SG10201401753TA - Separate test electronics and blower modules in an apparatus for testing an integrated circuit - Google Patents

Separate test electronics and blower modules in an apparatus for testing an integrated circuit

Info

Publication number
SG10201401753TA
SG10201401753TA SG10201401753TA SG10201401753TA SG10201401753TA SG 10201401753T A SG10201401753T A SG 10201401753TA SG 10201401753T A SG10201401753T A SG 10201401753TA SG 10201401753T A SG10201401753T A SG 10201401753TA SG 10201401753T A SG10201401753T A SG 10201401753TA
Authority
SG
Singapore
Prior art keywords
testing
integrated circuit
separate test
test electronics
blower modules
Prior art date
Application number
SG10201401753TA
Other languages
English (en)
Inventor
David S Hendrickson
Jovan Jovanovic
Ii Donald P Richmond
William D Barraclough
Original Assignee
Aehr Test Systems
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aehr Test Systems filed Critical Aehr Test Systems
Publication of SG10201401753TA publication Critical patent/SG10201401753TA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2862—Chambers or ovens; Tanks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
SG10201401753TA 2009-05-07 2010-05-05 Separate test electronics and blower modules in an apparatus for testing an integrated circuit SG10201401753TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/437,465 US7969175B2 (en) 2009-05-07 2009-05-07 Separate test electronics and blower modules in an apparatus for testing an integrated circuit

Publications (1)

Publication Number Publication Date
SG10201401753TA true SG10201401753TA (en) 2014-08-28

Family

ID=43050438

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201401753TA SG10201401753TA (en) 2009-05-07 2010-05-05 Separate test electronics and blower modules in an apparatus for testing an integrated circuit
SG2011081502A SG175902A1 (en) 2009-05-07 2010-05-05 Separate test electronics and blower modules in an apparatus for testing an integrated circuit

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG2011081502A SG175902A1 (en) 2009-05-07 2010-05-05 Separate test electronics and blower modules in an apparatus for testing an integrated circuit

Country Status (5)

Country Link
US (2) US7969175B2 (fr)
KR (2) KR101710336B1 (fr)
SG (2) SG10201401753TA (fr)
TW (2) TWI484199B (fr)
WO (1) WO2010129688A1 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006116767A1 (fr) 2005-04-27 2006-11-02 Aehr Test Systems Appareil de test de dispositifs electroniques
US7800382B2 (en) 2007-12-19 2010-09-21 AEHR Test Ststems System for testing an integrated circuit of a device and its method of use
US8030957B2 (en) 2009-03-25 2011-10-04 Aehr Test Systems System for testing an integrated circuit of a device and its method of use
US8547123B2 (en) * 2009-07-15 2013-10-01 Teradyne, Inc. Storage device testing system with a conductive heating assembly
US10035224B2 (en) 2012-06-19 2018-07-31 Dell Products L.P. Systems and methods for cooling an information handling system and components thereof
FR3025899B1 (fr) * 2014-09-11 2016-11-04 Bibench Systems / Charlu Sas Dispositif de regulation de la temperature d’un module de pilotage d’un composant electronique
US10230186B2 (en) * 2015-06-01 2019-03-12 Molex, Llc Connector with dual card slots
KR20180101476A (ko) 2016-01-08 2018-09-12 에어 테스트 시스템즈 일렉트로닉스 테스터 내의 디바이스들의 열 제어를 위한 방법 및 시스템
JP7164539B2 (ja) 2017-03-03 2022-11-01 エイアー テスト システムズ 電子試験器
KR102511698B1 (ko) 2017-11-27 2023-03-20 삼성전자주식회사 반도체 패키지의 신호 속도 테스트 장치
JP7341921B2 (ja) 2020-02-20 2023-09-11 株式会社東芝 空調装置及びエージング方法
CN116457670A (zh) 2020-10-07 2023-07-18 雅赫测试系统公司 电子测试器
CN114784583B (zh) * 2022-06-22 2022-08-26 中国飞机强度研究所 空天飞机热试验测量用多响应信号转接输出系统及方法

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US3149897A (en) 1961-08-29 1964-09-22 Hans G Martineck Printed cable connector
US3482201A (en) * 1967-08-29 1969-12-02 Thomas & Betts Corp Controlled impedance connector
US4298237A (en) 1979-12-20 1981-11-03 Bell Telephone Laboratories, Incorporated Printed wiring board interconnection apparatus
US4400049A (en) * 1981-08-12 1983-08-23 Ncr Corporation Connector for interconnecting circuit boards
US4591217A (en) * 1983-08-29 1986-05-27 Gte Communication Systems Corporation Low insertion force connection arrangement
US4582386A (en) * 1984-11-01 1986-04-15 Elfab Corp. Connector with enlarged power contact
US4995814A (en) * 1989-12-15 1991-02-26 Amp Incorporated Connector for mating blade-shaped members
US4981449A (en) * 1990-04-27 1991-01-01 Amp Incorporated Connector for mating multi-layer blade-shaped members
US6203582B1 (en) * 1996-07-15 2001-03-20 Semitool, Inc. Modular semiconductor workpiece processing tool
US5814733A (en) * 1996-09-12 1998-09-29 Motorola, Inc. Method of characterizing dynamics of a workpiece handling system
US5928036A (en) * 1997-10-30 1999-07-27 The Whitaker Corporation Dual row memory card connector
US20010012726A1 (en) * 1999-10-14 2001-08-09 O'neal Sean P. Stacked module connector
US6358061B1 (en) * 1999-11-09 2002-03-19 Molex Incorporated High-speed connector with shorting capability
DE10042224C2 (de) * 2000-08-28 2003-09-25 Infineon Technologies Ag Modultestsockel für Prüfadapter
US6472895B2 (en) * 2000-12-06 2002-10-29 Advanced Micro Devices, Inc. Method and system for adapting burn-in boards to multiple burn-in systems
US7385385B2 (en) * 2001-10-03 2008-06-10 Nextest Systems Corporation System for testing DUT and tester for use therewith
US20030112025A1 (en) * 2001-12-13 2003-06-19 Harold E. Hamilton Temperature control system for burn-in boards
US6628520B2 (en) * 2002-02-06 2003-09-30 Hewlett-Packard Development Company, L.P. Method, apparatus, and system for cooling electronic components
US6815966B1 (en) * 2002-06-27 2004-11-09 Aehr Test Systems System for burn-in testing of electronic devices
JP3657250B2 (ja) * 2002-09-03 2005-06-08 ホシデン株式会社 コネクタ
US7111211B1 (en) * 2003-05-12 2006-09-19 Kingston Technology Corp. Efficient air-flow loop through dual burn-in chambers with removable pattern-generator boards for memory-module environmental testing
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Also Published As

Publication number Publication date
TWI484199B (zh) 2015-05-11
KR20170021920A (ko) 2017-02-28
US8986048B2 (en) 2015-03-24
SG175902A1 (en) 2011-12-29
KR101710336B1 (ko) 2017-02-27
US20100283475A1 (en) 2010-11-11
WO2010129688A1 (fr) 2010-11-11
US20110256774A1 (en) 2011-10-20
US7969175B2 (en) 2011-06-28
TW201115164A (en) 2011-05-01
KR101821531B1 (ko) 2018-01-23
TWI519792B (zh) 2016-02-01
KR20120027310A (ko) 2012-03-21
TW201527762A (zh) 2015-07-16

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