TWI344928B - Mask packing box and selection method of packing box material therefor - Google Patents

Description

1344928 势》 九 发明 发明 发明 发明 发明 发明 发明 发明 发明 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 The method of selecting the material, in particular, the package and the material selection method thereof, which can reduce the molecular pollution of air movement in the case when the package is used for packaging. The method is characterized in that a concentration of air moving molecular pollution (AMC) is controlled to be less than 5 ppm per unit volume, and a single or a plurality of masks can be safely packaged, secured and transported, and a packaging box for the mask. The method of selecting the material of the package. [Prior Art] With the high integration of the material volume circuit, the size of the pattern is from n〇nm, 9〇, 65nm to 45nm, etc., and its size is increasingly pocketed. In order to achieve the above critical dimension (CD: Critical Dimension), it is necessary to use a high-performance photomask (Photomask). In order to manufacture a high-performance photomask, the benefits of the mask mask as a raw material highlight its importance. - Generally, the mask base is stored in the clean room from the Cleanroom to the • Mask process. In order to continue to maintain the high quality of the reticle base during the above-mentioned storage period, it is not possible to transport the vehicle (4) brain, money transport towel, and the temperature and scale of the external impact and ringing. Contaminant material of the defective reticle base package material itself. 5 When there is too much pollutant in the package material itself, the following problems occur. First of all, when viewed from the side of the reticle base, ionic impurities such as ΝΗ4+, α-, F, Ν02·, Ν〇3- and s〇42- occur in the package material; containing benzene, toluene, styrene, B Volatile organic compound (VQC, Volatile Oganie Compound) of aromatic hydrocarbon compounds such as benzene, butylated hydroxybenzene (BHT);

