CN110883680B - Polishing head pressure control device and method for chemical mechanical planarization device - Google Patents
Polishing head pressure control device and method for chemical mechanical planarization device Download PDFInfo
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- CN110883680B CN110883680B CN201911303301.0A CN201911303301A CN110883680B CN 110883680 B CN110883680 B CN 110883680B CN 201911303301 A CN201911303301 A CN 201911303301A CN 110883680 B CN110883680 B CN 110883680B
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- 238000005498 polishing Methods 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 title claims description 17
- 239000000126 substance Substances 0.000 title claims description 17
- 238000009530 blood pressure measurement Methods 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 3
- 230000008569 process Effects 0.000 description 9
- 238000013459 approach Methods 0.000 description 4
- 230000004044 response Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
A first pressure sensor is arranged on an outlet gas path of a control valve, a second pressure sensor is arranged on an inlet gas path of an air bag cavity, a controller carries out real-time closed-loop operation according to pressure values fed back by the first pressure sensor and the second pressure sensor, the opening of the control valve is adjusted, and the gas pressure in the air bag cavity is adjusted. The invention can quickly respond and accurately control the pressure of the air bag cavity of the polishing head, avoid the virtual high of the outlet pressure of the control valve in the inflation stage, ensure the high-precision and low-error pressure control and realize the stable control of the pressure of the air bag cavity of the polishing head.
Description
Technical Field
The present invention relates to semiconductor devices, and more particularly, to a pressure control apparatus and method for a polishing head of a chemical mechanical planarization apparatus.
Background
A Chemical Mechanical Planarization (CMP) apparatus generally includes a semiconductor Equipment Front End Module (EFEM), a polishing unit, and a cleaning unit. In the working process of the existing polishing unit, a downward pressure is generated by inflating an air bag (Membrane) in a polishing head and acts on a polished wafer, so that the friction force between the wafer and a polishing pad can meet the process requirement.
In the prior art, an electric proportional valve is generally adopted to regulate the pressure of an air bag cavity in a polishing head, and a pressure sensor arranged at the outlet of the electric proportional valve is used as a feedback element in a closed loop, but because the air bag cavity is large in volume and the air bag deforms, the pressure at the outlet of the electric proportional valve is prematurely considered to reach the target pressure by an electric proportional valve controller and the pressure supply is stopped under the condition that the actual pressure of the air bag cavity cannot reach the target pressure. This results in a section of the pressure variation curve having a lower slope in the rising stage, which causes the pressure not to reach the target value in time in the actual process, thereby affecting the process, and causing the reduction of the working efficiency and the yield.
Disclosure of Invention
The invention provides polishing head pressure control equipment and a polishing head pressure control method for chemical mechanical planarization equipment, which can quickly respond and accurately control the pressure of an air bag cavity of a polishing head and solve the problem of slow pressure control flow response of the air bag cavity of the polishing head caused by the fact that the outlet pressure of an electric proportional valve is higher than the actual pressure of the air bag cavity.
In order to achieve the above object, the present invention provides a polishing head pressure control apparatus for a chemical mechanical planarization apparatus, the polishing head pressure control apparatus comprising:
the air source is connected with the air bag cavity of the polishing head through an air path and is used for providing inflation gas for the air bag cavity;
the control valve is arranged on an air path of the air source and the air bag cavity, the air flow in the air path can be controlled by adjusting the opening of the control valve, and the air pressure in the air bag cavity is further adjusted;
the first pressure sensor is arranged on an outlet gas path of the control valve and used for detecting the gas pressure in the gas path at the outlet of the control valve;
the second pressure sensor is arranged on an air path of an inlet of the air bag cavity and used for detecting the gas pressure in the air path at the inlet of the air bag cavity;
and the controller is in circuit connection with the control valve, the first pressure sensor and the second pressure sensor and is used for performing real-time closed-loop operation according to PID (proportion integration differentiation) algorithm according to pressure values fed back by the first pressure sensor and the second pressure sensor, adjusting the opening of the control valve and adjusting the gas pressure in the air bag cavity.
