SG108262A1 - Method and apparatus for cutting a multi-layer substrate by dual laser irradiation - Google Patents

Method and apparatus for cutting a multi-layer substrate by dual laser irradiation

Info

Publication number
SG108262A1
SG108262A1 SG200104057A SG200104057A SG108262A1 SG 108262 A1 SG108262 A1 SG 108262A1 SG 200104057 A SG200104057 A SG 200104057A SG 200104057 A SG200104057 A SG 200104057A SG 108262 A1 SG108262 A1 SG 108262A1
Authority
SG
Singapore
Prior art keywords
cutting
laser irradiation
layer substrate
dual laser
dual
Prior art date
Application number
SG200104057A
Other languages
English (en)
Inventor
Hong Minghui
Ye Kaidong
An Chengwu
Ming Liu Da
Original Assignee
Inst Data Storage
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inst Data Storage filed Critical Inst Data Storage
Priority to SG200104057A priority Critical patent/SG108262A1/en
Priority to TW090121899A priority patent/TWI242792B/zh
Priority to JP2001348446A priority patent/JP3512400B2/ja
Priority to US10/047,119 priority patent/US20030006221A1/en
Publication of SG108262A1 publication Critical patent/SG108262A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
SG200104057A 2001-07-06 2001-07-06 Method and apparatus for cutting a multi-layer substrate by dual laser irradiation SG108262A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
SG200104057A SG108262A1 (en) 2001-07-06 2001-07-06 Method and apparatus for cutting a multi-layer substrate by dual laser irradiation
TW090121899A TWI242792B (en) 2001-07-06 2001-09-04 Method and apparatus for cutting a multi-layer substrate by dual laser irradiation
JP2001348446A JP3512400B2 (ja) 2001-07-06 2001-11-14 デュアル・レーザ照射で多層基板を切断するための方法および装置
US10/047,119 US20030006221A1 (en) 2001-07-06 2002-01-17 Method and apparatus for cutting a multi-layer substrate by dual laser irradiation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200104057A SG108262A1 (en) 2001-07-06 2001-07-06 Method and apparatus for cutting a multi-layer substrate by dual laser irradiation

Publications (1)

Publication Number Publication Date
SG108262A1 true SG108262A1 (en) 2005-01-28

Family

ID=20430800

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200104057A SG108262A1 (en) 2001-07-06 2001-07-06 Method and apparatus for cutting a multi-layer substrate by dual laser irradiation

Country Status (4)

Country Link
US (1) US20030006221A1 (ja)
JP (1) JP3512400B2 (ja)
SG (1) SG108262A1 (ja)
TW (1) TWI242792B (ja)

