SG10201500100TA - Pressure regulator and polishing apparatus having the pressure regulator - Google Patents

Pressure regulator and polishing apparatus having the pressure regulator

Info

Publication number
SG10201500100TA
SG10201500100TA SG10201500100TA SG10201500100TA SG10201500100TA SG 10201500100T A SG10201500100T A SG 10201500100TA SG 10201500100T A SG10201500100T A SG 10201500100TA SG 10201500100T A SG10201500100T A SG 10201500100TA SG 10201500100T A SG10201500100T A SG 10201500100TA
Authority
SG
Singapore
Prior art keywords
pressure regulator
polishing apparatus
regulator
pressure
polishing
Prior art date
Application number
SG10201500100TA
Inventor
Nobuyuki Takahashi
Toru Maruyama
Suguru Sakugawa
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201500100TA publication Critical patent/SG10201500100TA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/08—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving liquid or pneumatic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/7722—Line condition change responsive valves
    • Y10T137/7758—Pilot or servo controlled
    • Y10T137/7761—Electrically actuated valve

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Control Of Fluid Pressure (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
SG10201500100TA 2014-01-09 2015-01-07 Pressure regulator and polishing apparatus having the pressure regulator SG10201500100TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014002526A JP6085572B2 (en) 2014-01-09 2014-01-09 Pressure control apparatus and polishing apparatus provided with the pressure control apparatus

Publications (1)

Publication Number Publication Date
SG10201500100TA true SG10201500100TA (en) 2015-08-28

Family

ID=53614616

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201500100TA SG10201500100TA (en) 2014-01-09 2015-01-07 Pressure regulator and polishing apparatus having the pressure regulator

Country Status (6)

Country Link
US (1) US9370852B2 (en)
JP (1) JP6085572B2 (en)
KR (1) KR101711717B1 (en)
CN (1) CN104772691B (en)
SG (1) SG10201500100TA (en)
TW (1) TWI572446B (en)

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JP6491592B2 (en) * 2015-11-27 2019-03-27 株式会社荏原製作所 Calibration apparatus and calibration method
CN105773397B (en) * 2016-03-09 2017-09-29 天津华海清科机电科技有限公司 Chemically-mechanicapolish polish multi-region pressure On-line Control algorithm
JP2017185589A (en) * 2016-04-06 2017-10-12 株式会社荏原製作所 Substrate processing device
CN107813220A (en) * 2016-09-13 2018-03-20 清华大学 Pressure-loaded film
EP3318787A1 (en) * 2016-11-03 2018-05-09 VAT Holding AG Vacuum valve system for the controlled operation of a vacuum process
JP6823541B2 (en) * 2017-05-30 2021-02-03 株式会社荏原製作所 Calibration method and calibration program
JP7079164B2 (en) 2018-07-06 2022-06-01 株式会社荏原製作所 Board cleaning device and board cleaning method
CN112912209A (en) * 2018-10-25 2021-06-04 3M创新有限公司 Robotic paint repair system and method
US11731232B2 (en) * 2018-10-30 2023-08-22 Taiwan Semiconductor Manufacturing Company, Ltd. Irregular mechanical motion detection systems and method
TWI689678B (en) * 2019-03-07 2020-04-01 台灣氣立股份有限公司 Vacuum electronic control proportional valve
TWI689679B (en) * 2019-03-08 2020-04-01 台灣氣立股份有限公司 Vacuum large capacity electric control proportional valve
CN110497317B (en) * 2019-07-25 2024-05-03 杭州电子科技大学 Constant pressure device suitable for automatic polishing equipment
CN110883680B (en) * 2019-12-17 2021-08-10 杭州众硅电子科技有限公司 Polishing head pressure control device and method for chemical mechanical planarization device
JP7424322B2 (en) * 2021-01-19 2024-01-30 Smc株式会社 fluid pressure control device
CN113547437B (en) * 2021-08-09 2022-05-27 河南科技学院 Multifunctional grinding and polishing machine for laboratory
CN113894696B (en) * 2021-10-29 2023-01-24 北京烁科精微电子装备有限公司 Polishing monitoring device and polishing monitoring method
CN114166952B (en) * 2021-12-08 2023-08-29 北京晶亦精微科技股份有限公司 Adsorption detection device and adsorption detection method
CN116533127B (en) * 2023-07-06 2023-10-31 浙江晶盛机电股份有限公司 Polishing pressure adjusting method, polishing pressure adjusting device, computer equipment and storage medium

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JPS5919672A (en) * 1982-07-19 1984-02-01 Toshiba Corp Working pressure control device for polishing apparatus
US5799688A (en) * 1990-12-20 1998-09-01 Jetec Company Automatic flow control valve
JP3410513B2 (en) * 1993-06-30 2003-05-26 不二越機械工業株式会社 Wafer-polishing equipment with precise pressure control
US5762539A (en) * 1996-02-27 1998-06-09 Ebara Corporation Apparatus for and method for polishing workpiece
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US6857947B2 (en) * 2002-01-17 2005-02-22 Asm Nutool, Inc Advanced chemical mechanical polishing system with smart endpoint detection
TW556259B (en) * 2002-09-09 2003-10-01 Taiwan Semiconductor Mfg Method and system for controlling slurry flow rate using dual mode hybrid control
JP4718107B2 (en) * 2003-05-20 2011-07-06 株式会社荏原製作所 Substrate holding device and polishing device
AU2003250921A1 (en) 2003-07-09 2005-01-28 Peter Wolters Surface Technologies Gmbh And Co. Kg Holder for flat workpieces, in particular semiconductor wafers for mechanochemical polishing
JP4108023B2 (en) 2003-09-09 2008-06-25 株式会社荏原製作所 Pressure control system and polishing apparatus
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JP2007181893A (en) * 2006-01-06 2007-07-19 Komatsu Ltd Pressure control device on polishing device
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JP2013171088A (en) * 2012-02-17 2013-09-02 Hitachi High-Technologies Corp Proximity exposure apparatus, method for forming exposure light of proximity exposure apparatus, and method for manufacturing display panel substrate
JP5905359B2 (en) * 2012-07-23 2016-04-20 株式会社荏原製作所 Pressure control apparatus and polishing apparatus provided with the pressure control apparatus
TWM464315U (en) * 2013-06-20 2013-11-01 Wei Kuang Automation Co Ltd Adhesive supply pressure control device of hot melt adhesive

Also Published As

Publication number Publication date
CN104772691A (en) 2015-07-15
TW201532733A (en) 2015-09-01
TWI572446B (en) 2017-03-01
CN104772691B (en) 2017-10-13
JP6085572B2 (en) 2017-02-22
US20150224620A1 (en) 2015-08-13
KR101711717B1 (en) 2017-03-02
US9370852B2 (en) 2016-06-21
KR20150083432A (en) 2015-07-17
JP2015131351A (en) 2015-07-23

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