The invention also provides chemical mechanical planarization equipment which comprises a front-end module, a polishing unit and a cleaning unit, wherein the polishing unit comprises a polishing head, and the polishing head comprises the polishing head pressure control equipment.
The invention also provides a polishing head pressure control method for the chemical mechanical planarization equipment, wherein the controller performs PID closed-loop operation according to the pressure feedback value obtained by the first pressure sensor and/or the second pressure sensor and in combination with the pressure set value, and adjusts the opening of the control valve, so that the gas pressure in the air bag cavity is adjusted.
The pressure feedback value is as follows:
W＝a×W1+b×W2；
where W is the pressure feedback value, a is the weight of the first pressure sensor, W1 is the pressure measurement of the first pressure sensor, b is the weight of the second pressure sensor, and W2 is the pressure measurement of the second pressure sensor.
When | T-P |/T ≦ x%, a ═ 1 and b ═ 0, and when | T-P |/T > x%, a ═ 0 and b ═ 1;
wherein T is a pressure set value, P is a pressure value detected by the second pressure sensor, x is a set threshold value, a is the weight of the first pressure sensor, and b is the weight of the second pressure sensor.
When the absolute value of T-P/T is less than or equal to x%, a is 0.51-0.99, b is 0.01-0.49, when the absolute value of T-P/T is greater than x%, a is 0.01-0.49, and b is 0.51-0.99;
wherein T is a pressure set value, P is a pressure value detected by the second pressure sensor, x is a set threshold value, a is the weight of the first pressure sensor, and b is the weight of the second pressure sensor.
The invention can quickly respond and accurately control the pressure of the air bag cavity of the polishing head, avoid the virtual high of the outlet pressure of the control valve in the inflation stage, ensure the high-precision and low-error pressure control and realize the stable control of the pressure of the air bag cavity of the polishing head.
Drawings
Fig. 1 is a schematic structural view of a polishing head pressure control apparatus for a chemical mechanical planarization apparatus in one embodiment of the present invention.
Fig. 2 is a schematic structural view of a polishing head pressure control apparatus for a chemical mechanical planarization apparatus in another embodiment of the present invention.
Fig. 3 is a schematic of the closed loop control of the present invention.
Fig. 4 is a flowchart of a method for controlling pressure of a polishing head of a chemical mechanical planarization apparatus, according to an embodiment of the present invention.
Detailed Description
The preferred embodiment of the present invention will be described in detail below with reference to fig. 1 to 4.
In order to solve the problem that the pressure control flow path of the air bag cavity of the polishing head is slow in response because the outlet pressure of the electric proportional valve is higher than the actual pressure of the air bag cavity, the pressure sensor is additionally arranged on the air path between the air source and the air bag cavity of the polishing head and is arranged close to the air bag cavity, so that the actual gas pressure in the air bag cavity of the polishing head can be better monitored, and a more accurate monitoring result is provided for the electric proportional valve.
As shown in fig. 1, in one embodiment of the present invention, there is provided a polishing head pressure control apparatus for a chemical mechanical planarization apparatus, the polishing head pressure control apparatus comprising:
the gas source 1 is connected with the air bag cavity 7 of the polishing head through a gas path and is used for providing inflation gas for the air bag cavity 7;
the electric proportional valve 2 comprises a built-in controller 3, a control valve 4 and a first pressure sensor 5, the controller 3 is connected with the control valve 4 and the first pressure sensor 5 through a circuit, the control valve 4 is arranged on a gas path of the gas source 1 and the air bag containing cavity 7, the gas flow in the gas path can be controlled by adjusting the opening degree of the control valve 4, so that the gas quantity entering the air bag containing cavity 7 is controlled, the gas pressure in the air bag containing cavity 7 is further adjusted, the first pressure sensor 5 is arranged on an outlet gas path of the control valve 4, and is mainly used for detecting the gas pressure in the gas path at the outlet of the control valve 4 and transmitting the detected gas pressure value to the controller 3;
and the second pressure sensor 6 is arranged on an inlet gas path of the air bag cavity 7 and is in circuit connection with the controller 3 in the electric proportional valve 2, and the second pressure sensor 6 is used for detecting the gas pressure in the gas path at the inlet of the air bag cavity 7 and transmitting the detected gas pressure value to the controller 3.
