SG10201806221TA - Substrate polishing apparatus and method - Google Patents
Substrate polishing apparatus and methodInfo
- Publication number
- SG10201806221TA SG10201806221TA SG10201806221TA SG10201806221TA SG10201806221TA SG 10201806221T A SG10201806221T A SG 10201806221TA SG 10201806221T A SG10201806221T A SG 10201806221TA SG 10201806221T A SG10201806221T A SG 10201806221TA SG 10201806221T A SG10201806221T A SG 10201806221TA
- Authority
- SG
- Singapore
- Prior art keywords
- thickness
- substrate
- polishing apparatus
- estimating
- substrate polishing
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 6
- 239000000758 substrate Substances 0.000 title abstract 6
- 238000000034 method Methods 0.000 title abstract 2
- 238000001228 spectrum Methods 0.000 abstract 3
- 238000002310 reflectometry Methods 0.000 abstract 2
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
- B24B49/05—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation including the measurement of a first workpiece already machined and of another workpiece being machined and to be matched with the first one
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017142545A JP7023062B2 (ja) | 2017-07-24 | 2017-07-24 | 基板研磨装置及び方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201806221TA true SG10201806221TA (en) | 2019-02-27 |
Family
ID=65023156
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201806221TA SG10201806221TA (en) | 2017-07-24 | 2018-07-20 | Substrate polishing apparatus and method |
Country Status (6)
Country | Link |
---|---|
US (1) | US11195729B2 (ko) |
JP (1) | JP7023062B2 (ko) |
KR (1) | KR102556648B1 (ko) |
CN (1) | CN109290942B (ko) |
SG (1) | SG10201806221TA (ko) |
TW (1) | TWI793138B (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7403998B2 (ja) * | 2019-08-29 | 2023-12-25 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
CN116852252A (zh) * | 2023-07-06 | 2023-10-10 | 华海清科股份有限公司 | 一种晶圆膜厚测量方法和化学机械抛光设备 |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010012108A1 (en) * | 1996-07-26 | 2001-08-09 | Paul Holzapfel | Methods and apparatus for the in-process measurement of thin film layers |
US6290572B1 (en) * | 2000-03-23 | 2001-09-18 | Micron Technology, Inc. | Devices and methods for in-situ control of mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
US6747283B1 (en) * | 2001-03-19 | 2004-06-08 | Lam Research Corporation | In-situ detection of thin-metal interface using high resolution spectral analysis of optical interference |
JP3932836B2 (ja) * | 2001-07-27 | 2007-06-20 | 株式会社日立製作所 | 薄膜の膜厚計測方法及びその装置並びにそれを用いたデバイスの製造方法 |
KR100939556B1 (ko) | 2001-12-06 | 2010-01-29 | 가부시키가이샤 에바라 세이사꾸쇼 | 탄성막 및 플렉시블 막 |
JP4107835B2 (ja) * | 2001-12-06 | 2008-06-25 | 株式会社荏原製作所 | 基板保持装置及びポリッシング装置 |
JP4542324B2 (ja) * | 2002-10-17 | 2010-09-15 | 株式会社荏原製作所 | 研磨状態監視装置及びポリッシング装置 |
CN100488729C (zh) * | 2002-10-17 | 2009-05-20 | 株式会社荏原制作所 | 抛光状态监测装置和抛光装置以及方法 |
US6991514B1 (en) | 2003-02-21 | 2006-01-31 | Verity Instruments, Inc. | Optical closed-loop control system for a CMP apparatus and method of manufacture thereof |
JP2004265957A (ja) * | 2003-02-26 | 2004-09-24 | Nikon Corp | 最適位置検出式の検出方法、位置合わせ方法、露光方法、デバイス製造方法及びデバイス |
JP4581427B2 (ja) * | 2004-02-27 | 2010-11-17 | 富士電機システムズ株式会社 | 膜厚評価方法、研磨終点検出方法 |
US8260446B2 (en) | 2005-08-22 | 2012-09-04 | Applied Materials, Inc. | Spectrographic monitoring of a substrate during processing using index values |
CN102490112B (zh) | 2006-10-06 | 2015-03-25 | 株式会社荏原制作所 | 加工终点检测方法、研磨方法及研磨装置 |
JP2009129970A (ja) * | 2007-11-20 | 2009-06-11 | Ebara Corp | 研磨装置及び研磨方法 |
EP2568316A1 (en) * | 2008-04-15 | 2013-03-13 | Qualcomm Incorporated | Method and apparatus for position determination with hybrid SPS orbit data |
US8129279B2 (en) * | 2008-10-13 | 2012-03-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical polish process control for improvement in within-wafer thickness uniformity |
