SG10201609616TA - Electronic device with cooling fan - Google Patents
Electronic device with cooling fanInfo
- Publication number
- SG10201609616TA SG10201609616TA SG10201609616TA SG10201609616TA SG10201609616TA SG 10201609616T A SG10201609616T A SG 10201609616TA SG 10201609616T A SG10201609616T A SG 10201609616TA SG 10201609616T A SG10201609616T A SG 10201609616TA SG 10201609616T A SG10201609616T A SG 10201609616TA
- Authority
- SG
- Singapore
- Prior art keywords
- electronic device
- cooling fan
- fan
- cooling
- electronic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D17/00—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
- F04D17/08—Centrifugal pumps
- F04D17/16—Centrifugal pumps for displacing without appreciable compression
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D25/00—Pumping installations or systems
- F04D25/02—Units comprising pumps and their driving means
- F04D25/06—Units comprising pumps and their driving means the pump being electrically driven
- F04D25/0606—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump
- F04D25/0613—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump the electric motor being of the inside-out type, i.e. the rotor is arranged radially outside a central stator
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/40—Casings; Connections of working fluid
- F04D29/42—Casings; Connections of working fluid for radial or helico-centrifugal pumps
- F04D29/44—Fluid-guiding means, e.g. diffusers
- F04D29/441—Fluid-guiding means, e.g. diffusers especially adapted for elastic fluid pumps
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
- G06F1/1658—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories related to the mounting of internal components, e.g. disc drive or any other functional module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1662—Details related to the integrated keyboard
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662384041P | 2016-09-06 | 2016-09-06 | |
US201662413395P | 2016-10-26 | 2016-10-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201609616TA true SG10201609616TA (en) | 2018-04-27 |
Family
ID=59799484
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201609616TA SG10201609616TA (en) | 2016-09-06 | 2016-11-16 | Electronic device with cooling fan |
Country Status (4)
Country | Link |
---|---|
US (1) | US10375853B2 (zh) |
CN (1) | CN109792853B (zh) |
SG (1) | SG10201609616TA (zh) |
WO (1) | WO2018048636A1 (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10285303B2 (en) | 2017-07-14 | 2019-05-07 | Apple Inc. | Electronic device with integrated passive and active cooling |
CN117072471A (zh) * | 2017-12-22 | 2023-11-17 | 台达电子工业股份有限公司 | 风扇 |
TWI664353B (zh) * | 2018-03-28 | 2019-07-01 | 華碩電腦股份有限公司 | 風扇模組及電子裝置 |
US11294435B2 (en) * | 2018-12-14 | 2022-04-05 | Dell Products L.P. | Information handling system high density motherboard |
JP2021052090A (ja) * | 2019-09-25 | 2021-04-01 | レノボ・シンガポール・プライベート・リミテッド | 電子機器 |
CN112735890A (zh) * | 2019-10-28 | 2021-04-30 | 群光电子股份有限公司 | 键盘 |
US11304329B2 (en) * | 2019-12-20 | 2022-04-12 | Intel Corporation | Movable inlet for a fan |
JP6846547B1 (ja) * | 2020-01-09 | 2021-03-24 | レノボ・シンガポール・プライベート・リミテッド | 電子機器 |
CN113672039A (zh) * | 2021-08-23 | 2021-11-19 | 联想(北京)有限公司 | 一种电子设备 |
