SG10201909509UA - Substrate cleaning member and substrate cleaning apparatus - Google Patents
Substrate cleaning member and substrate cleaning apparatusInfo
- Publication number
- SG10201909509UA SG10201909509UA SG10201909509UA SG10201909509UA SG10201909509UA SG 10201909509U A SG10201909509U A SG 10201909509UA SG 10201909509U A SG10201909509U A SG 10201909509UA SG 10201909509U A SG10201909509U A SG 10201909509UA SG 10201909509U A SG10201909509U A SG 10201909509UA
- Authority
- SG
- Singapore
- Prior art keywords
- substrate cleaning
- cleaning apparatus
- cleaning member
- substrate
- cleaning
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title 2
- 239000000758 substrate Substances 0.000 title 2
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
- B08B1/143—Wipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02096—Cleaning only mechanical cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018193312A JP7166132B2 (ja) | 2018-10-12 | 2018-10-12 | 基板洗浄部材および基板洗浄装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201909509UA true SG10201909509UA (en) | 2020-05-28 |
Family
ID=68280895
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201909509UA SG10201909509UA (en) | 2018-10-12 | 2019-10-11 | Substrate cleaning member and substrate cleaning apparatus |
Country Status (6)
Country | Link |
---|---|
US (1) | US11501983B2 (pt) |
EP (1) | EP3636356A1 (pt) |
JP (1) | JP7166132B2 (pt) |
CN (1) | CN111048442A (pt) |
SG (1) | SG10201909509UA (pt) |
TW (1) | TWI820206B (pt) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6892176B1 (ja) * | 2020-11-19 | 2021-06-23 | 不二越機械工業株式会社 | ワーク洗浄装置 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB772599A (en) | 1954-01-23 | 1957-04-17 | Service Eng Ltd | Improvements relating to brushing machines |
KR100230694B1 (ko) | 1992-05-18 | 1999-11-15 | 다카시마 히로시 | 기판세정처리장치 |
US5937469A (en) | 1996-12-03 | 1999-08-17 | Intel Corporation | Apparatus for mechanically cleaning the edges of wafers |
JPH11283952A (ja) * | 1998-03-30 | 1999-10-15 | Shibaura Mechatronics Corp | ブラシ洗浄装置 |
US6299698B1 (en) * | 1998-07-10 | 2001-10-09 | Applied Materials, Inc. | Wafer edge scrubber and method |
US6467120B1 (en) * | 1999-09-08 | 2002-10-22 | International Business Machines Corporation | Wafer cleaning brush profile modification |
US20040040576A1 (en) | 2002-08-29 | 2004-03-04 | Yuxia Sun | Wafer cleaning brush |
KR100562502B1 (ko) | 2003-07-02 | 2006-03-21 | 삼성전자주식회사 | 반도체 기판의 가장자리부 처리 장치 및 방법 |
JP3933670B2 (ja) | 2005-03-29 | 2007-06-20 | 東京エレクトロン株式会社 | 基板洗浄方法及び基板洗浄装置 |
JP4768556B2 (ja) | 2006-09-15 | 2011-09-07 | Nec液晶テクノロジー株式会社 | 基板洗浄装置及び基板洗浄方法 |
JP2007272236A (ja) | 2007-04-11 | 2007-10-18 | Advanced Display Inc | 基板端面洗浄装置、基板端面洗浄方法及び半導体装置の製造方法 |
JP2008282865A (ja) | 2007-05-08 | 2008-11-20 | Fuji Electric Device Technology Co Ltd | スクラブ洗浄装置及びそれに用いられるロールスポンジアセンブリ |
KR101020676B1 (ko) * | 2008-11-26 | 2011-03-09 | 세메스 주식회사 | 기판 세정 장치 |
WO2010125663A1 (ja) * | 2009-04-30 | 2010-11-04 | アイオン株式会社 | 洗浄用スポンジローラ |
JP5535687B2 (ja) | 2010-03-01 | 2014-07-02 | 株式会社荏原製作所 | 基板洗浄方法及び基板洗浄装置 |
JP5645752B2 (ja) * | 2011-05-25 | 2014-12-24 | 株式会社荏原製作所 | 基板洗浄方法及びロール洗浄部材 |
US9704729B2 (en) * | 2013-06-13 | 2017-07-11 | K.C. Tech Co., Ltd. | Substrate cleaning apparatus and method and brush assembly used therein |
JP7224128B2 (ja) | 2018-08-09 | 2023-02-17 | 株式会社荏原製作所 | 基板用洗浄具、基板洗浄装置、基板処理装置、基板処理方法および基板用洗浄具の製造方法 |
-
2018
- 2018-10-12 JP JP2018193312A patent/JP7166132B2/ja active Active
-
2019
- 2019-09-10 TW TW108132505A patent/TWI820206B/zh active
- 2019-10-10 US US16/598,728 patent/US11501983B2/en active Active
- 2019-10-11 CN CN201910964641.1A patent/CN111048442A/zh active Pending
- 2019-10-11 EP EP19202831.4A patent/EP3636356A1/en active Pending
- 2019-10-11 SG SG10201909509UA patent/SG10201909509UA/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW202017030A (zh) | 2020-05-01 |
US20200118843A1 (en) | 2020-04-16 |
US11501983B2 (en) | 2022-11-15 |
CN111048442A (zh) | 2020-04-21 |
JP7166132B2 (ja) | 2022-11-07 |
EP3636356A1 (en) | 2020-04-15 |
JP2020061514A (ja) | 2020-04-16 |
TWI820206B (zh) | 2023-11-01 |
KR20200041791A (ko) | 2020-04-22 |
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