Families Citing this family (144)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6555449B1 (en) * 1996-05-28 2003-04-29 Trustees Of Columbia University In The City Of New York Methods for producing uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors using sequential lateral solidfication
US6407360B1 (en) * 1998-08-26 2002-06-18 Samsung Electronics, Co., Ltd. Laser cutting apparatus and method
US6830993B1 (en) * 2000-03-21 2004-12-14 The Trustees Of Columbia University In The City Of New York Surface planarization of thin silicon films during and after processing by the sequential lateral solidification method
US7115503B2 (en) 2000-10-10 2006-10-03 The Trustees Of Columbia University In The City Of New York Method and apparatus for processing thin metal layers
ATE282527T1 (de) * 2001-05-25 2004-12-15 Stork Prints Austria Gmbh Verfahren und vorrichtund zur herstellung einer druckform
ES2233522T3 (es) * 2001-05-25 2005-06-16 Stork Prints Austria Gmbh Procedimiento y dispositivo para la fabricacion de un molde.
JP2006512749A (ja) * 2002-08-19 2006-04-13 ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク 種々の照射パターンを有するシングルショット半導体処理システム及び方法
TWI360707B (en) * 2002-08-19 2012-03-21 Univ Columbia Process and system for laser crystallization proc
JP2004160483A (ja) * 2002-11-12 2004-06-10 Disco Abrasive Syst Ltd レーザー加工方法およびレーザー加工装置
WO2004075263A2 (en) * 2003-02-19 2004-09-02 The Trustees Of Columbia University In The City Of New York System and process for processing a plurality of semiconductor thin films which are crystallized using sequential lateral solidification techniques
GB2402230B (en) * 2003-05-30 2006-05-03 Xsil Technology Ltd Focusing an optical beam to two foci
JP4231349B2 (ja) * 2003-07-02 2009-02-25 株式会社ディスコ レーザー加工方法およびレーザー加工装置
TWI351713B (en) * 2003-09-16 2011-11-01 Univ Columbia Method and system for providing a single-scan, con
WO2005029548A2 (en) * 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York System and process for providing multiple beam sequential lateral solidification
US7164152B2 (en) * 2003-09-16 2007-01-16 The Trustees Of Columbia University In The City Of New York Laser-irradiated thin films having variable thickness
TWI359441B (en) 2003-09-16 2012-03-01 Univ Columbia Processes and systems for laser crystallization pr
US7364952B2 (en) * 2003-09-16 2008-04-29 The Trustees Of Columbia University In The City Of New York Systems and methods for processing thin films
TWI366859B (en) 2003-09-16 2012-06-21 Univ Columbia System and method of enhancing the width of polycrystalline grains produced via sequential lateral solidification using a modified mask pattern
WO2005029546A2 (en) * 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York Method and system for providing a continuous motion sequential lateral solidification for reducing or eliminating artifacts, and a mask for facilitating such artifact reduction/elimination
US7318866B2 (en) 2003-09-16 2008-01-15 The Trustees Of Columbia University In The City Of New York Systems and methods for inducing crystallization of thin films using multiple optical paths
US7311778B2 (en) * 2003-09-19 2007-12-25 The Trustees Of Columbia University In The City Of New York Single scan irradiation for crystallization of thin films
EP1518634A1 (en) * 2003-09-23 2005-03-30 Advanced Laser Separation International (ALSI) B.V. A method of and a device for separating semiconductor elements formed in a wafer of semiconductor material
JP4175636B2 (ja) * 2003-10-31 2008-11-05 株式会社日本製鋼所 ガラスの切断方法
DE10352402B4 (de) * 2003-11-10 2015-12-17 Lasertec Gmbh Laserbearbeitungsmaschine und Laserbearbeitungsverfahren
US7491288B2 (en) 2004-06-07 2009-02-17 Fujitsu Limited Method of cutting laminate with laser and laminate
JP4938998B2 (ja) 2004-06-07 2012-05-23 富士通株式会社 基板及び積層体の切断方法、並びに積層体の製造方法
US7645337B2 (en) * 2004-11-18 2010-01-12 The Trustees Of Columbia University In The City Of New York Systems and methods for creating crystallographic-orientation controlled poly-silicon films
