SG10201810852TA - Substrate processing apparatus and processing method - Google Patents
Substrate processing apparatus and processing methodInfo
- Publication number
- SG10201810852TA SG10201810852TA SG10201810852TA SG10201810852TA SG10201810852TA SG 10201810852T A SG10201810852T A SG 10201810852TA SG 10201810852T A SG10201810852T A SG 10201810852TA SG 10201810852T A SG10201810852T A SG 10201810852TA SG 10201810852T A SG10201810852T A SG 10201810852TA
- Authority
- SG
- Singapore
- Prior art keywords
- substrate
- polishing
- transfer
- unit
- cleaning
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 9
- 238000003672 processing method Methods 0.000 title abstract 2
- 238000005498 polishing Methods 0.000 abstract 9
- 238000004140 cleaning Methods 0.000 abstract 5
- 238000000034 method Methods 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
- H01L21/02065—Cleaning during device manufacture during, before or after processing of insulating layers the processing being a planarization of insulating layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014204739A JP6426965B2 (ja) | 2014-10-03 | 2014-10-03 | 処理コンポーネント、処理モジュール、及び、処理方法 |
JP2014207872A JP6445298B2 (ja) | 2014-10-09 | 2014-10-09 | 研磨装置、及び、処理方法 |
JP2014258716A JP2016119406A (ja) | 2014-12-22 | 2014-12-22 | 基板処理装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201810852TA true SG10201810852TA (en) | 2019-01-30 |
Family
ID=55633296
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201810852TA SG10201810852TA (en) | 2014-10-03 | 2015-09-30 | Substrate processing apparatus and processing method |
SG10201508119XA SG10201508119XA (en) | 2014-10-03 | 2015-09-30 | Substrate processing apparatus and processing method |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201508119XA SG10201508119XA (en) | 2014-10-03 | 2015-09-30 | Substrate processing apparatus and processing method |
Country Status (5)
Country | Link |
---|---|
US (3) | US20160099156A1 (ko) |
KR (2) | KR102202331B1 (ko) |
CN (2) | CN112091809B (ko) |
SG (2) | SG10201810852TA (ko) |
TW (2) | TWI787555B (ko) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10160090B2 (en) * | 2015-11-12 | 2018-12-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical polishing method |
JP6606017B2 (ja) * | 2016-06-07 | 2019-11-13 | 株式会社荏原製作所 | 基板処理装置 |
US10741381B2 (en) * | 2016-12-15 | 2020-08-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | CMP cleaning system and method |
KR102570853B1 (ko) * | 2017-08-10 | 2023-08-25 | 도쿄엘렉트론가부시키가이샤 | 기판 이면 연마 부재의 드레싱 장치 및 드레싱 방법 |
US11103970B2 (en) * | 2017-08-15 | 2021-08-31 | Taiwan Semiconductor Manufacturing Co, , Ltd. | Chemical-mechanical planarization system |
SG11201908968QA (en) * | 2017-10-17 | 2019-10-30 | Sumco Corp | Method of polishing silicon wafer |
JP6887371B2 (ja) * | 2017-12-20 | 2021-06-16 | 株式会社荏原製作所 | 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体 |
US11414748B2 (en) * | 2019-09-25 | 2022-08-16 | Intevac, Inc. | System with dual-motion substrate carriers |
JP7160725B2 (ja) * | 2019-03-06 | 2022-10-25 | 株式会社荏原製作所 | 基板処理装置 |
US11791173B2 (en) | 2019-03-21 | 2023-10-17 | Samsung Electronics Co., Ltd. | Substrate cleaning equipment, substrate treatment system including the same, and method of fabricating semiconductor device using the substrate cleaning equipment |
CN110653671B (zh) * | 2019-09-24 | 2021-06-25 | 广州大学 | 一种涂刷式金属工件表面强化研磨加工设备及方法 |