Airborne Molecular Contamination), combined with the composition of the amplified resist, will result in a decrease in the lifetime of the amplified resist and a decrease in sensitivity, which will reduce the characteristics of the reticle substrate. In addition, it will be a transparent substrate of the finished reticle substrate or a semi-finished galvanized tube coated with a chrome film on the transparent substrate, and then it can cause serious problems when the coating agent on the permeable plate is coated with a resist on the lapped film. . When the transparent substrate is stored in a package box of air crane molecular pollution and a film is formed, the force reduction between the chromium film and the transparent substrate is weakened or the air moving molecular contaminants are adsorbed on the transparent substrate to cause defects, thereby causing chromium Bad membrane. After the chromium film is stored in the package, the film is blocked, and the air-moving molecular pollutants of the chromium film are adsorbed on the surface of the chromium film to cause uneven surface energy changes, and a uniform _ relay cannot be formed on the surface of the entire chrome film. In turn, it causes defects. If the use of the amplitude-type coating is carried out, serious defects will be caused due to the presence of the resist residual film (Residue) in the formation of the barrier sample. Then in the light paste © when viewing 'will make Xiao suffer from air decoration molecular pollutants 1344928 / fresh reticle base money tree light _ uncle Μ 贴 贴 贴 贴 贴 贴 职 职 上述 上述 上述 上述 上述 上述 上述 上述 上述 上述 上述 上述 上述 上述 上述 上述 上述. The pollution of the above-mentioned needles and the pollution of the reticle base county (4) increase the degree of pollution, and the light sheet with the protective film (Pellicle), that is, the reticle film (Retide) will not exist in the photolithography process in the semiconductor process. Defects, the above defects are referred to as domain length defects or haze defects. The above-mentioned defect reincarnation is a defect caused by various x-ray impurities present on the mask yarn, containing the volatile mechanical compounding, and the 193 nm or 248 nm exposure wavelength laser energy of the semiconductor photolithography process. The above defects will cause fatal defects to the reticle, shorten the life of the reticle and reduce the manufacturing yield of the semiconductor. The above-mentioned defects caused by the movement of the mobile gas molecules not only affect the reticle base, the reticle and the reticle, but also the wafer storage container, the stepper for the photolithography, and the scanner. Cause serious problems. In addition to the above, 'scratches or particles caused by human error in the storage of the reticle base due to the structural problems of the above-mentioned sealing box (p) (6) may also cause serious problems in the reticle manufacturing process. 'The above-mentioned sealed box puts the base of the reticle into the box, and seals the part between the cover and the body with a tape. < lt;·••疋's existing field box even if the tape is attached to the reticle base The sealing operation of the cartridge may also fail to be perfectly sealed due to structural problems, resulting in external air or impurities 1344928 entering the inside of the reticle base package and causing contamination of the reticle substrate. Regarding the title, the air mineral molecular pollution generated by the sealing tape for the package I can also be problematic. SUMMARY OF THE INVENTION In order to solve the above problems, the object of the present invention is as follows: 1 Use to prevent outside air from entering the inside of the package. The sealing rod prevents external particles from entering the interior, and does not degrade its quality during the movement or storage of the reticle base, contributing to good manufacturing quality. The reticle 2. The reticle substrate does not move during the movement of the reticle substrate into the package, and the particles generated by the friction between the reticle substrate and the package are minimized, which can be effectively maintained. Excellent quality of the mask base. 3. In the method of selecting the packaging material of the present invention, the Outgas concentration of the mask base material can be analyzed by using ATD-GC/MS and 1C analysis methods, which is helpful for selecting an appropriate type of resist. The reticle base package material does not affect the surface characteristics of the transparent substrate and the chrome film. After the above-mentioned ATD-GC/MS, 1C analysis method and pcd process are selected, the reticle base package material suitable for the amplitude-increasing resist is selected and made into a package box. When it is applied to the storage and transportation of the mask base, it is possible to manufacture a package of a mask base having a low AMC concentration such as Mas, MBs, MCs, and MDs. 8 1344928 • 5· Using the above package can be used in In the process of storage and transportation of the mask base, the reticle base H' is advantageous for the manufacture of high-quality products, and further produces a high defect that does not occur in the use of a retort or a retort for the Uretide. Quality mask. In order to achieve the above object, the photomask encapsulation box of the present invention comprises a cover, a body, a card E and a pad. The inside of the fresh package of the present invention can be similar to the (4) semiconductor process mask, and the card® has an approximately rectangular shape with an upper opening. The utility model can carry a plurality of the above-mentioned figures and covers, the above-mentioned body has an approximately rectangular shape with an upper open portion, can carry a card E having a plurality of masks and is simplified, and has a sealing function in the winding tape to further improve the sealing degree. After the above-mentioned _ is placed inside the cover, the upper body is coupled to the main body to which the cassette is fixed. The card E has an upper and