JP2006269897A (ja) * 2005-03-25 2006-10-05 Disco Abrasive Syst Ltd ウエーハのレーザー加工方法
US8221544B2 (en) 2005-04-06 2012-07-17 The Trustees Of Columbia University In The City Of New York Line scan sequential lateral solidification of thin films
US20090218577A1 (en) * 2005-08-16 2009-09-03 Im James S High throughput crystallization of thin films
US7977601B2 (en) * 2005-11-28 2011-07-12 Electro Scientific Industries, Inc. X and Y orthogonal cut direction processing with set beam separation using 45 degree beam split orientation apparatus and method
TW200733240A (en) * 2005-12-05 2007-09-01 Univ Columbia Systems and methods for processing a film, and thin films
JP5025158B2 (ja) * 2006-04-27 2012-09-12 日立造船株式会社 レーザ加工方法及び装置
US20080070378A1 (en) * 2006-09-19 2008-03-20 Jong-Souk Yeo Dual laser separation of bonded wafers
KR20080028559A (ko) * 2006-09-27 2008-04-01 주식회사 이오테크닉스 폴리곤 미러를 이용한 대상물 다중 가공 방법
JP5036276B2 (ja) * 2006-11-02 2012-09-26 株式会社ディスコ レーザー加工装置
TWI308880B (en) * 2006-11-17 2009-04-21 Chunghwa Picture Tubes Ltd Laser cutting apparatus and laser cutting method
JP4851918B2 (ja) * 2006-11-24 2012-01-11 株式会社ディスコ ウエーハのレーザー加工方法およびレーザー加工装置
US8614471B2 (en) * 2007-09-21 2013-12-24 The Trustees Of Columbia University In The City Of New York Collections of laterally crystallized semiconductor islands for use in thin film transistors
KR20100074179A (ko) 2007-09-25 2010-07-01 더 트러스티이스 오브 콜롬비아 유니버시티 인 더 시티 오브 뉴욕 측방향으로 결정화된 박막상에 제조된 박막 트랜지스터 장치에 높은 균일성을 생산하기 위한 방법
US20100247836A1 (en) * 2007-11-07 2010-09-30 Claus Peter Kluge Method for the laser ablation of brittle components
JP2009123421A (ja) * 2007-11-13 2009-06-04 Canon Inc 気密容器の製造方法
CN103354204A (zh) * 2007-11-21 2013-10-16 纽约市哥伦比亚大学理事会 用于制备外延纹理厚膜的系统和方法
WO2009067688A1 (en) 2007-11-21 2009-05-28 The Trustees Of Columbia University In The City Of New York Systems and methods for preparing epitaxially textured polycrystalline films
US8012861B2 (en) 2007-11-21 2011-09-06 The Trustees Of Columbia University In The City Of New York Systems and methods for preparing epitaxially textured polycrystalline films
JP2009176983A (ja) * 2008-01-25 2009-08-06 Disco Abrasive Syst Ltd ウエーハの加工方法
JP5284651B2 (ja) * 2008-01-29 2013-09-11 株式会社ディスコ ウエーハの加工方法
WO2009108936A1 (en) * 2008-02-29 2009-09-03 The Trustees Of Columbia University In The City Of New York Lithographic method of making uniform crystalline si films
US8569155B2 (en) * 2008-02-29 2013-10-29 The Trustees Of Columbia University In The City Of New York Flash lamp annealing crystallization for large area thin films
WO2009111326A2 (en) * 2008-02-29 2009-09-11 The Trustees Of Columbia University In The City Of New York Flash light annealing for thin films
US8563892B2 (en) * 2008-09-24 2013-10-22 Standex International Corporation Method and apparatus for laser engraving
KR20110094022A (ko) 2008-11-14 2011-08-19 더 트러스티이스 오브 콜롬비아 유니버시티 인 더 시티 오브 뉴욕 박막 결정화를 위한 시스템 및 방법
US8729427B2 (en) * 2009-03-27 2014-05-20 Electro Scientific Industries, Inc. Minimizing thermal effect during material removal using a laser
US8609512B2 (en) * 2009-03-27 2013-12-17 Electro Scientific Industries, Inc. Method for laser singulation of chip scale packages on glass substrates
US8440581B2 (en) 2009-11-24 2013-05-14 The Trustees Of Columbia University In The City Of New York Systems and methods for non-periodic pulse sequential lateral solidification
US9087696B2 (en) 2009-11-03 2015-07-21 The Trustees Of Columbia University In The City Of New York Systems and methods for non-periodic pulse partial melt film processing
US9646831B2 (en) 2009-11-03 2017-05-09 The Trustees Of Columbia University In The City Of New York Advanced excimer laser annealing for thin films
US20110287607A1 (en) * 2010-04-02 2011-11-24 Electro Scientific Industries, Inc. Method and apparatus for improved wafer singulation
US8383984B2 (en) 2010-04-02 2013-02-26 Electro Scientific Industries, Inc. Method and apparatus for laser singulation of brittle materials