JP7220648B2 (ja) * | 2019-12-20 | 2023-02-10 | 株式会社荏原製作所 | 基板処理装置および基板処理方法 |
JP7402698B2 (ja) * | 2020-01-21 | 2023-12-21 | 東京エレクトロン株式会社 | 基板洗浄装置及び基板洗浄方法 |
JP7387471B2 (ja) * | 2020-02-05 | 2023-11-28 | 株式会社荏原製作所 | 基板処理装置および基板処理方法 |
CN111451932B (zh) * | 2020-03-23 | 2021-09-07 | 中国科学院上海光学精密机械研究所 | 大口径异形平面元件光学加工夹具及加工方法 |
CN111673607B (zh) * | 2020-04-28 | 2021-11-26 | 北京烁科精微电子装备有限公司 | 一种化学机械平坦化设备 |
CN111906684A (zh) * | 2020-08-10 | 2020-11-10 | 泉芯集成电路制造(济南)有限公司 | 一种研磨方法 |
CN112428138B (zh) * | 2020-11-20 | 2022-07-29 | 西安奕斯伟材料科技有限公司 | 单面抛光装置及方法 |
CN112548845B (zh) * | 2021-02-19 | 2021-09-14 | 清华大学 | 一种基板加工方法 |
JP2022147778A (ja) * | 2021-03-23 | 2022-10-06 | 株式会社Screenホールディングス | 基板処理装置、基板処理システムおよび基板処理方法 |
US20230286107A1 (en) * | 2022-03-09 | 2023-09-14 | Applied Materials, Inc. | Eddy current monitoring to detect vibration in polishing |
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JP4894674B2 (ja) * | 2007-08-08 | 2012-03-14 | 東京エレクトロン株式会社 | 塗布、現像装置及び塗布、現像方法並びに記憶媒体 |
JP5444596B2 (ja) * | 2007-08-31 | 2014-03-19 | 富士通セミコンダクター株式会社 | 半導体装置の製造方法 |
JP5744382B2 (ja) | 2008-07-24 | 2015-07-08 | 株式会社荏原製作所 | 基板処理装置および基板処理方法 |
WO2010019264A2 (en) * | 2008-08-14 | 2010-02-18 | Applied Materials, Inc. | Chemical mechanical polisher having movable slurry dispensers and method |
WO2010045151A2 (en) * | 2008-10-16 | 2010-04-22 | Applied Materials, Inc. | Textured platen |
KR101004435B1 (ko) * | 2008-11-28 | 2010-12-28 | 세메스 주식회사 | 기판 연마 장치 및 이를 이용한 기판 연마 방법 |
CN101992421B (zh) * | 2009-08-14 | 2012-10-03 | 中芯国际集成电路制造(上海)有限公司 | 铜互连工艺中的化学机械抛光方法 |
JP5511600B2 (ja) * | 2010-09-09 | 2014-06-04 | 株式会社荏原製作所 | 研磨装置 |
JP5722065B2 (ja) * | 2011-02-10 | 2015-05-20 | 株式会社ディスコ | 研磨装置 |
TWI663018B (zh) * | 2012-09-24 | 2019-06-21 | 日商荏原製作所股份有限公司 | 研磨方法及研磨裝置 |
JP2014167996A (ja) * | 2013-02-28 | 2014-09-11 | Ebara Corp | 研磨装置および研磨方法 |
CN203305047U (zh) * | 2013-04-27 | 2013-11-27 | 株式会社荏原制作所 | 研磨装置 |
CN203282328U (zh) * | 2013-04-28 | 2013-11-13 | 株式会社荏原制作所 | 抛光装置以及基板处理装置 |
-
2015
- 2015-09-30 SG SG10201810852TA patent/SG10201810852TA/en unknown
- 2015-09-30 SG SG10201508119XA patent/SG10201508119XA/en unknown
- 2015-09-30 CN CN202010986718.8A patent/CN112091809B/zh active Active
- 2015-09-30 KR KR1020150137387A patent/KR102202331B1/ko active IP Right Grant
- 2015-09-30 CN CN201510640665.3A patent/CN105479324B/zh active Active
- 2015-10-01 TW TW108140123A patent/TWI787555B/zh active
- 2015-10-01 US US14/872,342 patent/US20160099156A1/en not_active Abandoned
- 2015-10-01 TW TW104132378A patent/TWI678750B/zh active
-
2020
- 2020-09-29 US US17/036,555 patent/US20210013071A1/en not_active Abandoned
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2021
- 2021-01-06 KR KR1020210001228A patent/KR102263992B1/ko active IP Right Grant
-
2023
- 2023-07-10 US US18/349,666 patent/US20230352326A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
SG10201508119XA (en) | 2016-05-30 |
TWI787555B (zh) | 2022-12-21 |
KR102202331B1 (ko) | 2021-01-13 |
US20160099156A1 (en) | 2016-04-07 |
US20230352326A1 (en) | 2023-11-02 |
KR20160040428A (ko) | 2016-04-14 |
CN105479324A (zh) | 2016-04-13 |
TWI678750B (zh) | 2019-12-01 |
CN112091809B (zh) | 2022-11-29 |
KR20210007008A (ko) | 2021-01-19 |
TW201622040A (zh) | 2016-06-16 |
CN105479324B (zh) | 2020-11-06 |
KR102263992B1 (ko) | 2021-06-11 |
CN112091809A (zh) | 2020-12-18 |
TW202006858A (zh) | 2020-02-01 |
US20210013071A1 (en) | 2021-01-14 |
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