SG10201406781WA - Method for manufacturing space transformer by using carrier substrate made for chip package and provided with elongated contacts - Google Patents

Method for manufacturing space transformer by using carrier substrate made for chip package and provided with elongated contacts

Info

Publication number
SG10201406781WA
SG10201406781WA SG10201406781WA SG10201406781WA SG10201406781WA SG 10201406781W A SG10201406781W A SG 10201406781WA SG 10201406781W A SG10201406781W A SG 10201406781WA SG 10201406781W A SG10201406781W A SG 10201406781WA SG 10201406781W A SG10201406781W A SG 10201406781WA
Authority
SG
Singapore
Prior art keywords
carrier substrate
chip package
substrate made
space transformer
manufacturing space
Prior art date
Application number
SG10201406781WA
Other languages
English (en)
Inventor
Chung-Tse Lee
Chien-Chou Wu
Tsung-Yi Chen
Original Assignee
Mpi Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mpi Corp filed Critical Mpi Corp
Publication of SG10201406781WA publication Critical patent/SG10201406781WA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/20—Modifications of basic electric elements for use in electric measuring instruments; Structural combinations of such elements with such instruments
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/143—Masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0574—Stacked resist layers used for different processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
SG10201406781WA 2013-10-22 2014-10-20 Method for manufacturing space transformer by using carrier substrate made for chip package and provided with elongated contacts SG10201406781WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW102138165A TWI541959B (zh) 2013-10-22 2013-10-22 And a space converter for a wafer carrier for a wafer having a long strip contact is used And its manufacturing method

Publications (1)

Publication Number Publication Date
SG10201406781WA true SG10201406781WA (en) 2015-05-28

Family

ID=52339696

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201406781WA SG10201406781WA (en) 2013-10-22 2014-10-20 Method for manufacturing space transformer by using carrier substrate made for chip package and provided with elongated contacts

Country Status (5)

Country Link
US (1) US9648757B2 (zh)
JP (1) JP3195187U (zh)
CN (1) CN104569514B (zh)
SG (1) SG10201406781WA (zh)
TW (1) TWI541959B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102179035B1 (ko) * 2014-03-07 2020-11-16 삼성전자주식회사 반도체 장치
TWI713807B (zh) 2016-12-16 2020-12-21 義大利商探針科技公司 具有增進的頻率性質的測試頭
US10886245B2 (en) * 2019-05-30 2021-01-05 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor structure, 3DIC structure and method of fabricating the same

