SG101924A1 - Composite material used in making printed wiring boards - Google Patents

Composite material used in making printed wiring boards

Info

Publication number
SG101924A1
SG101924A1 SG9903706A SG1999003706A SG101924A1 SG 101924 A1 SG101924 A1 SG 101924A1 SG 9903706 A SG9903706 A SG 9903706A SG 1999003706 A SG1999003706 A SG 1999003706A SG 101924 A1 SG101924 A1 SG 101924A1
Authority
SG
Singapore
Prior art keywords
composite material
printed wiring
material used
wiring boards
making printed
Prior art date
Application number
SG9903706A
Other languages
English (en)
Inventor
Kataoka Takashi
Hirasawa Yutaka
Yamamoto Takuya
Iwakiri Kenichiro
Higuchi Tsutomu
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of SG101924A1 publication Critical patent/SG101924A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
SG9903706A 1998-10-19 1999-07-16 Composite material used in making printed wiring boards SG101924A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29739998 1998-10-19

Publications (1)

Publication Number Publication Date
SG101924A1 true SG101924A1 (en) 2004-02-27

Family

ID=17846001

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9903706A SG101924A1 (en) 1998-10-19 1999-07-16 Composite material used in making printed wiring boards

Country Status (8)

Country Link
US (1) US6548153B2 (zh)
EP (1) EP0996319B1 (zh)
KR (1) KR100633515B1 (zh)
CN (1) CN1190115C (zh)
DE (1) DE69934379T2 (zh)
MY (1) MY120367A (zh)
SG (1) SG101924A1 (zh)
TW (1) TW462210B (zh)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3676152B2 (ja) * 1999-11-11 2005-07-27 三井金属鉱業株式会社 キャリア箔付電解銅箔及びその製造方法
JP3690962B2 (ja) * 2000-04-26 2005-08-31 三井金属鉱業株式会社 キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法並びに銅張積層板
JP2002026475A (ja) * 2000-07-07 2002-01-25 Mitsui Mining & Smelting Co Ltd キャリア箔付銅箔回路及びそれを用いたプリント配線板の製造方法並びにプリント配線板
EP1356531A1 (en) * 2001-01-24 2003-10-29 Koninklijke Philips Electronics N.V. Method of producing a track on a substrate
JP4562110B2 (ja) * 2001-02-16 2010-10-13 大日本印刷株式会社 ウエットエッチングが適用される用途に限定される積層体、それを用いた電子回路部品、及びその製造方法
JP4683769B2 (ja) * 2001-05-31 2011-05-18 三井金属鉱業株式会社 銅メッキ回路層付銅張積層板及びその銅メッキ回路層付銅張積層板を用いたプリント配線板の製造方法
JPWO2003084297A1 (ja) * 2002-03-28 2005-08-11 新光電気工業株式会社 配線構造体及びその製造方法
US7476449B2 (en) * 2003-02-27 2009-01-13 Furukawa Circuit Foil Co., Ltd. Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield
JP4736703B2 (ja) * 2005-10-14 2011-07-27 宇部興産株式会社 銅配線ポリイミドフィルムの製造方法
US7951447B2 (en) * 2007-01-31 2011-05-31 Kyocera Corporation Method and apparatus for manufacturing prepreg sheet and prepreg sheet
CA2686000A1 (en) * 2007-05-24 2008-11-27 Basf Se Method for producing polymer-coated metal foils and use thereof
KR20100016622A (ko) * 2007-05-24 2010-02-12 바스프 에스이 금속 코팅 베이스 적층판의 제조 방법
US8809237B2 (en) * 2008-02-19 2014-08-19 Superpower, Inc. Method of forming an HTS article
KR101015770B1 (ko) * 2008-11-11 2011-02-22 삼성전기주식회사 세미 애디티브 공법에 의하여 제조되는 인쇄회로기판에 대한 절연층 형성방법과 이를 이용한 인쇄회로기판 제조방법 및 이에 의하여 제조되는 인쇄회로기판
TWI392412B (zh) * 2009-05-08 2013-04-01 Unimicron Technology Corp Circuit board and its manufacturing method
TWI393491B (zh) * 2009-08-21 2013-04-11 Unimicron Technology Corp 線路板及其製造方法
KR101022943B1 (ko) * 2009-10-12 2011-03-16 삼성전기주식회사 기판 제조용 캐리어 부재 및 이를 이용한 기판의 제조방법
CN102233699B (zh) * 2010-04-29 2013-10-16 南亚塑胶工业股份有限公司 以超低棱线铜箔为载体的极薄铜箔及其制造方法
JP5826322B2 (ja) * 2014-03-25 2015-12-02 Jx日鉱日石金属株式会社 表面処理銅箔、銅張積層板、プリント配線板、電子機器、半導体パッケージ用回路形成基板、半導体パッケージ及びプリント配線板の製造方法
TWI616120B (zh) * 2014-06-09 2018-02-21 結合載板的可撓性電路板結構及其製造方法
JP2019075456A (ja) * 2017-10-16 2019-05-16 住友電気工業株式会社 プリント配線板用基材及びプリント配線板
CN108330517B (zh) * 2018-01-25 2019-12-24 胡旭日 一种载体铜箔剥离层的镀液及剥离层的制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0297678A1 (en) * 1987-06-30 1989-01-04 Akzo N.V. Conductive metallization of substrates without developing agents
US4889573A (en) * 1988-05-23 1989-12-26 Tektronix, Inc. Method of forming a pattern of conductor runs on a sheet of dielectric material

