SG10201702783UA - Photomask blank substrate container, method for storing photomask blank substrate and method for transporting photomask blank substrate - Google Patents

Photomask blank substrate container, method for storing photomask blank substrate and method for transporting photomask blank substrate

Info

Publication number
SG10201702783UA
SG10201702783UA SG10201702783UA SG10201702783UA SG10201702783UA SG 10201702783U A SG10201702783U A SG 10201702783UA SG 10201702783U A SG10201702783U A SG 10201702783UA SG 10201702783U A SG10201702783U A SG 10201702783UA SG 10201702783U A SG10201702783U A SG 10201702783UA
Authority
SG
Singapore
Prior art keywords
photomask blank
blank substrate
transporting
storing
container
Prior art date
Application number
SG10201702783UA
Other languages
English (en)
Inventor
Ito Shogo
Koitabashi Ryuji
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2017049655A external-priority patent/JP6723945B2/ja
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of SG10201702783UA publication Critical patent/SG10201702783UA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/20—Masks or mask blanks for imaging by charged particle beam [CPB] radiation, e.g. by electron beam; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/60—Substrates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67376—Closed carriers characterised by sealing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975—Assembly, maintenance, transport or storage of apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
SG10201702783UA 2016-04-07 2017-04-05 Photomask blank substrate container, method for storing photomask blank substrate and method for transporting photomask blank substrate SG10201702783UA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016077010 2016-04-07
JP2017017635 2017-02-02
JP2017049655A JP6723945B2 (ja) 2016-04-07 2017-03-15 フォトマスクブランクス基板収納容器、フォトマスクブランクス基板の保管方法、及びフォトマスクブランクス基板の輸送方法

Publications (1)

Publication Number Publication Date
SG10201702783UA true SG10201702783UA (en) 2017-11-29

Family

ID=58536704

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201702783UA SG10201702783UA (en) 2016-04-07 2017-04-05 Photomask blank substrate container, method for storing photomask blank substrate and method for transporting photomask blank substrate

Country Status (6)

Country Link
US (1) US10768524B2 (de)
EP (1) EP3229074B1 (de)
KR (1) KR102382330B1 (de)
CN (1) CN107272328A (de)
SG (1) SG10201702783UA (de)
TW (1) TWI739819B (de)

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5330053A (en) 1991-02-07 1994-07-19 Dai Nippon Printing Co., Ltd. Case for photomask
US5873468A (en) 1995-11-16 1999-02-23 Sumitomo Sitix Corporation Thin-plate supporting container with filter means
JPH11163115A (ja) * 1997-11-28 1999-06-18 Shin Etsu Polymer Co Ltd ウェーハ押さえ部材、これを組み込んだウェーハ収納用容器
JP3910397B2 (ja) * 2001-10-12 2007-04-25 信越ポリマー株式会社 基板収納容器用ガスケット部材及びこれを用いた基板収納容器
US7823730B2 (en) 2002-09-11 2010-11-02 Shin-Etsu Polymer Co., Ltd. Substrate storage container
JP4342863B2 (ja) 2003-07-25 2009-10-14 Ｈｏｙａ株式会社 マスクブランクスの収納容器、マスクブランクスの収納方法及びマスクブランクス収納体並びにマスクブランクス収納体の輸送方法
JP2005031489A (ja) 2003-07-08 2005-02-03 Hoya Corp マスクブランクス等の収納容器及びマスクブランクスの収納方法並びにマスクブランクス収納体
US7463338B2 (en) * 2003-07-08 2008-12-09 Hoya Corporation Container for housing a mask blank, method of housing a mask blank, and mask blank package
JP2005321532A (ja) * 2004-05-07 2005-11-17 Shin Etsu Chem Co Ltd 基板収納ケース
JP2006124034A (ja) * 2004-09-29 2006-05-18 Hoya Corp 薄膜付基板の支持部材、薄膜付基板の収納容器、マスクブランク収納体、転写マスク収納体、及び薄膜付基板の輸送方法
TWI344928B (en) * 2007-04-25 2011-07-11 S&S Tech Co Ltd Mask packing box and selection method of packing box material therefor
JP5347286B2 (ja) * 2008-03-12 2013-11-20 凸版印刷株式会社 粘着テープ、筐体及びその搬送・保管方法、フォトマスクケース及びその搬送・保管方法
JP5268142B2 (ja) * 2008-09-27 2013-08-21 Ｈｏｙａ株式会社 マスクブランク収納ケース及びマスクブランクの収納方法、並びにマスクブランク収納体
KR101147841B1 (ko) * 2010-06-08 2012-05-21 도레이첨단소재 주식회사 전자부품 제조용 점착테이프
JP5663996B2 (ja) 2010-07-27 2015-02-04 株式会社ニコン フォトマスク用合成石英ガラス基板またはフォトマスクブランクの保管ケースの製造方法
CN104520984B (zh) * 2012-04-04 2017-09-22 信越聚合物株式会社 基板收纳容器
JP5952972B2 (ja) 2013-09-11 2016-07-13 信越ポリマー株式会社 フォトマスクブランクス基板収納容器

Also Published As

Publication number Publication date
TW201804515A (zh) 2018-02-01
EP3229074A1 (de) 2017-10-11
EP3229074B1 (de) 2020-12-23
US10768524B2 (en) 2020-09-08
KR102382330B1 (ko) 2022-04-01
KR20170115438A (ko) 2017-10-17
TWI739819B (zh) 2021-09-21
US20170293220A1 (en) 2017-10-12
CN107272328A (zh) 2017-10-20

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