CN116241482B (zh) * | 2023-03-31 | 2023-12-19 | 荣耀终端有限公司 | 一种散热风扇及电子设备 |
Family Cites Families (63)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4119008B2 (ja) * | 1998-06-23 | 2008-07-16 | 株式会社東芝 | 回路部品の冷却装置および電子機器 |
JP2000216575A (ja) * | 1999-01-22 | 2000-08-04 | Toshiba Corp | 冷却装置及び冷却装置を内蔵した電子機器 |
JP4327320B2 (ja) * | 2000-01-07 | 2009-09-09 | 株式会社東芝 | 電子機器 |
JP3302350B2 (ja) * | 2000-06-29 | 2002-07-15 | 株式会社東芝 | 電子機器 |
JP2002198674A (ja) | 2000-12-27 | 2002-07-12 | Toshiba Corp | 冷却装置および冷却装置を有する携帯形電子機器 |
US6778390B2 (en) | 2001-05-15 | 2004-08-17 | Nvidia Corporation | High-performance heat sink for printed circuit boards |
US20030024693A1 (en) | 2001-07-31 | 2003-02-06 | Petty Eric Hayes | Counter flow two pass active heat sink with heat spreader |
US7314613B2 (en) * | 2002-11-18 | 2008-01-01 | Maxygen, Inc. | Interferon-alpha polypeptides and conjugates |
CN100378975C (zh) * | 2003-05-07 | 2008-04-02 | 富士通株式会社 | 冷却部件、基板和电子设备 |
US7198464B2 (en) | 2004-10-08 | 2007-04-03 | Asia Vital Component Co., Ltd. | Frame device of a fan |
US20060078423A1 (en) * | 2004-10-08 | 2006-04-13 | Nonlinear Tech, Inc. | Bi-directional Blowers for Cooling Laptop Computers |
US20060193113A1 (en) * | 2005-02-28 | 2006-08-31 | International Business Machines Corporation | Controlling a surface temperature of a portable computer for user comfort in response to motion detection |
US20070041157A1 (en) * | 2005-08-18 | 2007-02-22 | Wang David G | Heat dissipation apparatus |
JP2008071855A (ja) * | 2006-09-13 | 2008-03-27 | Fujitsu Ltd | 電子機器およびプリント基板ユニット |
US20080138134A1 (en) * | 2006-12-07 | 2008-06-12 | Wilde Wendy J | Keyboard assembly with integral air circulator |
US20080174957A1 (en) * | 2007-01-23 | 2008-07-24 | Lev Jeffrey A | Electronic device cooling system |
US7934540B2 (en) * | 2007-02-01 | 2011-05-03 | Delphi Technologies, Inc. | Integrated liquid cooling unit for computers |
US20080266782A1 (en) | 2007-04-27 | 2008-10-30 | Qin Zhang | Waterproof keyboard device |
US7764493B2 (en) * | 2008-01-04 | 2010-07-27 | Apple Inc. | Systems and methods for cooling electronic devices using airflow dividers |
CN101605442B (zh) | 2008-06-13 | 2013-01-23 | 富准精密工业(深圳)有限公司 | 散热装置 |
CN101610658B (zh) | 2008-06-20 | 2012-07-18 | 富准精密工业(深圳)有限公司 | 散热装置 |
JP5160973B2 (ja) | 2008-06-23 | 2013-03-13 | 株式会社小糸製作所 | 車両用灯具 |
US8202045B2 (en) | 2008-06-26 | 2012-06-19 | Intel Corporation | Blower fan for low profile environment |
JP2010073160A (ja) | 2008-09-22 | 2010-04-02 | Fujitsu Ltd | 筐体および電子機器 |
US8011878B2 (en) * | 2008-12-07 | 2011-09-06 | Furui Precise Component (Kunshan) Co., Ltd. | Centrifugal fan and electronic device using same |
TWM366878U (en) * | 2009-01-23 | 2009-10-11 | Wistron Corp | Thermal module with airflow-guided effect |
WO2010122611A1 (ja) * | 2009-04-23 | 2010-10-28 | パナソニック株式会社 | 高周波電力検波回路及び無線通信装置 |
CN101896054A (zh) | 2009-05-21 | 2010-11-24 | 富准精密工业(深圳)有限公司 | 散热装置 |
US8085535B2 (en) * | 2009-12-18 | 2011-12-27 | Intel Corporation | Fan casing integrated heat spreader for active cooling of computing system skins |
JP4792103B2 (ja) | 2009-12-25 | 2011-10-12 | 株式会社東芝 | 遠心ファンおよび電子機器 |
TW201204227A (en) | 2010-07-05 | 2012-01-16 | Hon Hai Prec Ind Co Ltd | Heat dissipation apparatus |
TWI573519B (zh) * | 2010-09-24 | 2017-03-01 | 鴻準精密工業股份有限公司 | 可攜帶式電子裝置及其散熱模組 |
