SG10201504767PA - Process for manufacturing semiconductor package having hollow chamber - Google Patents
Process for manufacturing semiconductor package having hollow chamberInfo
- Publication number
- SG10201504767PA SG10201504767PA SG10201504767PA SG10201504767PA SG10201504767PA SG 10201504767P A SG10201504767P A SG 10201504767PA SG 10201504767P A SG10201504767P A SG 10201504767PA SG 10201504767P A SG10201504767P A SG 10201504767PA SG 10201504767P A SG10201504767P A SG 10201504767PA
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor package
- hollow chamber
- manufacturing semiconductor
- manufacturing
- hollow
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00269—Bonding of solid lids or wafers to the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0172—Seals
- B81C2203/019—Seals characterised by the material or arrangement of seals between parts
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW104114011A TWI544580B (zh) | 2015-05-01 | 2015-05-01 | 具中空腔室之半導體封裝製程 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201504767PA true SG10201504767PA (en) | 2016-12-29 |
Family
ID=57183661
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201504767PA SG10201504767PA (en) | 2015-05-01 | 2015-06-17 | Process for manufacturing semiconductor package having hollow chamber |
Country Status (6)
Country | Link |
---|---|
US (1) | US20160318756A1 (zh) |
JP (1) | JP6110437B2 (zh) |
KR (1) | KR101731942B1 (zh) |
CN (1) | CN106098568A (zh) |
SG (1) | SG10201504767PA (zh) |
TW (1) | TWI544580B (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6469327B1 (ja) * | 2017-06-08 | 2019-02-13 | 北陸電気工業株式会社 | センサデバイス及びその製造方法 |
DE102017125140B4 (de) * | 2017-10-26 | 2021-06-10 | Infineon Technologies Ag | Verfahren zum Herstellen eines hermetisch abgedichteten Gehäuses mit einem Halbleiterbauteil |
DE102018102144A1 (de) * | 2018-01-31 | 2019-08-01 | Tdk Electronics Ag | Elektronisches Bauelement |
JP7174242B2 (ja) * | 2018-06-15 | 2022-11-17 | 日亜化学工業株式会社 | 半導体装置の製造方法 |
US10811581B2 (en) * | 2018-06-15 | 2020-10-20 | Nichia Corporation | Method of manufacturing semiconductor device |
US20210276859A1 (en) * | 2018-09-26 | 2021-09-09 | Ignite, Inc. | A MEMS Package |
WO2020185021A1 (ko) | 2019-03-12 | 2020-09-17 | 에스케이씨 주식회사 | 패키징 기판 및 이를 포함하는 반도체 장치 |
KR102396184B1 (ko) | 2019-03-12 | 2022-05-10 | 앱솔릭스 인코포레이티드 | 패키징 기판 및 이를 포함하는 반도체 장치 |
WO2020185020A1 (ko) | 2019-03-12 | 2020-09-17 | 에스케이씨 주식회사 | 유리를 포함하는 기판의 적재 카세트 및 이를 적용한 기판의 적재방법 |
WO2020204473A1 (ko) | 2019-03-29 | 2020-10-08 | 에스케이씨 주식회사 | 반도체용 패키징 유리기판, 반도체용 패키징 기판 및 반도체 장치 |
CN113366633B (zh) | 2019-08-23 | 2022-07-12 | 爱玻索立克公司 | 封装基板及包括其的半导体装置 |
JP7318572B2 (ja) * | 2020-03-17 | 2023-08-01 | 三菱電機株式会社 | 半導体装置及び半導体装置の製造方法 |
KR20220081445A (ko) | 2020-12-08 | 2022-06-16 | 삼성전자주식회사 | PoP 구조의 반도체 패키지 및 그 제조방법 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6479320B1 (en) * | 2000-02-02 | 2002-11-12 | Raytheon Company | Vacuum package fabrication of microelectromechanical system devices with integrated circuit components |
US6661082B1 (en) * | 2000-07-19 | 2003-12-09 | Fairchild Semiconductor Corporation | Flip chip substrate design |
JP2002299484A (ja) * | 2001-03-29 | 2002-10-11 | Matsushita Electric Ind Co Ltd | 電子部品 |
JP2004111571A (ja) * | 2002-09-17 | 2004-04-08 | Kyocera Corp | 半導体素子収納用パッケージおよび半導体装置 |
JP2006228837A (ja) * | 2005-02-15 | 2006-08-31 | Sharp Corp | 半導体装置及びその製造方法 |
US20070170599A1 (en) * | 2006-01-24 | 2007-07-26 | Masazumi Amagai | Flip-attached and underfilled stacked semiconductor devices |
JP2008085108A (ja) | 2006-09-28 | 2008-04-10 | Kyocera Corp | 接合構造体および電子装置 |
JP4274264B2 (ja) * | 2007-04-06 | 2009-06-03 | パナソニック株式会社 | モジュールの製造方法 |
JP2009038286A (ja) * | 2007-08-03 | 2009-02-19 | Olympus Corp | 封止構造体 |
JP5645047B2 (ja) * | 2008-09-29 | 2014-12-24 | 日立化成株式会社 | 半導体素子搭載用パッケージ基板とその製法及び半導体パッケージ |
JP5537119B2 (ja) | 2009-10-28 | 2014-07-02 | 京セラ株式会社 | 蓋体並びに蓋体の製造方法および電子装置の製造方法 |
US8393526B2 (en) * | 2010-10-21 | 2013-03-12 | Raytheon Company | System and method for packaging electronic devices |
-
2015
- 2015-05-01 TW TW104114011A patent/TWI544580B/zh active
- 2015-06-11 US US14/736,328 patent/US20160318756A1/en not_active Abandoned
- 2015-06-17 SG SG10201504767PA patent/SG10201504767PA/en unknown
- 2015-07-03 KR KR1020150095108A patent/KR101731942B1/ko active IP Right Grant
- 2015-07-03 JP JP2015134350A patent/JP6110437B2/ja active Active
- 2015-07-03 CN CN201510386211.8A patent/CN106098568A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
KR101731942B1 (ko) | 2017-05-02 |
US20160318756A1 (en) | 2016-11-03 |
JP2016213426A (ja) | 2016-12-15 |
TWI544580B (zh) | 2016-08-01 |
CN106098568A (zh) | 2016-11-09 |
JP6110437B2 (ja) | 2017-04-05 |
TW201640622A (zh) | 2016-11-16 |
KR20160130134A (ko) | 2016-11-10 |
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