SG10201607814PA - Liquid material discharge apparatus and method - Google Patents

Liquid material discharge apparatus and method

Info

Publication number
SG10201607814PA
SG10201607814PA SG10201607814PA SG10201607814PA SG10201607814PA SG 10201607814P A SG10201607814P A SG 10201607814PA SG 10201607814P A SG10201607814P A SG 10201607814PA SG 10201607814P A SG10201607814P A SG 10201607814PA SG 10201607814P A SG10201607814P A SG 10201607814PA
Authority
SG
Singapore
Prior art keywords
liquid material
material discharge
discharge apparatus
liquid
discharge
Prior art date
Application number
SG10201607814PA
Other languages
English (en)
Inventor
Kazumasa Ikushima
Original Assignee
Musashi Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Musashi Engineering Inc filed Critical Musashi Engineering Inc
Publication of SG10201607814PA publication Critical patent/SG10201607814PA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1034—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D83/00—Containers or packages with special means for dispensing contents
    • B65D83/0005—Containers or packages provided with a piston or with a movable bottom or partition having approximately the same section as the container
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
SG10201607814PA 2011-10-07 2012-10-05 Liquid material discharge apparatus and method SG10201607814PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011222468A JP5986727B2 (ja) 2011-10-07 2011-10-07 液体材料の吐出装置および方法

Publications (1)

Publication Number Publication Date
SG10201607814PA true SG10201607814PA (en) 2016-11-29

Family

ID=48043850

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201401318WA SG11201401318WA (en) 2011-10-07 2012-10-05 Liquid material discharge apparatus and method
SG10201607814PA SG10201607814PA (en) 2011-10-07 2012-10-05 Liquid material discharge apparatus and method

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG11201401318WA SG11201401318WA (en) 2011-10-07 2012-10-05 Liquid material discharge apparatus and method

Country Status (10)

Country Link
US (2) US9260234B2 (fr)
EP (1) EP2764925B1 (fr)
JP (1) JP5986727B2 (fr)
KR (1) KR102012303B1 (fr)
CN (2) CN106984490B (fr)
MY (1) MY170835A (fr)
PL (1) PL2764925T3 (fr)
SG (2) SG11201401318WA (fr)
TW (1) TWI592216B (fr)
WO (1) WO2013051697A1 (fr)

