SG10201607091XA - Photomask Blank - Google Patents

Photomask Blank

Info

Publication number
SG10201607091XA
SG10201607091XA SG10201607091XA SG10201607091XA SG10201607091XA SG 10201607091X A SG10201607091X A SG 10201607091XA SG 10201607091X A SG10201607091X A SG 10201607091XA SG 10201607091X A SG10201607091X A SG 10201607091XA SG 10201607091X A SG10201607091X A SG 10201607091XA
Authority
SG
Singapore
Prior art keywords
photomask blank
photomask
blank
Prior art date
Application number
SG10201607091XA
Other languages
English (en)
Inventor
Kouhei Sasamoto
Yukio Inazuki
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of SG10201607091XA publication Critical patent/SG10201607091XA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/20—Masks or mask blanks for imaging by charged particle beam [CPB] radiation, e.g. by electron beam; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • G03F1/32—Attenuating PSM [att-PSM], e.g. halftone PSM or PSM having semi-transparent phase shift portion; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/54—Absorbers, e.g. of opaque materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/80—Etching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • G03F7/0043—Chalcogenides; Silicon, germanium, arsenic or derivatives thereof; Metals, oxides or alloys thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/7015—Details of optical elements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
SG10201607091XA 2015-09-03 2016-08-25 Photomask Blank SG10201607091XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015173895A JP6451561B2 (ja) 2015-09-03 2015-09-03 フォトマスクブランク

Publications (1)

Publication Number Publication Date
SG10201607091XA true SG10201607091XA (en) 2017-04-27

Family

ID=56740132

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201607091XA SG10201607091XA (en) 2015-09-03 2016-08-25 Photomask Blank

Country Status (7)

Country Link
US (1) US9864266B2 (fr)
EP (2) EP3139211B1 (fr)
JP (1) JP6451561B2 (fr)
KR (2) KR101928621B1 (fr)
CN (4) CN114326284A (fr)
SG (1) SG10201607091XA (fr)
TW (1) TWI630455B (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180102027A (ko) 2017-03-06 2018-09-14 주식회사 엘지화학 장식 부재 및 장식 부재의 제조 방법
WO2018164464A1 (fr) 2017-03-06 2018-09-13 주식회사 엘지화학 Élément décoratif et procédé de fabrication associé
JP7056000B2 (ja) * 2017-03-15 2022-04-19 株式会社三洋物産 遊技機
JP6432636B2 (ja) * 2017-04-03 2018-12-05 凸版印刷株式会社 フォトマスクブランク、フォトマスク及びフォトマスクの製造方法
CN109597276A (zh) * 2017-10-01 2019-04-09 思而施技术株式会社 用于防止静电破坏的空白掩模和光掩模
JP7420065B2 (ja) * 2018-03-15 2024-01-23 大日本印刷株式会社 大型フォトマスク
JP6988697B2 (ja) * 2018-05-31 2022-01-05 信越化学工業株式会社 フォトマスクブランク、フォトマスクの製造方法及びフォトマスク
JP7110022B2 (ja) * 2018-07-27 2022-08-01 アルバック成膜株式会社 フォトマスクおよびその製造方法
JP7366810B2 (ja) * 2019-05-28 2023-10-23 アルバック成膜株式会社 マスクブランクス、ハーフトーンマスク、製造方法、製造装置
JP7280171B2 (ja) * 2019-12-05 2023-05-23 信越化学工業株式会社 フォトマスクブランク、フォトマスクの製造方法及びフォトマスク
JP7296927B2 (ja) * 2020-09-17 2023-06-23 信越化学工業株式会社 位相シフトマスクブランク、位相シフトマスクの製造方法、及び位相シフトマスク
JP7033638B2 (ja) * 2020-12-09 2022-03-10 Hoya株式会社 マスクブランク、転写用マスクの製造方法、及び半導体デバイスの製造方法
US20220317554A1 (en) * 2021-04-06 2022-10-06 Shin-Etsu Chemical Co., Ltd. Photomask blank, method for producing photomask, and photomask

