SG10201504222SA - Electrostatic Attraction Apparatus, Electrostatic Chuck And Cooling Treatment Apparatus - Google Patents

Electrostatic Attraction Apparatus, Electrostatic Chuck And Cooling Treatment Apparatus

Info

Publication number
SG10201504222SA
SG10201504222SA SG10201504222SA SG10201504222SA SG10201504222SA SG 10201504222S A SG10201504222S A SG 10201504222SA SG 10201504222S A SG10201504222S A SG 10201504222SA SG 10201504222S A SG10201504222S A SG 10201504222SA SG 10201504222S A SG10201504222S A SG 10201504222SA
Authority
SG
Singapore
Prior art keywords
electrostatic
cooling treatment
treatment apparatus
electrostatic chuck
electrostatic attraction
Prior art date
Application number
SG10201504222SA
Other languages
English (en)
Inventor
Kaoru Yamamoto
Shinji Orimoto
Naoyuki Suzuki
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG10201504222SA publication Critical patent/SG10201504222SA/en

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
SG10201504222SA 2014-05-29 2015-05-28 Electrostatic Attraction Apparatus, Electrostatic Chuck And Cooling Treatment Apparatus SG10201504222SA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014111285A JP6358856B2 (ja) 2014-05-29 2014-05-29 静電吸着装置及び冷却処理装置

Publications (1)

Publication Number Publication Date
SG10201504222SA true SG10201504222SA (en) 2015-12-30

Family

ID=54702934

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201504222SA SG10201504222SA (en) 2014-05-29 2015-05-28 Electrostatic Attraction Apparatus, Electrostatic Chuck And Cooling Treatment Apparatus

Country Status (5)

Country Link
US (1) US9787222B2 (zh)
JP (1) JP6358856B2 (zh)
KR (1) KR101791302B1 (zh)
SG (1) SG10201504222SA (zh)
TW (1) TWI659497B (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6742214B2 (ja) * 2016-10-04 2020-08-19 株式会社ディスコ 静電チャックプレートの給電装置
JP6605061B2 (ja) 2017-07-07 2019-11-13 東京エレクトロン株式会社 載置台構造及び処理装置
US11149345B2 (en) * 2017-12-11 2021-10-19 Applied Materials, Inc. Cryogenically cooled rotatable electrostatic chuck
US11848177B2 (en) 2018-02-23 2023-12-19 Lam Research Corporation Multi-plate electrostatic chucks with ceramic baseplates
JP7134039B2 (ja) 2018-09-14 2022-09-09 東京エレクトロン株式会社 基板載置機構、成膜装置、および成膜方法
JP7210960B2 (ja) * 2018-09-21 2023-01-24 東京エレクトロン株式会社 真空処理装置及び基板搬送方法
JP7151368B2 (ja) * 2018-10-19 2022-10-12 東京エレクトロン株式会社 酸化処理モジュール、基板処理システム及び酸化処理方法
JP7233266B2 (ja) 2018-10-25 2023-03-06 東京エレクトロン株式会社 ステージ装置および処理装置
JP7224139B2 (ja) 2018-10-25 2023-02-17 東京エレクトロン株式会社 ステージ装置および処理装置
US11417504B2 (en) * 2018-10-25 2022-08-16 Tokyo Electron Limited Stage device and processing apparatus
WO2020167451A1 (en) 2019-02-12 2020-08-20 Lam Research Corporation Electrostatic chuck with ceramic monolithic body
CN113557475A (zh) * 2019-03-13 2021-10-26 Asml控股股份有限公司 用于光刻设备的静电夹具
JP7426842B2 (ja) * 2020-02-12 2024-02-02 東京エレクトロン株式会社 ステージ装置、給電機構、および処理装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58165462U (ja) * 1982-04-27 1983-11-04 ナイルス部品株式会社 シガレツトライタ−の異常過熱防止装置
JPH01116442U (zh) * 1988-02-01 1989-08-07
US5275683A (en) * 1991-10-24 1994-01-04 Tokyo Electron Limited Mount for supporting substrates and plasma processing apparatus using the same
US5348497A (en) * 1992-08-14 1994-09-20 Applied Materials, Inc. High voltage vaccum feed-through electrical connector
US5350479A (en) * 1992-12-02 1994-09-27 Applied Materials, Inc. Electrostatic chuck for high power plasma processing
JPH07161803A (ja) * 1993-12-08 1995-06-23 Tokyo Electron Ltd アルミニウム部材とポリベンズイミダゾール部材との接合方法、静電チャックの電極構造およびその製造方法
KR100260587B1 (ko) 1993-06-01 2000-08-01 히가시 데쓰로 정전척 및 그의 제조방법
US5822171A (en) * 1994-02-22 1998-10-13 Applied Materials, Inc. Electrostatic chuck with improved erosion resistance
US5691876A (en) 1995-01-31 1997-11-25 Applied Materials, Inc. High temperature polyimide electrostatic chuck
US5745332A (en) * 1996-05-08 1998-04-28 Applied Materials, Inc. Monopolar electrostatic chuck having an electrode in contact with a workpiece
JPH10303286A (ja) * 1997-02-25 1998-11-13 Applied Materials Inc 静電チャック及び半導体製造装置
JP3872256B2 (ja) * 2000-05-29 2007-01-24 京セラ株式会社 ウエハ加熱装置
JP4021661B2 (ja) * 2001-12-27 2007-12-12 株式会社巴川製紙所 静電チャック装置
JP4369765B2 (ja) 2003-07-24 2009-11-25 京セラ株式会社 静電チャック
JP4508990B2 (ja) * 2005-09-07 2010-07-21 株式会社巴川製紙所 給電コネクタ、及び当該給電コネクタを有する静電チャック装置
JP4803518B2 (ja) * 2006-04-06 2011-10-26 独立行政法人産業技術総合研究所 試料冷却装置
KR100884327B1 (ko) 2007-03-30 2009-02-18 주식회사 유진테크 써모커플 장치 및 기판처리장치
US20110164955A1 (en) * 2009-07-15 2011-07-07 Applied Materials,Inc. Processing chamber with translating wear plate for lift pin
JP6176771B2 (ja) 2010-12-28 2017-08-09 住友大阪セメント株式会社 静電チャック装置

Also Published As

Publication number Publication date
JP2015226010A (ja) 2015-12-14
TWI659497B (zh) 2019-05-11
JP6358856B2 (ja) 2018-07-18
TW201611178A (zh) 2016-03-16
KR101791302B1 (ko) 2017-10-27
US20150349668A1 (en) 2015-12-03
US9787222B2 (en) 2017-10-10
KR20150138015A (ko) 2015-12-09

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