SG108933A1 - Lithographic projection apparatus and particle barrier for use in said apparatus - Google Patents
Lithographic projection apparatus and particle barrier for use in said apparatusInfo
- Publication number
- SG108933A1 SG108933A1 SG200304875A SG200304875A SG108933A1 SG 108933 A1 SG108933 A1 SG 108933A1 SG 200304875 A SG200304875 A SG 200304875A SG 200304875 A SG200304875 A SG 200304875A SG 108933 A1 SG108933 A1 SG 108933A1
- Authority
- SG
- Singapore
- Prior art keywords
- lithographic projection
- particle barrier
- projection apparatus
- barrier
- particle
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/7015—Details of optical elements
- G03F7/70166—Capillary or channel elements, e.g. nested extreme ultraviolet [EUV] mirrors or shells, optical fibers or light guides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02078515 | 2002-08-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG108933A1 true SG108933A1 (en) | 2005-02-28 |
Family
ID=32405731
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200304875A SG108933A1 (en) | 2002-08-23 | 2003-08-21 | Lithographic projection apparatus and particle barrier for use in said apparatus |
Country Status (8)
Country | Link |
---|---|
US (2) | US6838684B2 (ko) |
EP (1) | EP1391785B1 (ko) |
JP (1) | JP4115913B2 (ko) |
KR (1) | KR100748447B1 (ko) |
CN (1) | CN1495531B (ko) |
DE (1) | DE60333151D1 (ko) |
SG (1) | SG108933A1 (ko) |
TW (1) | TWI229242B (ko) |
Families Citing this family (80)
Publication number | Priority date | Publication date | Assignee | Title |
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NL1008352C2 (nl) | 1998-02-19 | 1999-08-20 | Stichting Tech Wetenschapp | Inrichting, geschikt voor extreem ultraviolet lithografie, omvattende een stralingsbron en een verwerkingsorgaan voor het verwerken van de van de stralingsbron afkomstige straling, alsmede een filter voor het onderdrukken van ongewenste atomaire en microscopische deeltjes welke door een stralingsbron zijn uitgezonden. |
US7439530B2 (en) * | 2005-06-29 | 2008-10-21 | Cymer, Inc. | LPP EUV light source drive laser system |
US20050080143A1 (en) * | 2001-11-29 | 2005-04-14 | Steiner Mitchell S. | Treatment of androgen-deprivation induced osteoporosis |
US6838684B2 (en) * | 2002-08-23 | 2005-01-04 | Asml Netherlands B.V. | Lithographic projection apparatus and particle barrier for use therein |
US6963071B2 (en) * | 2002-11-25 | 2005-11-08 | Intel Corporation | Debris mitigation device |
CN100476585C (zh) * | 2002-12-23 | 2009-04-08 | Asml荷兰有限公司 | 具有可扩展薄片的杂质屏蔽 |
SG118268A1 (en) * | 2003-06-27 | 2006-01-27 | Asml Netherlands Bv | Laser produced plasma radiation system with foil trap |
US7948185B2 (en) | 2004-07-09 | 2011-05-24 | Energetiq Technology Inc. | Inductively-driven plasma light source |
US7307375B2 (en) * | 2004-07-09 | 2007-12-11 | Energetiq Technology Inc. | Inductively-driven plasma light source |
US7183717B2 (en) * | 2004-07-09 | 2007-02-27 | Energetiq Technology Inc. | Inductively-driven light source for microscopy |
US7199384B2 (en) * | 2004-07-09 | 2007-04-03 | Energetiq Technology Inc. | Inductively-driven light source for lithography |
EP1774838B1 (en) * | 2004-07-09 | 2011-04-20 | Energetiq Technology Inc. | Inductively-driven plasma light source |
US7307263B2 (en) * | 2004-07-14 | 2007-12-11 | Asml Netherlands B.V. | Lithographic apparatus, radiation system, contaminant trap, device manufacturing method, and method for trapping contaminants in a contaminant trap |
US7302043B2 (en) * | 2004-07-27 | 2007-11-27 | Gatan, Inc. | Rotating shutter for laser-produced plasma debris mitigation |
US7339909B2 (en) * | 2004-07-30 | 2008-03-04 | Motorola Inc. | Apparatus and method for operating a communication device on two networks |
US7161653B2 (en) * | 2004-09-20 | 2007-01-09 | Asml Netherlands B.V. | Lithographic apparatus having a contaminant trapping system, a contamination trapping system, a device manufacturing method, and a method for improving trapping of contaminants in a lithographic apparatus |