a lower type structure, and includes a body, which is composed of a bearing space portion and a _ which can carry the figure army; and a bottom surface which extends with the above-mentioned body and can support the carried fresh. The reticle base groove is disposed along the card wall and the opposite inner wall, and the reticle base can be placed inside the bearing space portion, and the upper side of the body (10) of the card g is disposed downward. Extending the card settlement bar of the above-mentioned method, the above-mentioned card deformation strip can reduce the above-mentioned card E material from changing the image, and the card g is easy to be combined and fixed when the card g is combined with the body; the card_outside (four) has a card E guide, you can minimize the movement of the above mentioned cassette when combined with the body. The upper body has an upper open structure ‘including a body, which is composed of the above-mentioned card 9 1344928 • (4) carrying empty m卩 and (10); and a bottom surface extending integrally with the upper wall and supporting the _ card®. In order to prevent the body from being deformed during molding, a body deformation preventing strip is disposed on the inner side surface of the inner wall; and the body is conveniently combined with the card E, and the inner side guide is formed on the upper portion of the bottom surface. 'The above-mentioned inner wall of the inner wall forms a body lock, which can be combined with the cover lock of the cover to prevent the above-mentioned package from being separated; the sealing rod is disposed along the outer side of the inner wall and is in a water-paying configuration. After the joint use, the seal is used to seal the work. The seal is improved by the step-by-step method: the outer side of the bottom surface has a body outer guide, and when a plurality of the above-mentioned packs are stacked in the vertical direction, the cover can be guided with the cover. Combined to facilitate the lamination work. In addition, the upper seam includes: a pad HJ fixed groove at both ends thereof, which can be combined/fixed to the pad holder of the above cover; the side support frame of the cover and the side fixing portion of the cover can support the mosquito The substrate, the surface, and the holder, when the pad is combined with the cover, can be combined with the body to enhance the bearing capacity of the pad. The above-mentioned crucible includes: a plurality of tracks 'located on the outer side of the upper side, which can improve the convenience in the laminating operation of the reticle base case; the money fixing frame is located inside the cover, and the pad '· cover deformation preventing strip can be fixed, and The deformation of the cover is minimized during the molding process of the cover; the cover lock 'is located on the side of the cover, and the body and the cover may be combined. [Embodiment] The contents and embodiments of the present invention will be further described below with reference to the accompanying drawings. First, 1344928 * * . Explains the structural aspects. 1 is a schematic perspective view showing a combination of a cassette and a body; FIGS. 2a to 2e are schematic perspective views of a card stencil of a reticle base package; and FIG. 3 is a schematic view of a body of a 3D reticle base package (B〇dy). 3A is a schematic perspective view of a cover of a reticle base package of the present invention. FIG. 5a is a schematic perspective view of a cover of a reticle base package of the present invention. However, the scope of the patent application of the present invention is not limited to the following embodiments. For example, this manual defines the carrier cover in the package as a reticle base. However, the following package is not only suitable for the reticle substrate, but also for the reticle, the reticle, the wafer, and the wafer. And a transparent substrate or the like, which is required to prevent the contamination of the semiconductor device during the storage process. Of course, scales can make various changes to the size and shape of the county box composition. First, the cassette and the body of the present invention will be described with reference to Figs. 1 to 3. As shown in FIG. 2 to FIG. 2, the card E 300 has an upper open structure, and the body 310' is composed of a bearing space portion 3 ιι which can carry the reticle base and the inner wall ., and the bottom surface 汹 is integrated with the inner wall 312. Extends and can support the reticle substrate carried. In order to place a plurality of reticle substrates inside the above-mentioned load-bearing space portion 3, and to carry ‘the inner wall of the side wall of the cassette 300 and its facing inner wall are arranged with the cover groove %. On the upper side surface of the inner wall 312 of the card H 3 (8), there are arranged two less than a fixed distance-cutting deformation preventing strip 32, and the above-mentioned cutting deformation preventing strip % can greatly reduce the deformation phenomenon of the above-mentioned card E. It is easy to combine and fix the above-mentioned traits 1344928 when combined with the body. The outer side of the bottom surface 320 of the cassette has a plurality of cassette guides 31, which can minimize the movement of the cassettes 3 when the cassette 300 is coupled to the body. As shown in FIG. 1 and FIGS. 3a to 3d, the body 2 has an upper open structure, and the body 210' is composed of a bearing space portion 211 capable of carrying a card and an inner wall; and a bottom surface 220, and the above The inner wall 212 extends integrally and can support the cassette 300 carried. In order to prevent deformation of the main body 200 during molding, the main body deformation preventing strip 2 is disposed in the vertical direction of the inner side surface of the inner wall 22A. In order to facilitate the combination of the above-mentioned card and the card S 300, the inner side rail 21 is formed on the upper portion of the bottom surface, and the outer side surface of the inner wall of the