TW201134596A (en) * 2010-04-15 2011-10-16 Epileds Technologies Inc Laser processing method
US8365662B2 (en) * 2010-05-17 2013-02-05 Eastman Kodak Company Direct engraving of flexographic printing plates
US20110278767A1 (en) * 2010-05-17 2011-11-17 David Aviel Direct engraving of flexographic printing plates
SG187059A1 (en) 2010-07-12 2013-02-28 Filaser Inc Method of material processing by laser filamentation
EP2409808A1 (de) 2010-07-22 2012-01-25 Bystronic Laser AG Laserbearbeitungsmaschine
WO2013019204A1 (en) * 2011-08-01 2013-02-07 Ipg Photonics Corporation Method and apparatus for processing materials with composite structure
WO2014005041A1 (en) 2012-06-29 2014-01-03 Shiloh Industries, Inc. Welded blank assembly and method
TW201417928A (zh) * 2012-07-30 2014-05-16 Raydiance Inc 具訂製邊形及粗糙度之脆性材料切割
US8842358B2 (en) 2012-08-01 2014-09-23 Gentex Corporation Apparatus, method, and process with laser induced channel edge
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
KR20150086485A (ko) * 2012-11-30 2015-07-28 쉴로 인더스트리즈 인코포레이티드 금속 박편에 용접 노치를 형성하는 방법
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
US9701564B2 (en) 2013-01-15 2017-07-11 Corning Incorporated Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles
WO2014153096A1 (en) 2013-03-14 2014-09-25 Shiloh Industries, Inc. Welded blank assembly and method
US9481598B2 (en) 2013-03-15 2016-11-01 Kinestral Technologies, Inc. Laser cutting strengthened glass
JP5928379B2 (ja) * 2013-03-19 2016-06-01 株式会社デンソー 半導体装置の製造方法
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
KR102037259B1 (ko) * 2013-07-05 2019-10-29 삼성디스플레이 주식회사 기판 분리 장치 및 이를 이용한 기판 분리 방법
IL227458A0 (en) * 2013-07-11 2013-12-31 Technion Res & Dev Foundation A method and cave for transmitting light
US20150034613A1 (en) 2013-08-02 2015-02-05 Rofin-Sinar Technologies Inc. System for performing laser filamentation within transparent materials
US9102011B2 (en) 2013-08-02 2015-08-11 Rofin-Sinar Technologies Inc. Method and apparatus for non-ablative, photoacoustic compression machining in transparent materials using filamentation by burst ultrafast laser pulses
US10017410B2 (en) 2013-10-25 2018-07-10 Rofin-Sinar Technologies Llc Method of fabricating a glass magnetic hard drive disk platter using filamentation by burst ultrafast laser pulses
US10252507B2 (en) 2013-11-19 2019-04-09 Rofin-Sinar Technologies Llc Method and apparatus for forward deposition of material onto a substrate using burst ultrafast laser pulse energy
US9517929B2 (en) 2013-11-19 2016-12-13 Rofin-Sinar Technologies Inc. Method of fabricating electromechanical microchips with a burst ultrafast laser pulses
US10005152B2 (en) 2013-11-19 2018-06-26 Rofin-Sinar Technologies Llc Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses
US11053156B2 (en) 2013-11-19 2021-07-06 Rofin-Sinar Technologies Llc Method of closed form release for brittle materials using burst ultrafast laser pulses
US10144088B2 (en) 2013-12-03 2018-12-04 Rofin-Sinar Technologies Llc Method and apparatus for laser processing of silicon by filamentation of burst ultrafast laser pulses
EP2883647B1 (de) 2013-12-12 2019-05-29 Bystronic Laser AG Verfahren zur Konfiguration einer Laserbearbeitungsvorrichtung
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US9687936B2 (en) 2013-12-17 2017-06-27 Corning Incorporated Transparent material cutting with ultrafast laser and beam optics
CN103803485A (zh) * 2013-12-29 2014-05-21 北京工业大学 激光直写玻璃表面制备光学微结构的方法
US9938187B2 (en) 2014-02-28 2018-04-10 Rofin-Sinar Technologies Llc Method and apparatus for material processing using multiple filamentation of burst ultrafast laser pulses
JP6358835B2 (ja) * 2014-04-09 2018-07-18 株式会社ディスコ 研削装置
WO2015162445A1 (fr) * 2014-04-25 2015-10-29 Arcelormittal Investigación Y Desarrollo Sl Procede et dispositif de preparation de toles d'acier aluminiees destinees a etre soudees puis durcies sous presse; flan soude correspondant