US7145132B2 (en) * | 2004-12-27 | 2006-12-05 | Asml Netherlands B.V. | Lithographic apparatus, illumination system and debris trapping system |
SG123770A1 (en) * | 2004-12-28 | 2006-07-26 | Asml Netherlands Bv | Lithographic apparatus, radiation system and filt er system |
US7692169B2 (en) * | 2004-12-28 | 2010-04-06 | Asml Netherlands B.V. | Method for filtering particles out of a beam of radiation and filter for a lithographic apparatus |
SG123767A1 (en) | 2004-12-28 | 2006-07-26 | Asml Netherlands Bv | Lithographic apparatus, illumination system and filter system |
US7414251B2 (en) * | 2004-12-28 | 2008-08-19 | Asml Netherlands B.V. | Method for providing an operable filter system for filtering particles out of a beam of radiation, filter system, apparatus and lithographic apparatus comprising the filter system |
JP4366358B2 (ja) * | 2004-12-29 | 2009-11-18 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置、照明システム、フィルタ・システム、およびそのようなフィルタ・システムのサポートを冷却するための方法 |
US7250620B2 (en) * | 2005-01-20 | 2007-07-31 | Infineon Technologies Ag | EUV lithography filter |
US7868304B2 (en) * | 2005-02-07 | 2011-01-11 | Asml Netherlands B.V. | Method for removal of deposition on an optical element, lithographic apparatus, device manufacturing method, and device manufactured thereby |
US7482609B2 (en) * | 2005-02-28 | 2009-01-27 | Cymer, Inc. | LPP EUV light source drive laser system |
US7233010B2 (en) * | 2005-05-20 | 2007-06-19 | Asml Netherlands B.V. | Radiation system and lithographic apparatus |
KR101298214B1 (ko) * | 2005-06-14 | 2013-08-22 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 향상된 가스 분포를 갖는 잔해 저감 시스템 |
US7402825B2 (en) * | 2005-06-28 | 2008-07-22 | Cymer, Inc. | LPP EUV drive laser input system |
US7397056B2 (en) * | 2005-07-06 | 2008-07-08 | Asml Netherlands B.V. | Lithographic apparatus, contaminant trap, and device manufacturing method |
US7569791B2 (en) * | 2005-09-30 | 2009-08-04 | Energetiq Technology, Inc. | Inductively-driven plasma light source |
US7262423B2 (en) * | 2005-12-02 | 2007-08-28 | Asml Netherlands B.V. | Radiation system and lithographic apparatus |
US7332731B2 (en) * | 2005-12-06 | 2008-02-19 | Asml Netherlands, B.V. | Radiation system and lithographic apparatus |
US7468521B2 (en) * | 2005-12-28 | 2008-12-23 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7453071B2 (en) * | 2006-03-29 | 2008-11-18 | Asml Netherlands B.V. | Contamination barrier and lithographic apparatus comprising same |
US7368733B2 (en) * | 2006-03-30 | 2008-05-06 | Asml Netherlands B.V. | Contamination barrier and lithographic apparatus comprising same |
JP5076349B2 (ja) * | 2006-04-18 | 2012-11-21 | ウシオ電機株式会社 | 極端紫外光集光鏡および極端紫外光光源装置 |
US7442948B2 (en) * | 2006-05-15 | 2008-10-28 | Asml Netherlands B.V. | Contamination barrier and lithographic apparatus |
US7714306B2 (en) * | 2006-08-30 | 2010-05-11 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7889312B2 (en) * | 2006-09-22 | 2011-02-15 | Asml Netherlands B.V. | Apparatus comprising a rotating contaminant trap |
JP4888046B2 (ja) * | 2006-10-26 | 2012-02-29 | ウシオ電機株式会社 | 極端紫外光光源装置 |
US8071963B2 (en) * | 2006-12-27 | 2011-12-06 | Asml Netherlands B.V. | Debris mitigation system and lithographic apparatus |
US7825390B2 (en) * | 2007-02-14 | 2010-11-02 | Asml Netherlands B.V. | Apparatus with plasma radiation source and method of forming a beam of radiation and lithographic apparatus |
US8018576B2 (en) * | 2007-03-23 | 2011-09-13 | Asml Netherlands B.V. | Contamination prevention system, a lithographic apparatus, a radiation source and a method for manufacturing a device |
DE102008014832A1 (de) | 2007-04-19 | 2008-10-23 | Carl Zeiss Smt Ag | Projektionsbelichtungsanlage für die Mikrolithographie |
DE102007023444B4 (de) | 2007-05-16 | 2009-04-09 | Xtreme Technologies Gmbh | Einrichtung zur Erzeugung eines Gasvorhangs für plasmabasierte EUV-Strahlungsquellen |
US7687788B2 (en) * | 2007-07-16 | 2010-03-30 | Asml Netherlands B.V. | Debris prevention system, radiation system, and lithographic apparatus |
US8227771B2 (en) * | 2007-07-23 | 2012-07-24 | Asml Netherlands B.V. | Debris prevention system and lithographic apparatus |
