SG10201805222PA - Monitoring system for deposition and method of operation thereof - Google Patents

Monitoring system for deposition and method of operation thereof

Info

Publication number
SG10201805222PA
SG10201805222PA SG10201805222PA SG10201805222PA SG10201805222PA SG 10201805222P A SG10201805222P A SG 10201805222PA SG 10201805222P A SG10201805222P A SG 10201805222PA SG 10201805222P A SG10201805222P A SG 10201805222PA SG 10201805222P A SG10201805222P A SG 10201805222PA
Authority
SG
Singapore
Prior art keywords
deposition
monitoring system
substrate
material layer
monitoring
Prior art date
Application number
SG10201805222PA
Other languages
English (en)
Inventor
Majeed A Foad
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG10201805222PA publication Critical patent/SG10201805222PA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0683—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating measurement during deposition or removal of the layer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
    • G01B15/02—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring thickness
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Physical Vapour Deposition (AREA)
SG10201805222PA 2013-12-22 2014-12-19 Monitoring system for deposition and method of operation thereof SG10201805222PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201361919776P 2013-12-22 2013-12-22

Publications (1)

Publication Number Publication Date
SG10201805222PA true SG10201805222PA (en) 2018-08-30

Family

ID=53403780

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201805222PA SG10201805222PA (en) 2013-12-22 2014-12-19 Monitoring system for deposition and method of operation thereof
SG11201604721VA SG11201604721VA (en) 2013-12-22 2014-12-19 Monitoring system for deposition and method of operation thereof

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG11201604721VA SG11201604721VA (en) 2013-12-22 2014-12-19 Monitoring system for deposition and method of operation thereof

Country Status (7)

Country Link
US (1) US20160341544A1 (zh)
JP (2) JP6653255B2 (zh)
KR (1) KR102291659B1 (zh)
CN (1) CN105917453B (zh)
SG (2) SG10201805222PA (zh)
TW (1) TWI647530B (zh)
WO (1) WO2015095799A1 (zh)

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US10818564B2 (en) * 2016-03-11 2020-10-27 Applied Materials, Inc. Wafer processing tool having a micro sensor
JP6606448B2 (ja) * 2016-03-17 2019-11-13 株式会社Ｓｃｒｅｅｎホールディングス 塗膜検査装置、塗膜検査方法および膜・触媒層接合体の製造装置
JP6869648B2 (ja) * 2016-06-07 2021-05-12 日東電工株式会社 多層膜の成膜方法
TWI737804B (zh) * 2017-09-04 2021-09-01 李亞玲 Cvd沉膜偏移製程異常之量測與監控方法
JP7009230B2 (ja) * 2018-01-23 2022-01-25 株式会社日立ビルシステム 非破壊検査装置及び非破壊検査方法
US10815561B2 (en) * 2018-03-10 2020-10-27 Applied Materials, Inc. Method and apparatus for asymmetric selective physical vapor deposition
KR102245198B1 (ko) * 2019-11-28 2021-04-27 대양전기공업 주식회사 레이저 스캐터링을 적용한 센서 제조방법 및 센서
US11688616B2 (en) 2020-07-22 2023-06-27 Applied Materials, Inc. Integrated substrate measurement system to improve manufacturing process performance
WO2023121494A1 (en) * 2021-12-22 2023-06-29 Qatar Foundation For Education, Science And Community Development Automated multi-layer two-dimensional printing
DE102022205971A1 (de) * 2022-06-13 2023-12-14 Carl Zeiss Smt Gmbh Verfahren zum Beschichten eines Spiegelsubstrats mit einer für Nutz- Wellenlängen hochreflektierenden Mehrlagen-Beschichtung sowie Beschichtungsanlage zur Durchführung eines derartigen Verfahrens

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US5871805A (en) * 1996-04-08 1999-02-16 Lemelson; Jerome Computer controlled vapor deposition processes
US6051113A (en) 1998-04-27 2000-04-18 Cvc Products, Inc. Apparatus and method for multi-target physical-vapor deposition of a multi-layer material structure using target indexing
US6215897B1 (en) * 1998-05-20 2001-04-10 Applied Komatsu Technology, Inc. Automated substrate processing system
US6706541B1 (en) 1999-10-20 2004-03-16 Advanced Micro Devices, Inc. Method and apparatus for controlling wafer uniformity using spatially resolved sensors
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JP3683261B2 (ja) * 2003-03-03 2005-08-17 Ｈｏｙａ株式会社 擬似欠陥を有する反射型マスクブランクス及びその製造方法、擬似欠陥を有する反射型マスク及びその製造方法、並びに擬似欠陥を有する反射型マスクブランクス又は反射型マスクの製造用基板
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JP2005281858A (ja) * 2004-03-03 2005-10-13 Sanyo Electric Co Ltd 堆積厚測定方法、材料層の形成方法、堆積厚測定装置および材料層の形成装置
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TWM485447U (zh) * 2014-05-30 2014-09-01 G E Products Co Ltd 具可換式筆頭之觸控筆

Also Published As

Publication number Publication date
TWI647530B (zh) 2019-01-11
CN105917453B (zh) 2021-10-15
JP2017510827A (ja) 2017-04-13
KR20160102511A (ko) 2016-08-30
US20160341544A1 (en) 2016-11-24
WO2015095799A1 (en) 2015-06-25
JP7116753B2 (ja) 2022-08-10
JP6653255B2 (ja) 2020-02-26
JP2020095274A (ja) 2020-06-18
TW201527870A (zh) 2015-07-16
SG11201604721VA (en) 2016-07-28
KR102291659B1 (ko) 2021-08-18
CN105917453A (zh) 2016-08-31

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