TWI730945B (zh) 2014-07-08 2021-06-21 美商康寧公司 用於雷射處理材料的方法與設備
JP6788571B2 (ja) 2014-07-14 2020-11-25 コーニング インコーポレイテッド 界面ブロック、そのような界面ブロックを使用する、ある波長範囲内で透過する基板を切断するためのシステムおよび方法
US9617180B2 (en) 2014-07-14 2017-04-11 Corning Incorporated Methods and apparatuses for fabricating glass articles
EP3169635B1 (en) 2014-07-14 2022-11-23 Corning Incorporated Method and system for forming perforations
CN107073642B (zh) * 2014-07-14 2020-07-28 康宁股份有限公司 使用长度和直径可调的激光束焦线来加工透明材料的系统和方法
EP3169479B1 (en) 2014-07-14 2019-10-02 Corning Incorporated Method of and system for arresting incident crack propagation in a transparent material
US9757815B2 (en) 2014-07-21 2017-09-12 Rofin-Sinar Technologies Inc. Method and apparatus for performing laser curved filamentation within transparent materials
TWI574767B (zh) * 2014-07-29 2017-03-21 Improved laser structure
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
JP6377514B2 (ja) * 2014-12-17 2018-08-22 株式会社ディスコ パッケージ基板の加工方法
EP3245166B1 (en) 2015-01-12 2020-05-27 Corning Incorporated Laser cutting of thermally tempered substrates using the multi photon absorption method
US10391588B2 (en) 2015-01-13 2019-08-27 Rofin-Sinar Technologies Llc Method and system for scribing brittle material followed by chemical etching
US11773004B2 (en) 2015-03-24 2023-10-03 Corning Incorporated Laser cutting and processing of display glass compositions
WO2016160391A1 (en) 2015-03-27 2016-10-06 Corning Incorporated Gas permeable window and method of fabricating the same
DE102015212444A1 (de) * 2015-06-12 2016-12-15 Schuler Automation Gmbh & Co. Kg Verfahren und Vorrichtung zur Herstellung einer Blechplatine
EP3319911B1 (en) 2015-07-10 2023-04-19 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
JP6260601B2 (ja) * 2015-10-02 2018-01-17 日亜化学工業株式会社 半導体素子の製造方法
KR101729258B1 (ko) * 2015-10-28 2017-04-24 (주)하드램 필름 커팅용 멀티 스캔 레이저 장치 및 이를 이용한 필름 커팅 방법
JP6938543B2 (ja) 2016-05-06 2021-09-22 コーニング インコーポレイテッド 透明基板からの、輪郭設定された形状のレーザ切断及び取り外し
RU2634338C1 (ru) * 2016-05-23 2017-10-25 Лев Семенович Гликин Способ и устройство для лазерной резки материалов
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
CN109803934A (zh) 2016-07-29 2019-05-24 康宁股份有限公司 用于激光处理的装置和方法
JP2019532908A (ja) 2016-08-30 2019-11-14 コーニング インコーポレイテッド 強度マッピング光学システムによる材料のレーザー切断
KR102078294B1 (ko) 2016-09-30 2020-02-17 코닝 인코포레이티드 비-축대칭 빔 스폿을 이용하여 투명 워크피스를 레이저 가공하기 위한 기기 및 방법
JP7066701B2 (ja) 2016-10-24 2022-05-13 コーニング インコーポレイテッド シート状ガラス基体のレーザに基づく加工のための基体処理ステーション
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
JP6935484B2 (ja) * 2017-03-03 2021-09-15 古河電気工業株式会社 溶接方法および溶接装置
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
CN107876998B (zh) * 2017-11-23 2023-08-25 佛山科学技术学院 一种基于宽带激光频域三维切割装置和方法
JP6885310B2 (ja) 2017-11-28 2021-06-09 トヨタ自動車株式会社 電極シート製造装置および蓄電装置の製造方法
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
CN108465945A (zh) * 2018-03-28 2018-08-31 京东方科技集团股份有限公司 一种激光切割系统及切割方法
DE112019005450T5 (de) * 2018-10-30 2021-08-05 Hamamatsu Photonics K.K. Laserbearbeitungsverfahren
KR102174928B1 (ko) * 2019-02-01 2020-11-05 레이저쎌 주식회사 멀티 빔 레이저 디본딩 장치 및 방법
US11458572B2 (en) * 2019-05-16 2022-10-04 Caterpillar Inc. Laser smoothing
US11999014B2 (en) * 2019-11-22 2024-06-04 Medtronic, Inc. Laser cutting system
EP4163047A4 (en) * 2020-06-04 2024-03-13 Nikon Corporation PROCESSING DEVICE
KR20220011848A (ko) * 2020-07-21 2022-02-03 삼성디스플레이 주식회사 레이저 장치 및 표시 장치의 제조 방법
CN112692451A (zh) * 2020-12-30 2021-04-23 重庆凯歌电子股份有限公司 Pcb板的裁切系统
CN113260480A (zh) 2021-03-31 2021-08-13 长江存储科技有限责任公司 用于切割半导体结构的激光切割系统及方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995008414A1 (en) * 1993-09-23 1995-03-30 Laser Machining, Inc. Laser cutting apparatus
US5484981A (en) * 1994-08-24 1996-01-16 Honda Giken Kogyo Kabushiki Kaisha Method of cutting a hollow metallic material
US5578229A (en) * 1994-10-18 1996-11-26 Michigan State University Method and apparatus for cutting boards using opposing convergent laser beams

