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株式会社アドバンテスト |
Testing device and testing method
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2009-11-02 |
2013-06-18 |
Apple Inc. |
High-speed memory connector
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2010-04-30 |
2016-07-20 |
삼성전자주식회사 |
Target device providing debugging functionality and test system comprising the same
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2010-05-07 |
2012-10-02 |
Dell Products L.P. |
Processor loading system including a heat dissipater
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2010-07-12 |
2011-11-15 |
Tyco Electronics Corporation |
Edge connectors having stamped signal contacts
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2010-09-24 |
2013-06-25 |
Ati Technologies Ulc |
Stacked semiconductor chip device with thermal management
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2010-11-30 |
2014-06-01 |
King Yuan Electronics Co Ltd |
Wafer inspection system
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2010-12-07 |
2013-06-18 |
Centipede Systems, Inc. |
Socket cartridge and socket cartridge assembly
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2011-03-08 |
2012-09-18 |
삼성전자주식회사 |
Test interface board and test system including the same
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2011-08-24 |
2014-04-29 |
Freescale Semiconductor, Inc. |
Method and system for physical verification using network segment current
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2012-06-26 |
2014-01-06 |
삼성전자주식회사 |
Test interface board and test system
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2012-06-29 |
2014-01-03 |
Eles Semiconductor Equipment S.P.A. |
Test board with local thermal conditioning elements
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2013-11-21 |
2015-06-17 |
株式会社東京精密 |
Prober
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2014-02-19 |
2019-05-21 |
Advantest Corporation |
Integrated cooling system for electronics testing apparatus
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2014-02-21 |
2017-03-14 |
Sensata Technologies, Inc. |
Package on package thermal forcing device
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2016-03-18 |
2019-01-09 |
株式会社東京精密 |
Prober
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2016-06-13 |
2018-03-06 |
Qorvo Us, Inc. |
Substrate with integrated heat spreader
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