body 200 forms the body lock 22, which can be covered with the cover. The ship line combines with the gantry to separate the above package. At this time, in order to increase the bonding force with the above cover, the value of the body lock can be modified. The above-mentioned sealed rod 23 can be stepped up in the tape sealing operation performed after the cartridge joining operation to increase the density. In order to increase the lightness and sealing function of the tape width, the width of the above sealing bar can be increased or decreased. The outer side of the bottom surface has a body side rail 24 ′ which can be combined with the lid guide on the cover, and the vertical direction of the lion is high. As shown in Figs. 4a to 4d, the end of the crucible 400 has a crucible fixing groove 4, which can be used to combine the above-mentioned crucibles with the money. Scale, the number of the upper miscellaneous f 40 is not limited to two, in order to improve the turning function, a multi-fixing groove 4 can be formed. In addition, the method further includes: a cover side support frame and a cover side fixing portion 42, which can support the side surface of the above-mentioned cover which is carried by the solid surface; the pad support frame C, when the above-mentioned 塾4〇〇 is combined with the cover τ When combined with the upper body, it can enhance the bearing capacity by applying force to the pad. As shown in FIGS. 5a to 5d, the upper mask village of the cover (10) has a plurality of cover guides for improving the convenience in the lamination operation of the plurality of the cover boxes, and the inside of the cover has a cover for fixing the pads. Pad holder 13. In addition, the cover deformation preventing strip n should be included, and the deformation of the upper position can be minimized during the molding process of the above-mentioned cover (8). The lid i(8)_ surface has a lid lock, and the joint force can be greatly improved when the above reading is combined with the lid. At this time, considering the difference in the size or the miscellaneous size, the overall size of the cover may vary depending on the size of the cover, and in particular, the cover lock 12 may be modified in size in order to improve the bonding. In order to prevent the above-mentioned cover from being exposed to the photoresist (four) key and to allow viewing of its internal contents, the above cover should be transparent. At this time, the color of the above-mentioned cover should be such that the transmission of light of a wavelength of 5 GGn nm is mixed. The bonding process of the present invention having the above structure will be briefly described below. As shown in Fig. 6, the above-mentioned mask substrate 61 is housed in a cut fixed to the inside of the body. As shown in Fig. 7, the cover attached to the pad is placed in a plurality of masks and the body is placed to perform I. At the same time, the above-mentioned reticle base will be stored in the package box. As shown in FIG. 8, on the package box in which the group base is accommodated, the tape 62 is attached to the sealing rod and the thin-fixed portion of the body, and the sealing operation of the mask is completed. System (4) The above county box is added to f or pure, and the base of the cover is secret. &amp; ^ Λ As described above, in the above embodiment, when multiple reticle base reticle encapsulation boxes are used, only the edge portion of the hood is received, and the contact between the reticle substrate and the package is minimized. The location, thus minimizing damage to the fresh substrate and reducing the amount of particles generated. When the reticle base is placed in the package and the tape is used for sealing work, the sealing rod on the main body is also wrapped up, so the density is not good, and the outer space (10) red can be avoided. The external particles enter the inside of the box. The body deformation preventing strip inside the body and the card on the card S_riding the bar can minimize the difficulty of the card E into a __ degree, greatly increasing the bonding force between the body and the card _ and making the card _ in the body (10), It is possible to minimize the movement of the cassette during the storage of the figure, and (4) to greatly reduce the internal movement of the fresh substrate. The movement of the inside of the mask is greatly reduced by the lid lock on the lid and the crucible disposed on the lid, which greatly reduces the particles generated by the friction between the fresh substrate and the package. Further description will be made on the characteristics of the encapsulating material of the present invention, which can greatly reduce the air mobile molecular pollution caused by the above-mentioned package. First, the resin suitable for the components such as the lid, the body, the cassette, and the mat of the above-mentioned package is a conductive polymer substance or its surface resistance is 1 G1 to _ Ω / port. The air moving molecules (4) suitable for the above packaged box should be less than 5ppmv °. The mask base box, the mask package, the wafer package and the sealing tape are sealed. (The concentration of AMQ should be maintained at a level of less than 5 ppm per morning. The air-moving molecular pollutants generated by the above package include acid-based molecules (MAs = Molecular Acids) and salt-based molecules (MBs: Molecular Bases). , condensable molecules (MCs: Molecular Condensables) and impurity molecules (MDs: Molecular Dopants). The above package is made of polystyrene, acrylonitrile-stirrene, styrene- ACS: Acrylonitrile Chlorinated Polyethylene Styrene, Polypropylene (PP), Olefin (Olefin), Polyethylene (PE), Polycarbonate (PC), Expanded Polystyrene (Expanded Polystyrene; EPS), expanded polypropylene (EPP: Expanded Polypropylene), polybutylene terephthalate (PBT), acrylonitrile-butadiene-styrene ( ABS: Acrylonitrile Butadiene Styrene), PVC: Polyvinyl Chloride, PVDC: Polyvinyldene Chloride, Acrylic, Polyethylene Terephthalate Antistatic polyethylene terephthalate vinegar (APET: 1344928