The controller 3 arranged in the electric proportional valve 2 performs closed-loop control according to the pressure values fed back by the first pressure sensor 5 and the second pressure sensor 6 and according to a PID algorithm, and adjusts the opening degree of the control valve 4, so that the gas pressure in the air bag cavity 7 can be adjusted better and more accurately.
In the embodiment shown in fig. 1, the controller 3, the control valve 4 and the first pressure sensor 5 are packaged together to form the electric proportional valve 2. The controller 3, the control valve 4 and the first pressure sensor 5 may also be relatively independent devices.
In another embodiment of the present invention, as shown in fig. 2, there is provided another polishing head pressure control apparatus for a chemical mechanical planarization apparatus, the polishing head pressure control apparatus comprising:
the gas source 1 is connected with the air bag cavity 7 of the polishing head through a gas path and is used for providing inflation gas for the air bag cavity 7;
the control valve 4 is arranged on a gas path between the gas source 1 and the air bag cavity 7, the control valve 4 is a valve without closed loop operation, the valve only controls the opening according to an electric signal in proportion, and the gas flow in the gas path can be controlled by adjusting the opening of the control valve 4, so that the gas quantity entering the air bag cavity 7 is controlled, and the gas pressure in the air bag cavity 7 is further adjusted;
the first pressure sensor 5 is arranged on an outlet gas path of the control valve 4 and used for detecting the gas pressure in the gas path at the outlet of the control valve 4 and transmitting the detected gas pressure value to the controller 3;
the second pressure sensor 6 is arranged on an air inlet path of the air bag cavity 7 and used for detecting the air pressure in the air path at the inlet of the air bag cavity 7 and transmitting the detected air pressure value to the controller 3;
and the controller 3 is in circuit connection with the control valve 4, the first pressure sensor 5 and the second pressure sensor 6, and is used for performing real-time closed-loop operation according to pressure values fed back by the first pressure sensor 5 and the second pressure sensor 6, and adjusting the opening degree of the control valve 4, so that the gas pressure in the air bag cavity 7 can be adjusted better and more accurately.
In this embodiment, the controller 3 may adopt an industrial personal computer, and may also be a PLC or a single chip microcomputer.
As shown in figure 3, the invention adopts two pressure sensors to simultaneously obtain the real-time pressure at two ends of the gas path of the gas source and the air bag cavity, the pressure value of the gas detected by the pressure sensors is used as a feedback value and is fed back to the controller, the controller carries out closed-loop control according to a PID algorithm, judges whether the pressure of the current air bag cavity is close to a set value or not according to the feedback value, and correspondingly controls the opening of a control valve in the gas path, thereby controlling the gas transmission amount of the gas path and the on-off of the gas path. If the pressure of the current air bag cavity is judged to be far away from the set value according to the feedback value, the controller controls the opening of the control valve to be increased, and the gas delivery to the air bag cavity is increased; if the pressure of the current air bag cavity is judged to be close to the set value according to the feedback value, the controller controls the control valve to reduce the opening degree; and if the pressure of the current air bag cavity is judged to reach the set value according to the feedback value, the controller controls the control valve to close the air path for conveying. The pressure at the outlet of the control valve in the inflation stage is prevented from being falsely high by a closed-loop control circuit with the reading of a pressure sensor arranged at the inlet of the air bag cavity as a feedback value, the final high-precision and low-error pressure control is ensured by the closed-loop control circuit with the reading of the pressure sensor arranged at the outlet of the control valve as the feedback value, and the feedback value of the closed-loop control circuit is flexibly switched between the two sensors according to the relation between the current pressure and the set pressure.