US8084757B2 (en) * | 2008-01-17 | 2011-12-27 | Applied Materials, Inc. | Contamination prevention in extreme ultraviolet lithography |
US20090183322A1 (en) * | 2008-01-17 | 2009-07-23 | Banqiu Wu | Electrostatic surface cleaning |
NL1036768A1 (nl) * | 2008-04-29 | 2009-10-30 | Asml Netherlands Bv | Radiation source. |
NL2002890A1 (nl) * | 2008-06-16 | 2009-12-17 | Asml Netherlands Bv | Lithographic apparatus. |
DE102008029467A1 (de) | 2008-06-20 | 2009-12-24 | Osram Opto Semiconductors Gmbh | Halbleiterbauelement, Verwendung eines Halbleiterbauelements als Näherungssensor sowie Verfahren zum Detektieren von Objekten |
DE102008031650B4 (de) | 2008-07-04 | 2010-04-29 | Xtreme Technologies Gmbh | Anordnung zur Debrisunterdrückung in einer plasmabasierten Strahlungsquelle zur Erzeugung kurzwelliger Strahlung |
JP5559562B2 (ja) | 2009-02-12 | 2014-07-23 | ギガフォトン株式会社 | 極端紫外光光源装置 |
EP2545413A1 (en) * | 2010-03-12 | 2013-01-16 | ASML Netherlands B.V. | Radiation source, lithographic apparatus and device manufacturing method |
US9057962B2 (en) * | 2010-06-18 | 2015-06-16 | Media Lario S.R.L. | Source-collector module with GIC mirror and LPP EUV light source |
EP2681625A1 (en) * | 2011-03-04 | 2014-01-08 | ASML Netherlands BV | Lithograpic apparatus, spectral purity filter and device manufacturing method |
US9132436B2 (en) | 2012-09-21 | 2015-09-15 | Applied Materials, Inc. | Chemical control features in wafer process equipment |
US10256079B2 (en) | 2013-02-08 | 2019-04-09 | Applied Materials, Inc. | Semiconductor processing systems having multiple plasma configurations |
US9544984B2 (en) * | 2013-07-22 | 2017-01-10 | Kla-Tencor Corporation | System and method for generation of extreme ultraviolet light |
US10222701B2 (en) * | 2013-10-16 | 2019-03-05 | Asml Netherlands B.V. | Radiation source, lithographic apparatus device manufacturing method, sensor system and sensing method |
US9609731B2 (en) | 2014-07-07 | 2017-03-28 | Media Lario Srl | Systems and methods for synchronous operation of debris-mitigation devices |
US11637002B2 (en) | 2014-11-26 | 2023-04-25 | Applied Materials, Inc. | Methods and systems to enhance process uniformity |
US20160225652A1 (en) | 2015-02-03 | 2016-08-04 | Applied Materials, Inc. | Low temperature chuck for plasma processing systems |
US9741593B2 (en) | 2015-08-06 | 2017-08-22 | Applied Materials, Inc. | Thermal management systems and methods for wafer processing systems |
US10504700B2 (en) | 2015-08-27 | 2019-12-10 | Applied Materials, Inc. | Plasma etching systems and methods with secondary plasma injection |
US10504754B2 (en) | 2016-05-19 | 2019-12-10 | Applied Materials, Inc. | Systems and methods for improved semiconductor etching and component protection |
US10546729B2 (en) | 2016-10-04 | 2020-01-28 | Applied Materials, Inc. | Dual-channel showerhead with improved profile |
US11276559B2 (en) | 2017-05-17 | 2022-03-15 | Applied Materials, Inc. | Semiconductor processing chamber for multiple precursor flow |
US11276590B2 (en) | 2017-05-17 | 2022-03-15 | Applied Materials, Inc. | Multi-zone semiconductor substrate supports |
US10297458B2 (en) | 2017-08-07 | 2019-05-21 | Applied Materials, Inc. | Process window widening using coated parts in plasma etch processes |
US11328909B2 (en) | 2017-12-22 | 2022-05-10 | Applied Materials, Inc. | Chamber conditioning and removal processes |
US10964512B2 (en) | 2018-02-15 | 2021-03-30 | Applied Materials, Inc. | Semiconductor processing chamber multistage mixing apparatus and methods |
US10319600B1 (en) | 2018-03-12 | 2019-06-11 | Applied Materials, Inc. | Thermal silicon etch |
US11049755B2 (en) | 2018-09-14 | 2021-06-29 | Applied Materials, Inc. | Semiconductor substrate supports with embedded RF shield |
US11062887B2 (en) | 2018-09-17 | 2021-07-13 | Applied Materials, Inc. | High temperature RF heater pedestals |
US11417534B2 (en) | 2018-09-21 | 2022-08-16 | Applied Materials, Inc. | Selective material removal |
US11682560B2 (en) | 2018-10-11 | 2023-06-20 | Applied Materials, Inc. | Systems and methods for hafnium-containing film removal |