Antistatic Polyethylene Terephthalate) A polymer synthetic resin obtained by mixing one or two or more substances from the group consisting of KUREHA's B AYON series. In this case, the above polymer synthetic resin can be selectively subjected to oxidation resistance and antistatic treatment. In the air moving molecular contaminants occurring in the above package, the total amount of nitrogen (N)-containing pollutants or aromatic hydrocarbon compounds is maintained at a level of less than 5 ppm per unit volume. In this case, the above aromatic hydrocarbon compound is composed of Benzene, Toluene, Styrene, Ethylbenzene, o-Xylene, and m-Xyiene. ), p-Xyiene, n-Propylbenzene, Isopropylbenzene, 1,2,4-Trimethylbenzene, 1,3 ,5-Trimeth-ylbenzene, o-ethyltoluene, m-ethyltoluene, m-ethylbenzene (o- Diethylbenzene), mdiethylbenzene, p-diethylbenzene, n-butylbenzene, and butylated hydroxy Toluene One or two or more substances are selected from the group consisting of jin and mixed. Among the air moving molecular pollutants occurring in the above package, sulfur compounds, alcohols, aldehydes, ketones, fatty acids, esters, amines, aliphatic saturated hydrocarbons, aliphatic unsaturated carbonization The concentration of one or more selected from the group consisting of hydrogen, chlorine, chlorine compounds and aromatic hydrocarbons is maintained at a level of less than 5 ppm per unit volume of 16 1344928. Among the air moving molecular pollutants occurring in the above package, one of Li+, Na, NH4+, K+, Mg+, Ca+, F-, Cl-, N〇2, Br'NO3, PO42 and SO42- is selected or The concentration after mixing two or more substances is maintained to a level of less than 5 ppm per unit volume. The resist film constituting the reticle base when the reticle substrate is packaged is composed of an amplification resist, a photoresist, and an electron beam resist. As described above, the resin used for the lid, the body, the card S and the mat of the present invention is usually made of PP, PC, PE, HDPE, LDPE, PET, 〇lefin, BAY0N series, ABS, and Acryl. At this time, the concentration of air moving molecular contamination of the applied resin should be less than 5 ppmv. In order to prevent particles or impurities from being adsorbed on the applicable resin by the influence of static electricity, a conductive polymer material or a resin having a sheet resistance of 1 〇 13 Ω/Ο should be selected. In order to minimize the pollutants and use the above selected packaging materials, the characteristics of the carried mask can be maintained. Next, a method of selecting a mask base sealing material of the present invention will be described. The selection method is as follows: Step one, select the package material which can be used for the physical and chemical change of the silk fresh base from temperature, humidity, pressure, light, heat and wavelength. Step one, use gas chromatograph/mass spectrometer: Gas Chromatograph/Mass Spectr〇meter) and ion chromatograph (ic : h