As shown in fig. 4, in the above embodiment of the present invention, there is provided a polishing head pressure control method for a chemical mechanical planarization apparatus, comprising the steps of:
step S1, the upper computer sends a pressure set value to the controller;
step S2, the controller receives pressure values detected by the first pressure sensor and the second pressure sensor, the controller judges whether the pressure value detected by the second pressure sensor is close to a pressure set value, if so, the step S3 is carried out, and if not, the step S4 is carried out;
in this embodiment, assuming that the pressure set value is T and the pressure value detected by the second pressure sensor is P, if the absolute value of the difference between the pressure set value and the pressure value detected by the second pressure sensor is smaller than a certain set threshold, it may be determined that the real-time pressure value at that time is close to the pressure set value;
that is, | T-P |/T ≦ x%, where x is a set threshold, which may be set to 10, or 20, etc., and is set according to specific needs;
step S3, the controller uses the pressure value detected by the first pressure sensor as a feedback value, continues to the next pressure setting, and jumps to step S1;
in step S4, the controller uses the pressure value detected by the second pressure sensor as a feedback value, and jumps to step S2.
Because the second pressure sensor is arranged on the air inlet path of the air bag cavity, the pressure reading of the second pressure sensor can accurately reflect the real pressure in the cavity of the air bag cavity, and the controller judges whether the pressure in the cavity of the air bag cavity is close to the pressure set value or not according to the pressure reading of the second pressure sensor. If the current pressure of the cavity of the air bag cavity is greatly different from the pressure set value, the feedback value in the closed-loop control circuit is dominated by the pressure reading of the second pressure sensor before the pressure set value is approached, and the feedback value in the closed-loop control circuit is converted into the pressure reading of the first pressure sensor from the pressure reading of the second pressure sensor after the pressure reading of the second pressure sensor is approached to the pressure set value.
In another embodiment of the invention, after the upper computer issues a pressure set value to the controller, the controller receives pressure values detected by the first pressure sensor and the second pressure sensor, the controller still uses the pressure measured value of the second pressure sensor as the pressure value in the cavity of the air bag cavity, and judges whether the pressure value detected by the second pressure sensor is close to the pressure set value, but then the controller does not use the measured value of a single pressure sensor as a feedback value, but integrates the measured values of the first pressure sensor and the second pressure sensor to match different weights, so as to form a total feedback value.
The total feedback value is as follows: w ═ a × W1+ b × W2;
where W is the total feedback value, a is the weight of the first pressure sensor, W1 is the pressure measurement of the first pressure sensor, b is the weight of the second pressure sensor, W2 is the pressure measurement of the second pressure sensor, and a + b is 1.
If the difference between the current cavity pressure of the air bag cavity and the pressure set value is large, before the current cavity pressure of the air bag cavity approaches the pressure set value, the weight of the value of the second pressure sensor accounts for the main part, the weight b of the second pressure sensor is 0.51-0.99, after the current cavity pressure of the air bag cavity approaches the pressure set value, the weight between the first pressure sensor and the second pressure sensor has a switching process (the switching process is a process of eliminating the length between a and b, but a + b is maintained to be 1 in the switching process) in several control cycles, so that the influence on the control stability caused by switching is reduced, then the weight of the value of the first pressure sensor accounts for the main part, the weight a of the first pressure sensor is 0.51-0.99, and the pressure setting is continued until the next time.
The invention is based on the pressure control scheme of the closed-loop control circuit of the two sensors, and the purpose of shortening the control period is achieved by changing the influence of the respective feedback values of the two sensors on the closed-loop control circuit according to the current pressure. Before the cavity pressure of an air bag containing cavity of a polishing head approaches a set value, closed-loop control is performed on the pressure mainly by taking the reading of a pressure sensor arranged on an inlet air path of the air bag containing cavity as a feedback value, so that the influence caused by the fact that the outlet pressure of a control valve is inconsistent with the actual cavity pressure of the air bag containing cavity in the control process is avoided, and after the cavity pressure of the air bag containing cavity approaches the set value, a closed-loop circuit adjusts the pressure by taking the reading of the pressure sensor arranged on the outlet air path of the control valve as the feedback value, so that the stable control on the pressure is realized.
