SG111212A1 - Method and apparatus for joining protective tape to semiconductor wafer - Google Patents

Method and apparatus for joining protective tape to semiconductor wafer

Info

Publication number
SG111212A1
SG111212A1 SG200405669A SG200405669A SG111212A1 SG 111212 A1 SG111212 A1 SG 111212A1 SG 200405669 A SG200405669 A SG 200405669A SG 200405669 A SG200405669 A SG 200405669A SG 111212 A1 SG111212 A1 SG 111212A1
Authority
SG
Singapore
Prior art keywords
semiconductor wafer
protective tape
joining protective
joining
tape
Prior art date
Application number
SG200405669A
Other languages
English (en)
Inventor
Yamamoto Masayuki
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of SG111212A1 publication Critical patent/SG111212A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/3846—Cutting-out; Stamping-out cutting out discs or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2793/00—Shaping techniques involving a cutting or machining operation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1084—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing of continuous or running length bonded web
    • Y10T156/1085—One web only
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1317—Means feeding plural workpieces to be joined
    • Y10T156/1343—Cutting indefinite length web after assembly with discrete article
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1348—Work traversing type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1348—Work traversing type
    • Y10T156/1352—Work traversing type with liquid applying means
    • Y10T156/1361—Cutting after bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG200405669A 2003-10-07 2004-09-02 Method and apparatus for joining protective tape to semiconductor wafer SG111212A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003347750A JP4530638B2 (ja) 2003-10-07 2003-10-07 半導体ウエハへの保護テープ貼付方法及び貼付装置

Publications (1)

Publication Number Publication Date
SG111212A1 true SG111212A1 (en) 2005-05-30

Family

ID=34386413

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200405669A SG111212A1 (en) 2003-10-07 2004-09-02 Method and apparatus for joining protective tape to semiconductor wafer

Country Status (6)

Country Link
US (1) US7118645B2 (ko)
JP (1) JP4530638B2 (ko)
KR (1) KR101049024B1 (ko)
CN (1) CN1606135B (ko)
SG (1) SG111212A1 (ko)
TW (1) TWI342042B (ko)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006272505A (ja) * 2005-03-29 2006-10-12 Nitto Denko Corp 保護テープ切断方法およびこれを用いた装置
KR101282699B1 (ko) * 2005-08-11 2013-07-05 린텍 가부시키가이샤 시트 첩부 장치 및 첩부 방법
JP4795772B2 (ja) * 2005-10-24 2011-10-19 リンテック株式会社 シート切断用テーブル及びシート貼付装置
JP4606319B2 (ja) * 2005-12-19 2011-01-05 日東電工株式会社 復旧支援装置
JP4895766B2 (ja) * 2006-11-14 2012-03-14 日東電工株式会社 半導体ウエハの保護テープ切断方法および保護テープ切断装置
JP4642002B2 (ja) * 2006-11-14 2011-03-02 日東電工株式会社 半導体ウエハの保護テープ切断方法および保護テープ切断装置
KR100775933B1 (ko) * 2006-12-14 2007-11-13 우리마이크론(주) 확산판 보호테이프 자동 부착장치
KR101008647B1 (ko) * 2008-07-25 2011-01-17 엘지전자 주식회사 곡면스탬퍼의 제작방법
JP5216472B2 (ja) * 2008-08-12 2013-06-19 日東電工株式会社 半導体ウエハの保護テープ貼付け方法およびその装置
JP5075084B2 (ja) * 2008-10-16 2012-11-14 日東電工株式会社 保護テープ貼付け方法および保護テープ貼付け装置
JP5324319B2 (ja) * 2009-05-26 2013-10-23 日東電工株式会社 ウエハマウント方法とウエハマウント装置
JP5465944B2 (ja) * 2009-07-30 2014-04-09 日東電工株式会社 保護テープ貼付け方法
JP5412260B2 (ja) * 2009-12-10 2014-02-12 日東電工株式会社 粘着テープ貼付け方法およびこれを用いた装置
JP5054169B2 (ja) * 2010-08-06 2012-10-24 リンテック株式会社 シート切断用テーブル
US8834662B2 (en) * 2012-03-22 2014-09-16 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method of separating wafer from carrier
JP6500170B2 (ja) * 2015-03-24 2019-04-17 株式会社タカトリ 基板への接着テープ貼り付け装置及び貼り付け方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3754489A (en) * 1971-06-02 1973-08-28 Dove J B Inc Smokeless cut-off blade for plastic wrapping film
US4414872A (en) * 1981-04-29 1983-11-15 American Optical Corporation Lens tape cutter
US4603609A (en) * 1983-10-21 1986-08-05 Disco Abrasive Systems, Ltd. Apparatus for cutting a sheet-like member applied to a surface of a semiconductor wafer
JPS60231328A (ja) * 1984-04-27 1985-11-16 Disco Abrasive Sys Ltd 半導体ウエハに貼付されたシ−ト状部材を切断するための装置
JPS62174940A (ja) * 1986-01-28 1987-07-31 Nitto Electric Ind Co Ltd ウエハとリングの自動貼合せ装置
JPH10112492A (ja) * 1996-10-07 1998-04-28 Teikoku Seiki Kk ウェハ保護テープの裁断方法及びその装置
JP2003209082A (ja) 2002-01-15 2003-07-25 Nitto Denko Corp 保護テープの貼付方法およびその装置並びに保護テープの剥離方法

Also Published As

Publication number Publication date
TW200520084A (en) 2005-06-16
JP4530638B2 (ja) 2010-08-25
US20050072517A1 (en) 2005-04-07
KR101049024B1 (ko) 2011-07-12
KR20050033809A (ko) 2005-04-13
TWI342042B (en) 2011-05-11
JP2005116711A (ja) 2005-04-28
US7118645B2 (en) 2006-10-10
CN1606135B (zh) 2011-02-09
CN1606135A (zh) 2005-04-13

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