Chro shouted qing h) analysis of slaves (four) (four) secret f; (10) using the above gas 17 phase chromatograph / texture to divide (four), sewage __ sampling method and in the air capture (P &amp; T · Purge and Trap), automatic heat Desorption (Jian Yang matic Thermai

Des〇lpti〇n) ^^^(TD: Thermal Desorption)^ Tl.^(Headspace) Select one or more methods and then sample. When the analysis is carried out using the above gas chromatograph/f spectrometer, the sample of the analysis target material is first placed in a bottle of (4), and then the temperature at f temperature or below is carried out at a temperature of m 〇. When the instrument is analyzed, first sample the material of the analysis object and the ultrapure water-domain person (four) after the remainder, at 23. Door (10). (3) 孰 treatment at temperature. The following is a description of the method for selecting the reticle base encapsulating material of the present invention. First, the material of the package is prepared. The package includes a cover, a body, and a card H 3 〇 0 and 塾 4 〇〇 ' A mask substrate of a film (not shown). The material of the above-mentioned Fengshangjin 500 mainly uses a polymer synthetic resin. The above high-score synthetic resin may include polystyrene, butyl styrene, acrylonitrile, chlorinated polyethylene-styrene plastic, polypropylene, olefin, poly Ethylene, polycarbonate, expanded polystyrene foam, polybutylene terephthalate, propylene guess-butadiene-styrene, 4 ethylene, polyvinylidene chloride, acrylic, poly B. phthalic acid, antistatic polyethylene phthalic acid vinegar, Japan KUREHA ΒΑ 〇Ν 〇Ν series. At this time, the above-mentioned polymer synthesis can be carried out in an anti-oxidation and antistatic place. The above-mentioned package should be selected to protect the material of the reticle substrate from physical/chemical change towels of temperature, humidity, pressure, light, heat and wavelength. More specifically, the "child" packaging material should be selected from the vinyl (but), metal and synthetic resin materials that can be used to cover the base of the mask. In order to prevent the occurrence of air flow in the fresh base _ part and its exterior, the above-mentioned Wei material makes it easy to escape (4) A. The above encapsulating material can also reflect or absorb the wavelength that affects the photoresist. Then, the contaminants of the selected materials were analyzed by a gas chromatograph/mass spectrometer and an ion chromatograph. When the above chromatographic/mass spectrometer is used for the analysis, the sampling of the pollutants can be carried out by selecting one or two or more methods in the air blowing trap, the automatic thermal desorption, the thermal desorption, and the headspace method. The above pollutants refer to the World Semiconductor Equipment Materials Association (SEMI:

Air Equipment Contamination as defined by SEMI F21-951 by Semiconductor Equipment and Materials International, AMC classification includes: Mas: Molecular Acids, Salt-Based Molecular Bases (MBs: Molecular Bases), Condensable Molecules (MCs: Molecular Condensables) and impurity molecules (mds:

Molecular Dopants). When the above-mentioned analysis target material is analyzed by the above 1C method, it is placed in a sealed bottle in which the sample can be stored, and then ultrapure water is added, and then heat treatment is performed in a temperature range of 23 ° C to 3 ° C to make the pollutants super Get rid of pure water. For the ultrapure water from which the ionic impurities were removed by the above process, an IC analyzer was used to analyze the ultrafine water. Scales If the core of the sample is placed in the sealed bottle, the sample can be divided into the required size and placed in a sealed bottle. When the analysis is carried out using the above chromatograph/mass spectrometer, a sample of the material to be analyzed is placed in a sealed bottle, at 23. Door (8). (3) Temperature off _ line heat treatment. After the treatment, the red plastic in the sealed bottle is adsorbed in a red tube. The volatility in the adsorption tube (10)e) to which the volatile organic compound was adsorbed was determined by using a thermal desorption device, and the volatile organic compound was analyzed using a Gc/Ms apparatus. In the same sample as the 1C sample, the entire sample can be placed in the secret, or the sample can be divided into the required size and placed in a sealed bottle. After the above process, the material suitable for the package can be selected. An embodiment of a method of selecting a material for a reticle base package will now be described. The analytical materials of this example include PP, PC, ABS, pvc, 〇lefin, PE, PET, EPP, and Acrylic. First, perform the following pre-treatment before performing the ion impurity analysis. Each sample was cut into rectangular pieces of lcmxlcmxl mm size, and 5 g of the analysis sample was placed in an analysis bottle having a capacity of 250 ml, and then 2 ml of ultrapure water was filled into the analysis bottle. An analytical flask filled with 2 〇 ml of ultrapure water was heated at 120 ° C for 20 minutes using an autoclave. The ultrapure water from which ions were removed after heating was analyzed using a 1C instrument. When analyzing volatile organic compounds, as in the 1C analysis, the sample was cut into rectangular pieces of 1344928 lcm x lcm x l mm 'put the 5 g sample into the analysis bottle with 250 ml of grain' and then use the boiler (〇ven) 85. Heat at 〇 for 6 〇 minutes. The volatile organic compounds in the heating flask are adsorbed onto the adsorption tube using vacuum millet. The volatile organic compounds adsorbed on the adsorption tube were thermally desorbed using a thermal desorption device to analyze the volatile money compounds. At this time, the quantitative fractionation was carried out based on hexadecane.