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6674156B1 (en) * 2001-02-09 2004-01-06 National Semiconductor Corporation Multiple row fine pitch leadless leadframe package with use of half-etch process
US20030150640A1 (en) * 2002-02-14 2003-08-14 Crippen Warren Stuart Silicon space transformer and method of manufacturing same
TWI231028B (en) * 2004-05-21 2005-04-11 Via Tech Inc A substrate used for fine-pitch semiconductor package and a method of the same
US7459795B2 (en) * 2004-08-19 2008-12-02 Formfactor, Inc. Method to build a wirebond probe card in a many at a time fashion
TWI261329B (en) * 2005-03-09 2006-09-01 Phoenix Prec Technology Corp Conductive bump structure of circuit board and method for fabricating the same
TWI292296B (en) * 2006-01-27 2008-01-01 Au Optronics Corp The fpc having next door to pads can prevent a short circuit
KR100609652B1 (ko) * 2006-02-16 2006-08-08 주식회사 파이컴 공간변형기와 상기 공간변형기의 제조방법 및 상기공간변형기를 갖는 프로브 카드
US7425837B2 (en) * 2006-05-18 2008-09-16 Keithley Instruments, Inc. Spatial transformer for RF and low current interconnect
TWI322494B (en) * 2006-10-20 2010-03-21 Ind Tech Res Inst Electrical package, and contact structure and fabricating method thereof
TWI342952B (en) * 2007-10-09 2011-06-01 Ind Tech Res Inst Improved vertical probe card and space transformer design method
US8033012B2 (en) * 2008-03-07 2011-10-11 Taiwan Semiconductor Manufacturing Co., Ltd. Method for fabricating a semiconductor test probe card space transformer
KR100951344B1 (ko) * 2008-03-25 2010-04-08 주식회사 아이엠텍 프로브 카드, 프로브 카드용 스페이스 트랜스포머 및스페이스 트랜스포머 제조 방법
JP5121530B2 (ja) * 2008-03-27 2013-01-16 京セラ株式会社 基板、プローブカード・アセンブリ用基板および基板の製造方法
JP4759041B2 (ja) * 2008-12-04 2011-08-31 太陽誘電株式会社 電子部品内蔵型多層基板
KR101033400B1 (ko) * 2009-06-05 2011-05-09 남주한 반도체 기판의 전기적 특성 검사 장치용 프로브 카드의 공간 변형기 및 이의 제작 방법
US8430676B2 (en) * 2009-08-10 2013-04-30 Sv Probe Pte. Ltd. Modular space transformer for fine pitch vertical probing applications
KR20110020098A (ko) * 2009-08-21 2011-03-02 주식회사 메카로닉스 프로브 카드용 스페이스 트랜스포머 및 그 제조방법
KR101121644B1 (ko) * 2009-09-17 2012-02-28 삼성전기주식회사 프로브 카드용 공간 변환기 및 공간 변환기의 복구 방법
KR20120095657A (ko) * 2011-02-21 2012-08-29 삼성전기주식회사 프로브 카드용 ＳＴＦ(Ｓｐａｃｅ Ｔｒａｎｓｆｏｒｍｅｒ) 기판
CN102914673B (zh) * 2011-08-03 2015-09-30 旺矽科技股份有限公司 探针测试装置
KR20130062720A (ko) * 2011-12-05 2013-06-13 삼성전기주식회사 기판 및 그 제조방법, 그리고 프로브 카드
CN102692530A (zh) * 2012-06-26 2012-09-26 日月光半导体制造股份有限公司 探针结构与薄膜式探针的制造方法

Also Published As

Publication number Publication date
CN104569514A (zh) 2015-04-29
TWI541959B (zh) 2016-07-11
US20150107102A1 (en) 2015-04-23
TW201517227A (zh) 2015-05-01
JP3195187U (ja) 2015-01-08
CN104569514B (zh) 2017-10-03
US9648757B2 (en) 2017-05-09

Similar Documents

Publication Publication Date Title
GB2520149B (en) Die package with superposer substrate for passive components
HK1214408A1 (zh) 半導體裝置及其製造方法
EP3018696B8 (en) Manufacturing method for semiconductor substrate
SG10201911825SA (en) Insulating film, method for manufacturing semiconductor device, and semiconductor device
HK1204388A1 (zh) 半導體發光裝置及其製造方法
EP2930741A4 (en) SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT
EP2978018A4 (en) METHOD FOR PRODUCING A CURRENT MODULE SUBSTRATE
EP2836056A4 (en) METHOD FOR PRODUCING A HEAT-DISABLE PLATE
EP2908353A4 (en) OPTICAL SUBSTRATE, LIGHT-EMITTING SEMICONDUCTOR ELEMENT AND MANUFACTURING METHOD THEREFOR
GB201604510D0 (en) LED package and manufacturing method therefor
EP2833405A4 (en) SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF
EP3058586A4 (en) Integrated circuit package substrate
EP2988338A4 (en) LIGHT RECEPTION SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING THE SAME
EP2960925A4 (en) COMPOSITE SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
TWI563540B (en) Semiconductor device manufacturing method
SG11201602916VA (en) Towers for substrate carriers
EP2966679A4 (en) METHOD FOR PRODUCING A CURRENT MODULE SUBSTRATE
TWI560906B (en) Semiconductor light emitting device and method for manufacturing the same
HK1219347A1 (zh) 半導體裝置及其製造方法
EP2955748A4 (en) SEMICONDUCTOR COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
EP2913843A4 (en) METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
SG11201508291QA (en) Semiconductor device and method for manufacturing semiconductor device
GB2511418B (en) Substrate carrier
EP2919273A4 (en) METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT
SG11201510008UA (en) Semiconductor device and manufacturing method therefor