US11121002B2 (en) | 2018-10-24 | 2021-09-14 | Applied Materials, Inc. | Systems and methods for etching metals and metal derivatives |
US11437242B2 (en) | 2018-11-27 | 2022-09-06 | Applied Materials, Inc. | Selective removal of silicon-containing materials |
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US95623A (en) * | 1869-10-05 | Henry r | ||
US154279A (en) * | 1874-08-18 | Improvement in stamping apparatus | ||
US20890A (en) * | 1858-07-13 | Improvement in hemp-brakes | ||
US90054A (en) * | 1869-05-11 | Improved mosquito-bar frame | ||
US84428A (en) * | 1868-11-24 | Improvement in blowing-engines | ||
US4408338A (en) * | 1981-12-31 | 1983-10-04 | International Business Machines Corporation | Pulsed electromagnetic radiation source having a barrier for discharged debris |
WO1998040791A1 (en) * | 1997-03-10 | 1998-09-17 | Koninklijke Philips Electronics N.V. | Positioning device having two object holders |
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NL1008352C2 (nl) * | 1998-02-19 | 1999-08-20 | Stichting Tech Wetenschapp | Inrichting, geschikt voor extreem ultraviolet lithografie, omvattende een stralingsbron en een verwerkingsorgaan voor het verwerken van de van de stralingsbron afkomstige straling, alsmede een filter voor het onderdrukken van ongewenste atomaire en microscopische deeltjes welke door een stralingsbron zijn uitgezonden. |
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US6614505B2 (en) | 2001-01-10 | 2003-09-02 | Asml Netherlands B.V. | Lithographic projection apparatus, device manufacturing method, and device manufactured thereby |
US20020090054A1 (en) | 2001-01-10 | 2002-07-11 | Michael Sogard | Apparatus and method for containing debris from laser plasma radiation sources |
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DE10138284A1 (de) | 2001-08-10 | 2003-02-27 | Zeiss Carl | Beleuchtungssystem mit genesteten Kollektoren |
EP1438637A2 (en) * | 2001-10-12 | 2004-07-21 | Koninklijke Philips Electronics N.V. | Lithographic apparatus and device manufacturing method |
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US6838684B2 (en) * | 2002-08-23 | 2005-01-04 | Asml Netherlands B.V. | Lithographic projection apparatus and particle barrier for use therein |
CN100447671C (zh) * | 2002-08-27 | 2008-12-31 | Asml荷兰有限公司 | 光刻投射装置及用于所述装置中的反射器组件 |
SG129259A1 (en) * | 2002-10-03 | 2007-02-26 | Asml Netherlands Bv | Radiation source lithographic apparatus, and device manufacturing method |
DE10308174B4 (de) * | 2003-02-24 | 2010-01-14 | Xtreme Technologies Gmbh | Anordnung zur Debrisreduktion bei einer Strahlungsquelle auf Basis eines Plasmas |
JP2004343082A (ja) * | 2003-04-17 | 2004-12-02 | Asml Netherlands Bv | 凹面および凸面を含む集光器を備えたリトグラフ投影装置 |
-
2003
- 2003-08-21 US US10/644,954 patent/US6838684B2/en not_active Expired - Lifetime
- 2003-08-21 JP JP2003336475A patent/JP4115913B2/ja not_active Expired - Fee Related
- 2003-08-21 CN CN031470432A patent/CN1495531B/zh not_active Expired - Fee Related
- 2003-08-21 TW TW092123008A patent/TWI229242B/zh not_active IP Right Cessation
- 2003-08-21 SG SG200304875A patent/SG108933A1/en unknown
- 2003-08-21 KR KR1020030057857A patent/KR100748447B1/ko active IP Right Grant
- 2003-08-22 EP EP03077626A patent/EP1391785B1/en not_active Expired - Lifetime
- 2003-08-22 DE DE60333151T patent/DE60333151D1/de not_active Expired - Lifetime
-
2004
- 2004-12-01 US US11/000,381 patent/US7057190B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1391785A1 (en) | 2004-02-25 |
JP4115913B2 (ja) | 2008-07-09 |
TWI229242B (en) | 2005-03-11 |
KR100748447B1 (ko) | 2007-08-10 |
KR20040030262A (ko) | 2004-04-09 |
CN1495531B (zh) | 2010-05-26 |
US20040108465A1 (en) | 2004-06-10 |
US20050098741A1 (en) | 2005-05-12 |
CN1495531A (zh) | 2004-05-12 |
DE60333151D1 (de) | 2010-08-12 |
US6838684B2 (en) | 2005-01-04 |
EP1391785B1 (en) | 2010-06-30 |
TW200424783A (en) | 2004-11-16 |
US7057190B2 (en) | 2006-06-06 |
JP2004165639A (ja) | 2004-06-10 |
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