The invention has the following advantages:
1. the controller is simultaneously connected with the two pressure sensors, so that the controller can simultaneously acquire real-time pressures at two ends in the gas circuit;
2. the pressure at the outlet of the control valve is prevented from being high in the inflation stage through a closed-loop control circuit in which the reading of a pressure sensor arranged on an inlet gas path of the air bag cavity is a feedback value;
3. the final high-precision and low-error pressure control is ensured through a closed-loop control loop which takes the reading of a pressure sensor arranged on an outlet gas path of the control valve as a feedback value;
4. according to the relation between the current pressure of the cavity of the air bag cavity and the set pressure value, the feedback value of the closed-loop control circuit is flexibly switched between the two pressure sensors, and the stable control of the pressure is realized.
While the present invention has been described in detail with reference to the preferred embodiments, it should be understood that the above description should not be taken as limiting the invention. Various modifications and alterations to this invention will become apparent to those skilled in the art upon reading the foregoing description. Accordingly, the scope of the invention should be determined from the following claims.
Claims (3)
1. A polishing head pressure control apparatus for a chemical mechanical planarization apparatus, the polishing head pressure control apparatus comprising:
the air source is connected with the air bag cavity of the polishing head through an air path and is used for providing inflation gas for the air bag cavity;
the control valve is arranged on an air path of the air source and the air bag cavity, the air flow in the air path can be controlled by adjusting the opening of the control valve, and the air pressure in the air bag cavity is further adjusted;
the first pressure sensor is arranged on an outlet gas path of the control valve and used for detecting the gas pressure in the gas path at the outlet of the control valve;
the second pressure sensor is arranged on an air path of an inlet of the air bag cavity and used for detecting the gas pressure in the air path at the inlet of the air bag cavity;
the controller is connected with the control valve, the first pressure sensor and the second pressure sensor in a circuit and used for carrying out real-time closed-loop operation according to PID algorithm according to pressure values fed back by the first pressure sensor and the second pressure sensor, adjusting the opening of the control valve and adjusting the gas pressure in the air bag cavity;
when the absolute value of T-P/T is less than or equal to x%, a is 0.51-0.99, b is 0.01-0.49, when the absolute value of T-P/T is greater than x%, a is 0.01-0.49, and b is 0.51-0.99;
wherein T is a pressure set value, P is a pressure value detected by the second pressure sensor, x is a set threshold value, a is the weight of the first pressure sensor, and b is the weight of the second pressure sensor.
2. A chemical mechanical planarization apparatus comprising a front end module, a polishing unit comprising a polishing head, and a cleaning unit, wherein the polishing head comprises a polishing head pressure control apparatus according to claim 1.
3. A polishing head pressure control method of a polishing head pressure control apparatus for a chemical mechanical planarization apparatus as claimed in claim 1, wherein the controller performs a PID closed loop operation in combination with a pressure set value according to a pressure feedback value obtained by the first pressure sensor and/or the second pressure sensor, and adjusts an opening degree of the control valve, thereby adjusting a gas pressure in the chamber of the air bag;
the pressure feedback value is as follows:
W＝a×W1+b×W2；
where W is the pressure feedback value, a is the weight of the first pressure sensor, W1 is the pressure measurement of the first pressure sensor, b is the weight of the second pressure sensor, and W2 is the pressure measurement of the second pressure sensor.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911303301.0A CN110883680B (en) | 2019-12-17 | 2019-12-17 | Polishing head pressure control device and method for chemical mechanical planarization device |