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB859848A (en) * 1956-04-30 1961-01-25 Emi Ltd Improvements in or relating to the formation of conductors on insulating supports
US3998601A (en) * 1973-12-03 1976-12-21 Yates Industries, Inc. Thin foil
CA1044636A (en) * 1974-01-07 1978-12-19 Betty L. Berdan Method of nodularizing a metal surface
US3984598A (en) * 1974-02-08 1976-10-05 Universal Oil Products Company Metal-clad laminates
US4088544A (en) * 1976-04-19 1978-05-09 Hutkin Irving J Composite and method for making thin copper foil
US4169018A (en) * 1978-01-16 1979-09-25 Gould Inc. Process for electroforming copper foil
DE3322382A1 (de) * 1983-06-22 1985-01-10 Preh, Elektrofeinmechanische Werke Jakob Preh Nachf. Gmbh & Co, 8740 Bad Neustadt Verfahren zur herstellung von gedruckten schaltungen
JPH0818401B2 (ja) * 1989-05-17 1996-02-28 福田金属箔粉工業株式会社 複合箔とその製法
US5322975A (en) * 1992-09-18 1994-06-21 Gould Electronics Inc. Universal carrier supported thin copper line

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0297678A1 (en) * 1987-06-30 1989-01-04 Akzo N.V. Conductive metallization of substrates without developing agents
US4889573A (en) * 1988-05-23 1989-12-26 Tektronix, Inc. Method of forming a pattern of conductor runs on a sheet of dielectric material

Also Published As

Publication number Publication date
DE69934379D1 (de) 2007-01-25
MY120367A (en) 2005-10-31
KR20000028606A (ko) 2000-05-25
KR100633515B1 (ko) 2006-10-13
US6548153B2 (en) 2003-04-15
CN1255038A (zh) 2000-05-31
TW462210B (en) 2001-11-01
EP0996319B1 (en) 2006-12-13
EP0996319A3 (en) 2002-02-20
US20020090497A1 (en) 2002-07-11
CN1190115C (zh) 2005-02-16
EP0996319A2 (en) 2000-04-26
DE69934379T2 (de) 2007-09-27

Similar Documents

Publication Publication Date Title
SG101924A1 (en) Composite material used in making printed wiring boards
EP1699279B8 (en) Multilayer printed wiring board and method for producing the same
SG52992A1 (en) Multilayer printed circuit board
EP0678918A3 (en) Multi-layer circuit board.
GB9928031D0 (en) Printed wiring board
SG71716A1 (en) Multilayer printed circuit boards
EP0923085A4 (en) RESISTANCE CONNECTION TABLE AND METHOD FOR MANUFACTURING THE SAME
HK1008880A1 (en) Composite board
SG74116A1 (en) Composite copper foil process for preparing the same and copper-clad laminate and printed wiring board using the same
GB9721706D0 (en) Printed circuit boards
GB2314030B (en) Electronic dart board
GB2339555B (en) Drawing board
SG79881A1 (en) Printed circuit board
GB9512782D0 (en) Wiring board
EP1018858A4 (en) METHOD AND DEVICE FOR PRODUCING PCB
GB2337862B (en) Printed circuit board
SG91272A1 (en) Printed wiring board
GB2343995B (en) Printed wiring board
GB9508857D0 (en) Printed circuit board
GB2335626B (en) Board
GB9707153D0 (en) Improvements to multi-layer printed circuit boards
GB9827588D0 (en) A laminated board
GB9819202D0 (en) Improvements in or relating to printed circuit boards
GB9522452D0 (en) Printed circuit boards and their manufacture
GB9617843D0 (en) Improvements in or relating to printed circuit board manufacture