(Table 1) Results of cation analysis (unit: ppmv) F- Cl- N〇2- NO PP 0.8 1.2 0.0 ----- 0.6 PC 0.0 0.4 0.2 0.0 ABS 0.7 13 02 ---- 0.4 PVC 0.5 0.8 0.4 0.0 Olefin 0.1 0.6 0.0 ---— 0.0 PE 0.7 0.3 0.4 PET 0.1 0.0 0.0 ol (Table 2) Anion analysis results - P〇42- S〇42- Total 0.7 1.7 5.2 0.0 0.3 0.9 0.0 0.9 3.5 0.4 0.7 3.0 0.4 0.3 1.4 0.2 0.7 2.4 0.0 0.2 0.4 21 1344928 (unit: ppmv) Aromatic Hydrocarbon Other total voc — pp 1.5 2.3 3.8 PC 0.3 0.5 0.8 ABS 2.7 3.5 6.2 PVC 1.5 1 2.5 Olefin 0.5 0.9 1.4 PE 0.7 1.4 2.1 PET 0.8 1.5 2.3

(Table 3) Analysis results of volatile organic compounds (unit: ppmv) PP Air mobile molecular pollution concentration 15.4

(Table 4) Air Molecular Contamination Concentration Tables 2 and 3 are the results of analysis of cations, anions and volatile organic compounds respectively. Figure 9 shows the analysis of volatile organic compounds subdivided into Tables 1 and 2 and The air after the result values of Table 3 are added to move each of the seven boxes of the 1 1 134 928 cover, body, cassette and mat are all the same material. The performance of the amplified resist was evaluated after storing the amplified resist for 3 months in the reticle-based package. Performance Evaluation Results 'The performance of the reticle package made of PC, Olefin, and PET using air moving molecular contamination concentrations below 5PPnw did not decrease. However, using a package made of pp, ABS, PVC, and PE with air moving molecular contamination concentration higher than 5 ppmv, the amplification type resist stored in the box exhibits a decrease in sensitivity and a performance degradation phenomenon such as residual resist. , especially *NH4+, Cl, F, Ν〇2· and SO42- ionic impurities and Hydr_b()n

PP, PVC and ABS packages with large detection values of Compound have a severe performance degradation. It can be seen from the above results that the reticle base package made of a material having a moving molecular concentration of less than 5 ppmv can maintain the quality of the reticle base even after being stored for three months; however, using air to move the molecular contamination concentration The reticle base package made of a material higher than 5?1)11^ has a large reduction in the quality of the reticle substrate. This embodiment has been described only for a reticle base package which can accommodate five pieces, but the present invention can be applied to a package for a reticle base without being affected by the number of reticle substrates. As shown in Figs. 10a to 10b, not only the reticle base package, but also the storage/packaging/transport container for the reticle or the reticle can be selected to have no growth defects through the above analysis method 23 1344928. The material is also suitable for the storage of the crystal_package box. In the above situation, it is turned over in fresh base, fresh and fine county tape. While the present invention has been described in detail above, it is not intended to limit the invention, and it is understood that the invention may be variously modified without departing from the spirit of the invention and the scope of the patent application. And the modifications, therefore, the scope of protection of the present invention is defined as the scope defined by the scope of the patent. ^ As mentioned above, the package of the present invention uses a (four) rod which can prevent outside air from flowing into the interior of the sealing box, so that the foreign matter can be prevented from entering the interior of the package, and the movement or storage of the fresh substrate/; Reducing its quality helps to produce good quality light: hood. During the movement of the light armor substrate into the package, the reticle substrate does not move. 'The particles generated by the friction between the light and the substrate are minimized, and the excellent quality of the reticle substrate can be effectively maintained. . In the method for selecting a packaging material of the present invention, the 〇utgas inversion of the reticle base encapsulating material can be analyzed by using ATD_GC/MS and a knife-analysis method, which is helpful for selecting a suitable resisting agent and not affecting the surface of the transparent substrate and the chrome film. Features of the reticle base package material. Through the above ATD-GC/MS, 1C analysis method and PCD process, the reticle base encapsulant suitable for Zengzhong i resist is selected and packaged, and then applied to the storage and handling of the reticle 24 1344928 substrate. It is possible to manufacture a package of reticle substrates with lower concentrations of Mas, MBs, MCs &amp; MDs 荨 AMC. By using the above-described package, the quality of the mask base can be maintained during storage and handling of the reticle substrate, which is advantageous for the manufacture of high-quality reticle. When used in a reticle or Reticle package, it is possible to produce a high-quality reticle that does not cause long defects. [Simple diagram of the diagram] A schematic perspective view of the circle 1 series card and the body. 2a to 2e are schematic perspective views of a cassette of a reticle base package. 3a to 3d are schematic perspective views of a body (Bocjy) of a reticle base package. 4a to 4d are schematic perspective views of a mat (Cushi〇n) of a reticle base package. Fig. 5a to Fig. 5d are perspective views of the fresh base of the county (four), and Fig. 6 is a perspective view of the base of the reticle of the embodiment when placed in the cassette. Figure 7 is a projection view of the reticle substrate when it is packaged inside the reticle base package. Fig. 8 is a schematic perspective view showing the mask base sealed with a mask base and sealed with a secret tape. Figure 9 is a graph of the ATD_GC/MS peak of the present invention and the detected main substance. Figure 10a is a photograph of a package for use in a cap or reticle selected using the invention (iv). (10) Photo of the round box. Cover deformation preventing bar Figure l〇b is a crystal made using the material selected by the present invention [Main component symbol description] 10 Cover rail 11 25 1344928 12 Cover lock 20 Body deformation preventing strip 22 Body lock 24 Main body outer rail 31 Card guide Rail 40 pad fixing groove 42 cover side fixing portion 61 mask base 100 cover 300 cassette 210, 310 body 212, 312 inner wall 500 package 13 pad holder 21 body inner rail 23 sealing rod 30 mask base groove 32 card匣 deformation prevention strip 41 hood side support frame 43 pad support frame 62 tape 200 body 400 pad 211 ' 311 bearing space 220, 320 bottom surface