| PCT/CN2020/106752 WO2021120635A1 (en) | 2019-12-17 | 2020-08-04 | Polishing head pressure control device and method for chemical mechanical planarization device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911303301.0A CN110883680B (en) | 2019-12-17 | 2019-12-17 | Polishing head pressure control device and method for chemical mechanical planarization device |
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| CN110883680A CN110883680A (en) | 2020-03-17 |
| CN110883680B true CN110883680B (en) | 2021-08-10 |
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| WO (1) | WO2021120635A1 (en) |
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| CN110883680B (en) * | 2019-12-17 | 2021-08-10 | 杭州众硅电子科技有限公司 | Polishing head pressure control device and method for chemical mechanical planarization device |
| CN114166952B (en) * | 2021-12-08 | 2023-08-29 | 北京晶亦精微科技股份有限公司 | Adsorption detection device and adsorption detection method |
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| JPH06226612A (en) * | 1993-01-28 | 1994-08-16 | Toshiba Corp | Polishing tool |
| US5762546A (en) * | 1995-12-13 | 1998-06-09 | Coburn Optical Industries, Inc. | Pneumatically assisted conformal tool for an ophthalmic lens finer/polisher |
| JP2000288926A (en) * | 1999-04-08 | 2000-10-17 | Fujikoshi Mach Corp | Adhesive pressing device and wafer adhering device |
| KR100835834B1 (en) * | 2003-12-30 | 2008-06-05 | 동부일렉트로닉스 주식회사 | The Wafer Align Apparatus of Chemical Mechanical Polisher |
| CN101758445B (en) * | 2009-12-17 | 2011-11-23 | 浙江工业大学 | Pulse controlling system for air bag polishing |
| CN102133730B (en) * | 2011-01-06 | 2012-09-05 | 清华大学 | Multi-region air pressure control system for CMP (Chemical Mechanical Polishing) head |
| CN102658517B (en) * | 2012-05-07 | 2014-07-02 | 浙江工业大学 | Contact force real-time control system for airbag polishing |
| JP5905359B2 (en) * | 2012-07-23 | 2016-04-20 | 株式会社荏原製作所 | Pressure control apparatus and polishing apparatus provided with the pressure control apparatus |
| CN203070122U (en) * | 2013-01-18 | 2013-07-17 | 中山华帝燃具股份有限公司 | Numerical control gas supply control device for testing gas water heater |
| CN203343870U (en) * | 2013-05-20 | 2013-12-18 | 洛阳单晶硅有限责任公司 | Inflating type air bag pressure head |
| JP6085572B2 (en) * | 2014-01-09 | 2017-02-22 | 株式会社荏原製作所 | Pressure control apparatus and polishing apparatus provided with the pressure control apparatus |
| JP6234325B2 (en) * | 2014-05-23 | 2017-11-22 | 株式会社荏原製作所 | Pressure calibration jig and substrate processing apparatus |
| CN104369064B (en) * | 2014-11-20 | 2017-01-25 | 苏州大学 | Air bag polishing tool and system and method |
| CN106806040B (en) * | 2015-11-27 | 2019-07-12 | 北京纳通科技集团有限公司 | A kind of Invasive lumbar fusion device implantation control device |
| CN106670899B (en) * | 2016-10-28 | 2019-03-15 | 中国电子科技集团公司第五十四研究所 | A kind of gasbag-type electrochemical mechanical polishing head, burnishing device and polishing method |
| JP7107648B2 (en) * | 2017-07-11 | 2022-07-27 | 株式会社堀場エステック | FLUID CONTROL DEVICE, FLUID CONTROL SYSTEM, FLUID CONTROL METHOD, AND FLUID CONTROL DEVICE PROGRAM |
| CN108481189B (en) * | 2018-05-08 | 2019-09-24 | 厦门理工学院 | It can be from the air bag polishing head of air pressure adjusting |
| CN110543192A (en) * | 2018-10-31 | 2019-12-06 | 北京七星华创流量计有限公司 | mass flow control method and device based on pressure detection |
| CN109635771A (en) * | 2018-12-21 | 2019-04-16 | 邱礼璇 | Driver's anti-interference system |
| CN109685953B (en) * | 2019-01-08 | 2021-02-26 | 黄河水利职业技术学院 | Face recognition security control method |
| CN109976419B (en) * | 2019-02-27 | 2021-01-01 | 武汉中电节能有限公司 | Automatic control system and method for temperature and pressure reduction of regional cooling and heating steam |
| CN110883680B (en) * | 2019-12-17 | 2021-08-10 | 杭州众硅电子科技有限公司 | Polishing head pressure control device and method for chemical mechanical planarization device |
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2019
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- 2020-08-04 WO PCT/CN2020/106752 patent/WO2021120635A1/en active Application Filing
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| CN110883680A (en) | 2020-03-17 |
| WO2021120635A1 (en) | 2021-06-24 |
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