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JP5986727B2 (ja) * 2011-10-07 2016-09-06 武蔵エンジニアリング株式会社 液体材料の吐出装置および方法
EP2972130A4 (fr) * 2013-03-14 2016-12-07 The Alfred E Mann Found For Scient Res Capteur microfluidique de débit d'écoulement
CN107185775B (zh) * 2013-05-20 2019-06-14 日本电产增成株式会社 液剂吐出装置
JP6381902B2 (ja) * 2013-12-13 2018-08-29 Ntn株式会社 塗布針ホルダ
WO2016032746A1 (fr) 2014-08-28 2016-03-03 Nordson Corporation Module de distribution de jet sans impact et procédé
KR101610197B1 (ko) * 2014-11-18 2016-04-08 주식회사 프로텍 압전 공압 밸브 구동형 디스펜싱 펌프 및 이를 이용한 용액 디스펜싱 방법
CN104391403A (zh) * 2014-12-05 2015-03-04 京东方科技集团股份有限公司 一种液晶泵及应用该液晶泵的滴下方法
CN104588232B (zh) * 2015-01-15 2017-03-08 深圳市轴心自控技术有限公司 喷射阀及使用该喷射阀的点胶系统
CN104588233B (zh) * 2015-01-15 2017-03-08 深圳市轴心自控技术有限公司 喷射阀及具有该喷射阀的点胶系统
JP6452147B2 (ja) * 2015-01-19 2019-01-16 武蔵エンジニアリング株式会社 液体材料吐出装置
KR101674425B1 (ko) * 2015-03-05 2016-11-09 김진수 수지 도포장치
CN105149167B (zh) * 2015-10-16 2017-09-01 漳州职业技术学院 一种负压反馈回吸顶针式点胶阀
KR101740146B1 (ko) * 2015-10-30 2017-05-26 주식회사 프로텍 펌프 위치 피드백 방식 디스펜서 및 디스펜싱 방법
JP6615634B2 (ja) 2016-02-22 2019-12-04 武蔵エンジニアリング株式会社 増圧回路を備える液体材料吐出装置
CN106076693A (zh) * 2016-07-15 2016-11-09 苏州锡友微连电子科技有限公司 一种锡膏喷射阀
JP6285510B2 (ja) * 2016-08-08 2018-02-28 武蔵エンジニアリング株式会社 液体材料の吐出装置および方法
JP6778426B2 (ja) * 2016-09-20 2020-11-04 武蔵エンジニアリング株式会社 液体材料吐出装置
JP2018051478A (ja) 2016-09-29 2018-04-05 セイコーエプソン株式会社 流体吐出装置および流体を吐出する方法
JP2018051479A (ja) * 2016-09-29 2018-04-05 セイコーエプソン株式会社 流体吐出装置および流体を吐出する方法
JP6772725B2 (ja) * 2016-09-29 2020-10-21 セイコーエプソン株式会社 流体吐出装置および流体を吐出する方法
CN110612163B (zh) * 2017-04-28 2022-11-11 武藏工业株式会社 线缆单元、具备其的液体材料供给装置及涂布装置
KR102213687B1 (ko) 2017-05-25 2021-02-05 무사시 엔지니어링 가부시키가이샤 액체 재료 도포 장치 및 액체 재료 도포 방법
US10801493B2 (en) * 2017-12-14 2020-10-13 William E. Howseman, Jr. Positive displacement reciprocating pump assembly for dispensing predeterminedly precise amounts of fluid during both the up and down strokes of the pump piston
CN111556793B (zh) * 2018-02-02 2022-12-06 三键有限公司 喷出装置以及供液方法
KR102014701B1 (ko) * 2019-04-16 2019-08-27 (주)한빛산업 2차전지 전극코팅용 가변 액츄에이터 장치
MX2022007899A (es) * 2019-12-24 2022-09-09 Three Bond Co Ltd Dispositivo de aplicacion de material y elemento de empuje.
US20220234291A1 (en) * 2021-01-22 2022-07-28 Formlabs, Inc. Material dispensing pump for additive fabrication
CN115318551B (zh) * 2021-05-11 2024-03-29 三赢科技（深圳）有限公司 一种点胶装置
CN115672597A (zh) * 2021-07-27 2023-02-03 长鑫存储技术有限公司 一种喷涂装置及喷涂方法
CN114411519B (zh) * 2022-03-10 2023-11-24 济南市市政工程设计研究院（集团）有限责任公司 一种沥青路面防冻修复一体化装置

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Also Published As

Publication number Publication date
MY170835A (en) 2019-09-06
KR20140074974A (ko) 2014-06-18
EP2764925A1 (fr) 2014-08-13
SG11201401318WA (en) 2014-11-27
US9260234B2 (en) 2016-02-16
JP2013081884A (ja) 2013-05-09
US20160107188A1 (en) 2016-04-21
TW201325736A (zh) 2013-07-01
JP5986727B2 (ja) 2016-09-06
US20140252041A1 (en) 2014-09-11
TWI592216B (zh) 2017-07-21
CN106984490B (zh) 2019-05-14
EP2764925A4 (fr) 2015-07-29
KR102012303B1 (ko) 2019-08-20
US9919336B2 (en) 2018-03-20
CN103889589B (zh) 2017-02-15
PL2764925T3 (pl) 2019-08-30
CN103889589A (zh) 2014-06-25
CN106984490A (zh) 2017-07-28
EP2764925B1 (fr) 2019-02-27
WO2013051697A1 (fr) 2013-04-11

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