26

Claims (1)

1J44928 » * i Patent application: ® p. 妮妮£ (3⁄4 is replacing the purchase of 1. - reticle encapsulation box, package difficult, body, and cover the semiconductor process mask, t the above card! The upper layer is close to the matte and can carry a plurality of the above-mentioned masks; the cores are approximated to the upper and lower sides, and the cassettes having the plurality of masks are carried and fixed, and the body has a sealing rod, the sealing The rod is arranged on the outer side surface of the inner wall and arranged in a horizontal direction to further improve the degree of sealing after the use of the tape and the sealing operation; the cover fixes the pad to the inside of the cover to press and fix the pad After the upper part of the cover is combined with the main body to which the cassette is fixed; the resin suitable for the components such as the cover, the body, the card g and the cymbal of the package is a conductive polymer substance or its surface resistance is 1G1 to 1013 Ω/口. 2. The reticle encapsulation box according to claim j, wherein the card 1 has an upper structure, and comprises a bearing space portion and an inner wall which can carry the hood; And the bottom surface, and The inner wall extends integrally and can support the carried cover, and the inner wall of the card m side and the inner wall of the opposite inner wall are arranged with the reticle base groove, and the reticle base can be placed inside the carrying space portion and Carrying a card deformation preventing strip extending downward by a certain distance on the upper side surface of the inner wall of the card body, and the above-mentioned stuck deformation preventing strip can greatly reduce the deformation phenomenon of the above-mentioned card, and the above-mentioned card hiding When combined with the body, it is easy to combine and 27 1344928. Λ * , fixed; Η ', 刀送魏页〜一一--------. 丨丨 The above card _ silk outside. #卡_道, can be in the above The _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The carrying space portion of the cassette is composed of an inner wall; and the bottom surface is integrally extended with the inner wall and can support the loaded card. In order to prevent deformation of the body during molding, a body deformation is arranged on the inner side of the upper wall. Preventing the strip; in order to facilitate the combination of the main body and the cassette, the inner side rail of the main body is formed on the upper part of the bottom surface; the outer side surface of the inner wall forms a body lock, which can be combined with the cover lock of the cover and prevented The package is separated; the outer side of the bottom surface has a body outer guide, and when a plurality of the packages are stacked in the vertical direction, the cover can be combined with the lid guide to facilitate the lamination operation. The reticle encapsulation box, wherein the pad comprises a pad fixing groove at two ends thereof, the pad can be combined/fixed to the pad holder of the cover; the side cover of the cover and the side fixing portion of the cover The side surface of the reticle base can be supported and fixed. The pad support frame can be applied to the pad when the pad is combined with the cover body. 5. The reticle encapsulation box according to claim 1 or 4, wherein the cover comprises: a cover guide located on an outer side of the upper cover, which can improve convenience in the laminating operation of the plurality of sealed boxes; The frame 'located inside the cover' can fix the pad; the cover deformation preventing strip can minimize the deformation of the cover during the molding process of the cover; the cover lock is located on the side of the cover, and can be combined with the body and the cover. 6. The reticle package of claim 1, wherein the cover has a color such that a transmittance of a wavelength of 500 nm or less passing through the cover is less than 10%. 7. The reticle encapsulation box according to claim 1, wherein the resin suitable for the above package has a liquid mobile molecular pollution concentration of less than 5 ppmv 〇 8. A reticle encapsulation box includes a cover, a body, and a card The pad and the pad can carry and house the semiconductor process mask, wherein the card is in an approximately rectangular shape with an upper opening, and can carry a plurality of the above-mentioned masks; the body is approximately open in the shape of an approximately rectangular shape, and can carry more The card E of the mask is fixed and the body has a sealing rod, and the sealing rod is 29 1344928. The first side of the inner wall is horizontally arranged for use. The tape is further improved in sealing during the sealing operation; the cover is fixed to the inside of the cover by the cover, and then combined with the body to which the cassette is fixed; wherein the tape is exposed to the age of the crane The concentration of (AMC) is maintained to a level equal to or lower than 5 ppm per unit volume. 9. The reticle package of claim 1 or 8, wherein the air moving molecular contaminant generated by the package comprises: an acid-based molecule, a salt-based molecule, a condensable molecule, and an impurity molecule. 1. The reticle encapsulation box of the above-mentioned package (4), wherein the material of the above-mentioned package is made of polystyrene, acrylonitrile-styrene, styrene-gasified polyethylene-acrylonitrile, polypropylene, Olefin, polyethylene, polycarbonate, expanded polystyrene, expanded polypropylene, polybutylene terephthalate, acrylonitrile, dibutyl styrene, polystyrene, polyvinylidene dioxide, acrylic A polymer synthetic resin obtained by mixing one or two or more kinds of polyethylene terephthalate and antistatic polyethylene terephthalate. 11. The reticle package of claim 1 or 8, wherein the total amount of pollutants or aromatic hydrocarbon compounds containing gas (9) in the air moving molecular contaminants occurring in the package is Maintained to a level of less than 5 ppm per unit volume. 12. The reticle encapsulation box of claim u, wherein: 1344928 . &quot; * ' η _ , I , || | __ mu,,. ,! , |Μ||, ί_ —_月日日仏(_£) is replacing the page, the above aromatic hydrocarbon compound is composed of stupid, toluene, styrene, ethylbenzene, o-xylene, m-xylene, p-xylene, propylbenzene, cumene, u, 4_trimethyl stupid, 1,3,5-trimethylbenzene, o-ethyltoluene, m-ethyltoluene, m-diethylbenzene, benzo-ethylene-ethyl, diethylbenzene, n-butyl Benzene and tau radicals are composed of a mixture of toluene-sodium or a mixture of two or more substances. 13. The reticle encapsulation box according to claim </RTI> or claim 8, wherein in the air moving molecular contaminants occurring in the above package, the vulcanized condensate, ethanol, ethyl sulphate, hydrazine, fatty acid , the concentration of vinegar, amines, aliphatic saturated hydrocarbons, aliphatic unsaturated hydrocarbons, gas and gas compounds and aromatic carbonized U wipes selected after mixing one or more substances in the parent unit The volume is below 5 ppm. The reticle encapsulation box according to claim 1 or 8, wherein + in the air moving molecular pollutants occurring in the above package, in Li+, • Na, qing+, K+, Mg+, Ca+, The concentration of one or more selected from the group consisting of Cl, N02-, Br, Ν〇3·, P〇42- and SO42 is maintained at a level of less than 5 ppm per unit volume. 15. The reticle package of claim 1 or 8, wherein if the cover carried by the package is a reticle base, the damper constituting the reticle base is increased by The electron beam is formed. 16. A method for selecting a material of the mask package, comprising the first step, comprising polystyrene, acrylonitrile-styrene, styrene-gasified polyethylene 31 1344928, • 'positive replacement page 丨-acrylonitrile, Polypropylene roasting, smoking, polyethylene, polycarbon polystyrene &quot; - foamed polypropylene, polyethylene terephthalate, acrylonitrile-butadiene-styrene, polyvinyl chloride, polyethylene One or more of the group consisting of ethylene, acryl, polyethylene terephthalate and antistatic polyethylene terephthalate - f ' can be selected from temperature, humidity, pressure, light , heat and wavelength, etc. External-force physics/chemical changes in the protective reticle base or reticle encapsulation material; ~Step 2, so that the 骑 phase riding instrument / mass spectrometer and ion chromatograph analyze the above selected materials, pollutants (4) When using the above gas chromatograph _ instrument for analysis, the contaminated material wood sample method can be sampled after the method of blowing capture, automatic heat selection - seed attachment, and headspace method, and the instrument /Quality, I- \ y use the above gas phase layer When the Japanese instrument is read, the first analysis of the county is after the 23rd. "She. (4) The sample is packed in a sealed bottle for heat treatment in the temperature range of C ~ 300 C. 32