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62240186A (ja) * 1986-04-11 1987-10-20 Mitsubishi Electric Corp 加工材料の切断方法および切断装置
US5611946A (en) * 1994-02-18 1997-03-18 New Wave Research Multi-wavelength laser system, probe station and laser cutter system using the same
JPH0810970A (ja) * 1994-06-22 1996-01-16 Sony Corp レーザ加工装置及び方法
US6140708A (en) * 1996-05-17 2000-10-31 National Semiconductor Corporation Chip scale package and method for manufacture thereof
JP2000277550A (ja) * 1999-03-25 2000-10-06 Mitsubishi Electric Corp 半導体装置およびその製造方法
JP2001047399A (ja) * 1999-05-31 2001-02-20 Crystal Art:Kk プリント配線基板の外形加工工法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995008414A1 (en) * 1993-09-23 1995-03-30 Laser Machining, Inc. Laser cutting apparatus
US5484981A (en) * 1994-08-24 1996-01-16 Honda Giken Kogyo Kabushiki Kaisha Method of cutting a hollow metallic material
US5578229A (en) * 1994-10-18 1996-11-26 Michigan State University Method and apparatus for cutting boards using opposing convergent laser beams

Also Published As

Publication number Publication date
US20030006221A1 (en) 2003-01-09
JP3512400B2 (ja) 2004-03-29
JP2003037218A (ja) 2003-02-07
TWI242792B (en) 2005-11-01

Similar Documents

Publication Publication Date Title
SG108262A1 (en) Method and apparatus for cutting a multi-layer substrate by dual laser irradiation
GB2405369B (en) Apparatus for laser beam machining, machining mask, method for laser beam machining,and method for manufacturing a semiconductor device and seonductor device
AU2002359127A1 (en) Method and apparatus for patterning a workpiece
AU2003206156A1 (en) Multi-layer focusing method and apparatus therefor
TWI340676B (en) Laser beam manufacturing method, laser beam manufacturing apparatus and work produced
AU2003238155A1 (en) Method for pattern inspection
AU2002351284A1 (en) Method and apparatus for radiofrequencytissue ablation
EP1501958A4 (en) METHOD FOR PRODUCING COATED COMPONENTS
AU2002322654A1 (en) Method and apparatus for guaranteeing a win
AU2003234287A1 (en) Method and apparatus for treating a substrate with an ozone-solvent solution iii
AU2002335734A1 (en) Method and apparatus for monitoring and adjusting a laser welding process
SG108878A1 (en) Laser irradiation method and laser irradiation apparatus, and method for fabricating semiconductor device
SG117403A1 (en) Method and apparatus for assembling substrate
AU2003247272A1 (en) An apparatus and a method for guiding a tool along a path on a surface
AU2002354474A1 (en) Method for supplying solder
GB2389379B (en) Method and apparatus for perforating a well
EP1404476A4 (en) METHOD AND APPARATUS FOR ERROR REMOVAL FOR CUTTING TOOLS
EP1599403A4 (en) LASER CUTTING APPARATUS
AU2003229661A1 (en) Device for treating substrates by laser radiation
AU2003277738A1 (en) Apparatus for cutting lumber
EP1368172A4 (en) METHOD AND DEVICE FOR CUTTING WORKPIECES
AU2002211091A1 (en) Method for cutting a composite structure comprising one or more electronic compnents using a laser
SG115583A1 (en) Method and apparatus for machining substrate
AU2002253668A1 (en) Ablation method using laser beam, and device for ablation
AU2003289655A1 (en) Laser beam leading apparatus for puncture