US9002492B2 (en) * | 2010-02-16 | 2015-04-07 | Applied Materials, Inc. | Methods and apparatuses for utilizing adaptive predictive algorithms and determining when to use the adaptive predictive algorithms for virtual metrology |
JP5481264B2 (ja) * | 2010-04-16 | 2014-04-23 | 株式会社ディスコ | 研削装置 |
JP5612945B2 (ja) * | 2010-07-23 | 2014-10-22 | 株式会社荏原製作所 | 基板の研磨の進捗を監視する方法および研磨装置 |
KR101892914B1 (ko) | 2012-03-08 | 2018-08-29 | 어플라이드 머티어리얼스, 인코포레이티드 | 측정된 스펙트럼에 대한 광학 모델의 피팅 |
FR2994734B1 (fr) * | 2012-08-21 | 2017-08-25 | Fogale Nanotech | Dispositif et procede pour faire des mesures dimensionnelles sur des objets multi-couches tels que des wafers. |
JP5890768B2 (ja) * | 2012-11-19 | 2016-03-22 | 株式会社東京精密 | 半導体ウエハ加工装置 |
US10012494B2 (en) * | 2013-10-25 | 2018-07-03 | Applied Materials, Inc. | Grouping spectral data from polishing substrates |
US9490186B2 (en) * | 2013-11-27 | 2016-11-08 | Applied Materials, Inc. | Limiting adjustment of polishing rates during substrate polishing |
JP6595987B2 (ja) * | 2014-04-22 | 2019-10-23 | 株式会社荏原製作所 | 研磨方法 |
KR102534756B1 (ko) * | 2014-07-16 | 2023-05-18 | 어플라이드 머티어리얼스, 인코포레이티드 | 증착 이전에 측정이 이루어지는 폴리싱 |
JP6404172B2 (ja) * | 2015-04-08 | 2018-10-10 | 株式会社荏原製作所 | 膜厚測定方法、膜厚測定装置、研磨方法、および研磨装置 |
JP6473050B2 (ja) * | 2015-06-05 | 2019-02-20 | 株式会社荏原製作所 | 研磨装置 |
JP6475604B2 (ja) * | 2015-11-24 | 2019-02-27 | 株式会社荏原製作所 | 研磨方法 |
-
2017
- 2017-07-24 JP JP2017142545A patent/JP7023062B2/ja active Active
-
2018
- 2018-06-28 TW TW107122196A patent/TWI793138B/zh active
- 2018-07-18 KR KR1020180083508A patent/KR102556648B1/ko active IP Right Grant
- 2018-07-20 SG SG10201806221TA patent/SG10201806221TA/en unknown
- 2018-07-23 CN CN201810814032.3A patent/CN109290942B/zh active Active
- 2018-07-24 US US16/044,137 patent/US11195729B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20190027382A1 (en) | 2019-01-24 |
CN109290942A (zh) | 2019-02-01 |
US11195729B2 (en) | 2021-12-07 |
TW201908057A (zh) | 2019-03-01 |
JP2019024034A (ja) | 2019-02-14 |
JP7023062B2 (ja) | 2022-02-21 |
KR20190011203A (ko) | 2019-02-01 |
KR102556648B1 (ko) | 2023-07-18 |
CN109290942B (zh) | 2022-03-15 |
TWI793138B (zh) | 2023-02-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG10201806221TA (en) | Substrate polishing apparatus and method | |
WO2008055174A3 (en) | Peak-based endpointing for chemical mechanical polishing | |
JP2016538728A5 (ko) | ||
MX2016003928A (es) | Articulo abrasivo flexible y metodo de uso de este. | |
TWD183232S (zh) | 眼鏡 | |
JP2014150178A5 (ko) | ||
MY181072A (en) | Holding table | |
SG10201806665PA (en) | Substrate polishing apparatus and method | |
SG10201801373RA (en) | Substrate polisher and polishing method | |
TW201611946A (en) | Modifying substrate thickness profiles | |
MX2009010119A (es) | Metodos para remover defectos en superficies. | |
WO2012012530A3 (en) | Tracking spectrum features in two dimensions for endpoint detection | |
TWD179672S (zh) | 基板保持環之部分 | |
MY198102A (en) | Height detecting apparatus and laser processing apparatus | |
PH12016501335B1 (en) | Composite sheet for protective-film formation | |
WO2016055855A3 (en) | Hot cleaning system for surfaces | |
WO2008120578A1 (ja) | 金属膜研磨用パッドおよびそれを用いる金属膜の研磨方法 | |
RU2016103250A (ru) | СЛОИ TiB2 И ИХ ИЗГОТОВЛЕНИЕ | |
MX2016003384A (es) | Articulos de fregar tratados con radiacion ultravioleta (uv) y metodos para su fabricacion. | |
MX2021001582A (es) | Dispositivo sostenido con la mano para realizar una operacion de tratamiento. | |
USD849069S1 (en) | Abrasive material for barrel polishing | |
CL2016002052A1 (es) | Recubrimiento de fácil limpieza | |
MX2018006054A (es) | Espejo para aplicar cosmeticos para los ojos. | |
JP1744003S (ja) | 研磨パッド | |
JP1744143S (ja) | 研磨パッド |