SG10201504537YA - Processing apparatus - Google Patents

Processing apparatus

Info

Publication number
SG10201504537YA
SG10201504537YA SG10201504537YA SG10201504537YA SG10201504537YA SG 10201504537Y A SG10201504537Y A SG 10201504537YA SG 10201504537Y A SG10201504537Y A SG 10201504537YA SG 10201504537Y A SG10201504537Y A SG 10201504537YA SG 10201504537Y A SG10201504537Y A SG 10201504537YA
Authority
SG
Singapore
Prior art keywords
processing apparatus
processing
Prior art date
Application number
SG10201504537YA
Other languages
English (en)
Inventor
Sukegawa Naoya
Harada Seiji
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201504537YA publication Critical patent/SG10201504537YA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
SG10201504537YA 2014-06-27 2015-06-09 Processing apparatus SG10201504537YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014132280A JP6366383B2 (ja) 2014-06-27 2014-06-27 加工装置

Publications (1)

Publication Number Publication Date
SG10201504537YA true SG10201504537YA (en) 2016-01-28

Family

ID=54840024

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201504537YA SG10201504537YA (en) 2014-06-27 2015-06-09 Processing apparatus

Country Status (7)

Country Link
US (1) US20150380283A1 (ko)
JP (1) JP6366383B2 (ko)
KR (1) KR102194659B1 (ko)
CN (1) CN105215839B (ko)
DE (1) DE102015211806A1 (ko)
SG (1) SG10201504537YA (ko)
TW (1) TWI649158B (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6704275B2 (ja) * 2016-03-28 2020-06-03 株式会社ディスコ デバイスウエーハの評価方法
JP6856335B2 (ja) * 2016-09-06 2021-04-07 株式会社ディスコ 加工装置
CN106425744A (zh) * 2016-10-13 2017-02-22 成都格瑞思文化传播有限公司 自动化单晶硅片倒角装置
JP6707291B2 (ja) * 2016-10-14 2020-06-10 株式会社ディスコ ウェーハの加工方法
JP6754272B2 (ja) * 2016-10-24 2020-09-09 株式会社ディスコ 研削装置
JP2018085411A (ja) * 2016-11-22 2018-05-31 株式会社ディスコ ウエーハの加工方法
JP2018094596A (ja) * 2016-12-13 2018-06-21 株式会社ディスコ レーザー加工装置
CN110270918B (zh) * 2019-07-26 2020-11-06 浙江浦江三菱制锁有限公司 一种智能锁外壳抛光设备
JP7345379B2 (ja) 2019-12-06 2023-09-15 株式会社ディスコ ゲッタリング性評価装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5197271A (en) * 1981-03-22 1993-03-30 Texas Instruments Incorporated Method and apparatus for back side damage of silicon wafers
JP2508530B2 (ja) * 1987-04-25 1996-06-19 三菱マテリアル株式会社 歪付けウエハのゲツタリング能力の評価方法
JPH0770578B2 (ja) * 1990-03-27 1995-07-31 大日本スクリーン製造株式会社 半導体基板の表面状態評価方法およびその装置
JPH05335411A (ja) * 1992-06-02 1993-12-17 Toshiba Corp ペレットの製造方法
JPH11297779A (ja) * 1998-04-10 1999-10-29 Sony Corp 半導体装置の欠陥検出方法およびその製造方法
US6081334A (en) * 1998-04-17 2000-06-27 Applied Materials, Inc Endpoint detection for semiconductor processes
US6227944B1 (en) * 1999-03-25 2001-05-08 Memc Electronics Materials, Inc. Method for processing a semiconductor wafer
JP2007012810A (ja) * 2005-06-29 2007-01-18 Renesas Technology Corp 半導体集積回路装置の製造方法
JP4986568B2 (ja) * 2006-10-11 2012-07-25 株式会社ディスコ ウエーハの研削加工方法
JP2009004406A (ja) * 2007-06-19 2009-01-08 Disco Abrasive Syst Ltd 基板の加工方法
JP2009094326A (ja) 2007-10-10 2009-04-30 Disco Abrasive Syst Ltd ウェーハの研削方法
JP5568837B2 (ja) * 2008-02-29 2014-08-13 株式会社Ｓｕｍｃｏ シリコン基板の製造方法
US8129279B2 (en) * 2008-10-13 2012-03-06 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polish process control for improvement in within-wafer thickness uniformity
US20100235114A1 (en) * 2009-03-10 2010-09-16 Kla-Tencor Corporation Systems and methods for determining one or more characteristics of a specimen using radiation in the terahertz range
JP5406676B2 (ja) * 2009-11-10 2014-02-05 株式会社ディスコ ウエーハの加工装置
SG173283A1 (en) * 2010-01-26 2011-08-29 Semiconductor Energy Lab Method for manufacturing soi substrate
JP5385875B2 (ja) * 2010-08-26 2014-01-08 東京エレクトロン株式会社 プラズマ処理装置及び光学モニタ装置
JP2013219320A (ja) * 2012-03-15 2013-10-24 Ricoh Co Ltd 成膜方法及び面発光レーザの製造方法
JP6410490B2 (ja) * 2014-06-27 2018-10-24 株式会社ディスコ デバイスウェーハの評価方法

Also Published As

Publication number Publication date
JP2016012595A (ja) 2016-01-21
TW201603950A (zh) 2016-02-01
KR102194659B1 (ko) 2020-12-23
CN105215839A (zh) 2016-01-06
JP6366383B2 (ja) 2018-08-01
DE102015211806A1 (de) 2015-12-31
TWI649158B (zh) 2019-02-01
CN105215839B (zh) 2019-02-15
US20150380283A1 (en) 2015-12-31
KR20160001627A (ko) 2016-01-06

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