SG100709A1 - Semiconductor wafer assembly and machining apparatus having chuck tables for holding the same - Google Patents

Semiconductor wafer assembly and machining apparatus having chuck tables for holding the same

Info

Publication number
SG100709A1
SG100709A1 SG200103072A SG200103072A SG100709A1 SG 100709 A1 SG100709 A1 SG 100709A1 SG 200103072 A SG200103072 A SG 200103072A SG 200103072 A SG200103072 A SG 200103072A SG 100709 A1 SG100709 A1 SG 100709A1
Authority
SG
Singapore
Prior art keywords
holding
same
semiconductor wafer
machining apparatus
wafer assembly
Prior art date
Application number
SG200103072A
Other languages
English (en)
Inventor
Arai Kazuhisa
Takahashi Toshiaki
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG100709A1 publication Critical patent/SG100709A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG200103072A 2000-05-31 2001-05-22 Semiconductor wafer assembly and machining apparatus having chuck tables for holding the same SG100709A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000162287A JP2001345300A (ja) 2000-05-31 2000-05-31 半導体ウエーハ加工体および半導体ウエーハ加工体を保持するチャックテーブルを備えた加工装置

Publications (1)

Publication Number Publication Date
SG100709A1 true SG100709A1 (en) 2003-12-26

Family

ID=18666205

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200103072A SG100709A1 (en) 2000-05-31 2001-05-22 Semiconductor wafer assembly and machining apparatus having chuck tables for holding the same

Country Status (4)

Country Link
US (2) US20010049256A1 (ja)
JP (1) JP2001345300A (ja)
DE (1) DE10124739A1 (ja)
SG (1) SG100709A1 (ja)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10212420A1 (de) * 2002-03-21 2003-10-16 Erich Thallner Einrichtung zur Aufnahme eines Wafers
US7018268B2 (en) * 2002-04-09 2006-03-28 Strasbaugh Protection of work piece during surface processing
US20040229002A1 (en) * 2003-05-15 2004-11-18 3D Systems, Inc. Stereolithographic seal and support structure for semiconductor wafer
JP4592270B2 (ja) * 2003-10-06 2010-12-01 日東電工株式会社 半導体ウエハの支持材からの剥離方法およびこれを用いた装置
JP2007214502A (ja) * 2006-02-13 2007-08-23 Oki Electric Ind Co Ltd 半導体装置およびその製造方法
JP2009246098A (ja) * 2008-03-31 2009-10-22 Disco Abrasive Syst Ltd ウエーハの研削方法
US20100112905A1 (en) * 2008-10-30 2010-05-06 Leonard Borucki Wafer head template for chemical mechanical polishing and a method for its use
JP2011029331A (ja) * 2009-07-23 2011-02-10 Disco Abrasive Syst Ltd ウエーハの研削方法および保護テープ
US20130316627A1 (en) * 2012-05-14 2013-11-28 Edmond Arzuman Abrahamians Wafer carrier for batch wafer polishing in wafer polishing machines
JP5969334B2 (ja) * 2012-09-13 2016-08-17 株式会社ディスコ 加工装置及び加工方法
JP2014200888A (ja) * 2013-04-05 2014-10-27 ローム株式会社 吸引保持装置およびウエハ研磨装置
JP6045426B2 (ja) * 2013-04-05 2016-12-14 株式会社ディスコ ウェーハの転写方法および表面保護部材
JP6632469B2 (ja) * 2016-05-24 2020-01-22 三菱電機株式会社 ウエハトレイ
KR102420162B1 (ko) * 2018-02-09 2022-07-12 삼성전자주식회사 진공 척 및 이를 포함하는 반도체 제조 장치
DE102019211540A1 (de) 2019-08-01 2021-02-04 Disco Corporation Verfahren zum bearbeiten eines substrats
CN112838072A (zh) * 2019-11-22 2021-05-25 深圳市中光工业技术研究院 用于背面光刻工艺的对准方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04158549A (ja) * 1990-10-22 1992-06-01 Matsushita Electron Corp 半導体チップの剥離方法
JPH08107088A (ja) * 1994-10-04 1996-04-23 Fujitsu Ltd 半導体装置の製造方法
JP2000294603A (ja) * 1999-04-06 2000-10-20 Toshiba Corp 電子部品の実装装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54134973A (en) * 1978-04-12 1979-10-19 Kyushu Nippon Electric Sheet holding jig for semiconductor wafer
JPH0353546A (ja) * 1989-07-21 1991-03-07 Mitsubishi Electric Corp 半導体装置の製造方法およびその製造装置
JP2858705B2 (ja) * 1990-10-11 1999-02-17 富士通株式会社 半導体装置の製造方法
US5268065A (en) * 1992-12-21 1993-12-07 Motorola, Inc. Method for thinning a semiconductor wafer
JPH09213662A (ja) * 1996-01-31 1997-08-15 Toshiba Corp ウェーハの分割方法及び半導体装置の製造方法
JPH10116801A (ja) * 1996-10-09 1998-05-06 Rohm Co Ltd 基板分割方法及びその基板分割を用いた発光素子製造 方法
JP4322328B2 (ja) * 1997-06-05 2009-08-26 テキサス インスツルメンツ インコーポレイテツド ウエハをウエハテープに接着する方法および装置
JPH1140520A (ja) * 1997-07-23 1999-02-12 Toshiba Corp ウェーハの分割方法及び半導体装置の製造方法
JP3602943B2 (ja) * 1997-07-25 2004-12-15 シャープ株式会社 半導体ウエハの研削装置
JP3275299B2 (ja) * 1998-01-19 2002-04-15 株式会社東京精密 ダイシング装置及び切断刃のドレッシング方法
JPH11307488A (ja) * 1998-04-24 1999-11-05 Denso Corp 半導体装置、その製造方法、加工ガイドおよびその加工装置
US6142853A (en) * 1998-12-23 2000-11-07 Lucent Technologies, Inc. Method and apparatus for holding laser wafers during a fabrication process to minimize breakage
US6153536A (en) * 1999-03-04 2000-11-28 International Business Machines Corporation Method for mounting wafer frame at back side grinding (BSG) tool
US6468135B1 (en) * 1999-04-30 2002-10-22 International Business Machines Corporation Method and apparatus for multiphase chemical mechanical polishing
US6344414B1 (en) * 1999-04-30 2002-02-05 International Business Machines Corporation Chemical-mechanical polishing system having a bi-material wafer backing film assembly
US6431957B1 (en) * 2000-01-25 2002-08-13 Parker-Hannifin Corporation Directional flow control valve with recirculation for chemical-mechanical polishing slurries
JP2003179006A (ja) * 2002-09-20 2003-06-27 Toshiba Corp ウェーハの分割方法及び半導体装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04158549A (ja) * 1990-10-22 1992-06-01 Matsushita Electron Corp 半導体チップの剥離方法
JPH08107088A (ja) * 1994-10-04 1996-04-23 Fujitsu Ltd 半導体装置の製造方法
JP2000294603A (ja) * 1999-04-06 2000-10-20 Toshiba Corp 電子部品の実装装置

Also Published As

Publication number Publication date
US20030181150A1 (en) 2003-09-25
US20010049256A1 (en) 2001-12-06
JP2001345300A (ja) 2001-12-14
DE10124739A1 (de) 2002-04-04

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