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0720427Y2 (ja) 1990-01-11 1995-05-15 豊生ブレーキ工業株式会社 シュー間隙自動調節機構を備えたドラムブレーキ
EP1022614B1 (fr) 1998-07-31 2012-11-14 Hoya Corporation Ébauche pour photomasque, photomasque, ses procédés de fabrication et procédé de formation de micro-motifs
JP4686006B2 (ja) 2000-04-27 2011-05-18 大日本印刷株式会社 ハーフトーン位相シフトフォトマスクとハーフトーン位相シフトフォトマスク用ブランクス、及びハーフトーン位相シフトフォトマスクの製造方法
JP2003195483A (ja) 2001-12-28 2003-07-09 Hoya Corp フォトマスクブランク、フォトマスク、及びそれらの製造方法
JP2003195479A (ja) 2001-12-28 2003-07-09 Hoya Corp ハーフトーン型位相シフトマスクブランク、及びハーフトーン型位相シフトマスクの製造方法
JP3093632U (ja) 2002-03-01 2003-05-16 Ｈｏｙａ株式会社 ハーフトーン型位相シフトマスクブランク
JP4407815B2 (ja) * 2004-09-10 2010-02-03 信越化学工業株式会社 フォトマスクブランク及びフォトマスク
TWI375114B (en) * 2004-10-22 2012-10-21 Shinetsu Chemical Co Photomask-blank, photomask and fabrication method thereof
JP4413828B2 (ja) * 2004-10-22 2010-02-10 信越化学工業株式会社 フォトマスクブランクおよびフォトマスクならびにこれらの製造方法
JP4933754B2 (ja) 2005-07-21 2012-05-16 信越化学工業株式会社 フォトマスクブランクおよびフォトマスクならびにこれらの製造方法
DE602006021102D1 (de) 2005-07-21 2011-05-19 Shinetsu Chemical Co Photomaskenrohling, Photomaske und deren Herstellungsverfahren
JP4968740B2 (ja) * 2005-12-26 2012-07-04 Ｈｏｙａ株式会社 フォトマスクブランク及びフォトマスクの製造方法、並びに半導体装置の製造方法
JP4509050B2 (ja) * 2006-03-10 2010-07-21 信越化学工業株式会社 フォトマスクブランク及びフォトマスク
US8512916B2 (en) * 2008-03-31 2013-08-20 Hoya Corporation Photomask blank, photomask, and method for manufacturing photomask blank
JP5175932B2 (ja) * 2008-06-25 2013-04-03 Ｈｏｙａ株式会社 位相シフトマスクブランクおよび位相シフトマスク
JP5888247B2 (ja) * 2011-02-04 2016-03-16 旭硝子株式会社 導電膜付基板、多層反射膜付基板、およびｅｕｖリソグラフィ用反射型マスクブランク
CN103828022A (zh) * 2011-09-30 2014-05-28 Hoya株式会社 模具坯、母模具、复制模具和模具坯的制造方法
JP6105367B2 (ja) 2013-04-24 2017-03-29 株式会社ニューフレアテクノロジー 荷電粒子ビーム描画方法
JP6229466B2 (ja) * 2013-12-06 2017-11-15 信越化学工業株式会社 フォトマスクブランク
JP6284080B2 (ja) 2014-03-17 2018-02-28 国立大学法人 岡山大学 Ｘ線撮影用補助具

Also Published As

Publication number Publication date
KR20180124811A (ko) 2018-11-21
EP3139211A3 (fr) 2017-04-12
EP3633452A1 (fr) 2020-04-08
CN114326284A (zh) 2022-04-12
EP3633452B1 (fr) 2023-12-13
US20170068154A1 (en) 2017-03-09
JP2017049476A (ja) 2017-03-09
EP3139211A2 (fr) 2017-03-08
CN114326285A (zh) 2022-04-12
EP3633452C0 (fr) 2023-12-13
CN106502043A (zh) 2017-03-15
KR20170028261A (ko) 2017-03-13
TWI630455B (zh) 2018-07-21
TW201727353A (zh) 2017-08-01
CN114924460A (zh) 2022-08-19
EP3139211B1 (fr) 2020-02-12
US9864266B2 (en) 2018-01-09
CN106502043B (zh) 2022-01-18
KR101928621B1 (ko) 2018-12-12
JP6451561B2 (ja) 2019-01-16

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