TW201230939A (en) * | 2010-11-08 | 2012-07-16 | Compal Electronics Inc | Electronic apparatus |
TW201227244A (en) | 2010-12-27 | 2012-07-01 | Hon Hai Prec Ind Co Ltd | Heat dissipation device |
JP2012155375A (ja) * | 2011-01-21 | 2012-08-16 | Sony Corp | 情報処理装置及び操作入力装置 |
US9084512B2 (en) * | 2011-05-16 | 2015-07-21 | Vita-Mix Management Corporation | Blender base |
TWM417596U (en) * | 2011-05-30 | 2011-12-01 | Adda Corp | Heat dissipation fan |
CN202126658U (zh) * | 2011-06-09 | 2012-01-25 | 协禧电机股份有限公司 | 散热风扇 |
JP5927539B2 (ja) * | 2011-07-25 | 2016-06-01 | パナソニックIpマネジメント株式会社 | 電子機器 |
JP5159933B1 (ja) | 2011-09-01 | 2013-03-13 | 株式会社東芝 | テレビ、電子機器 |
TWI505073B (zh) * | 2012-03-22 | 2015-10-21 | Compal Electronics Inc | 電子裝置 |
JP2013225631A (ja) * | 2012-04-23 | 2013-10-31 | Fujitsu Ltd | 電子装置 |
US8964383B2 (en) | 2012-06-08 | 2015-02-24 | Apple Inc. | Optimized vent walls in electronic devices |
TWI509158B (zh) * | 2012-09-25 | 2015-11-21 | Sunon Electronics Kunshan Co Ltd | 離心式散熱扇 |
CN103796463B (zh) * | 2012-10-31 | 2016-12-21 | 英业达科技有限公司 | 散热模块、电子装置及其除尘方法 |
TW201424547A (zh) | 2012-12-03 | 2014-06-16 | Hon Hai Prec Ind Co Ltd | 電子裝置組合 |
US9298232B2 (en) * | 2012-12-28 | 2016-03-29 | Kabushiki Kaisha Toshiba | Electronic device |
JP6017954B2 (ja) | 2012-12-28 | 2016-11-02 | 株式会社東芝 | 電子機器 |
TWI512442B (zh) * | 2013-02-21 | 2015-12-11 | Sunonwealth Electr Mach Ind Co | 手持電子裝置之散熱系統 |
CN104110401B (zh) * | 2013-04-17 | 2016-08-10 | 台达电子工业股份有限公司 | 离心式风扇 |
JP5785223B2 (ja) | 2013-07-03 | 2015-09-24 | ファナック株式会社 | ファンモータの振動抑制機構を備えたファンカバー、およびモータ駆動装置 |
JP2015022611A (ja) | 2013-07-22 | 2015-02-02 | ソニー株式会社 | 回転駆動装置 |
US9765788B2 (en) * | 2013-12-04 | 2017-09-19 | Apple Inc. | Shrouded fan impeller with reduced cover overlap |
TW201538063A (zh) * | 2014-03-26 | 2015-10-01 | Hon Hai Prec Ind Co Ltd | 電子裝置及其散熱風扇 |
AT515828B1 (de) | 2014-05-23 | 2022-02-15 | Fronius Int Gmbh | Kühlvorrichtung und Wechselrichtergehäuse mit einer solchen Kühlvorrichtung |
JP6282541B2 (ja) * | 2014-06-27 | 2018-02-21 | ミネベアミツミ株式会社 | 遠心式ファン |
US20160013696A1 (en) * | 2014-07-09 | 2016-01-14 | Apple Inc. | Motor interconnect device |
US9530244B2 (en) * | 2014-11-11 | 2016-12-27 | Intergraph Corporation | Method and apparatus for shadow estimation and spreading |
JP6470578B2 (ja) * | 2015-02-03 | 2019-02-13 | 三菱重工コンプレッサ株式会社 | 遠心圧縮機 |
TW201706244A (zh) * | 2015-05-07 | 2017-02-16 | 必治妥美雅史谷比公司 | 作為RORγ調節劑之三環碸類 |
US10400790B2 (en) * | 2015-05-21 | 2019-09-03 | Mitsubishi Heavy Industries Compressor Corporation | Compressor |
US10718339B2 (en) * | 2015-09-03 | 2020-07-21 | Apple Inc. | Peripheral drive centrifugal fan |
KR101848437B1 (ko) * | 2017-03-28 | 2018-04-13 | 한국과학기술연구원 | 신축성 가변형 디퓨저 베인이 구비된 원심형 터보 기계 |
-
2016
- 2016-11-16 SG SG10201609616TA patent/SG10201609616TA/en unknown
-
2017
- 2017-08-21 US US15/682,291 patent/US10375853B2/en active Active
- 2017-08-24 CN CN201780057706.3A patent/CN109792853B/zh active Active
- 2017-08-24 WO PCT/US2017/048504 patent/WO2018048636A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN109792853B (zh) | 2020-06-26 |
US10375853B2 (en) | 2019-08-06 |
WO2018048636A1 (en) | 2018-03-15 |
US20180070472A1 (en) | 2018-03-08 |
CN109792853A (zh) | 2019-05-21 |
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