SE9900446L - Halvledaranordning med djupa substratkontakter - Google Patents
Halvledaranordning med djupa substratkontakterInfo
- Publication number
- SE9900446L SE9900446L SE9900446A SE9900446A SE9900446L SE 9900446 L SE9900446 L SE 9900446L SE 9900446 A SE9900446 A SE 9900446A SE 9900446 A SE9900446 A SE 9900446A SE 9900446 L SE9900446 L SE 9900446L
- Authority
- SE
- Sweden
- Prior art keywords
- substrate
- semiconductor device
- connection
- ground
- substrate contacts
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/535—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including internal interconnections, e.g. cross-under constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05599—Material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/85399—Material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13063—Metal-Semiconductor Field-Effect Transistor [MESFET]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Bipolar Transistors (AREA)
Priority Applications (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9900446A SE515158C2 (sv) | 1999-02-10 | 1999-02-10 | Halvledaranordning med jordanslutning via en ej genomgående plugg |
TW088102471A TW466732B (en) | 1999-02-10 | 1999-11-17 | Semiconductor device with deep substrate contacts |
PCT/SE2000/000207 WO2000048248A1 (en) | 1999-02-10 | 2000-02-02 | Semiconductor device with deep substrate contacts |
KR1020017009652A KR100781826B1 (ko) | 1999-02-10 | 2000-02-02 | 심층 기판 접촉부를 가진 반도체 디바이스 |
CNB008036888A CN1160786C (zh) | 1999-02-10 | 2000-02-02 | 具有深衬底接触的半导体器件 |
EP00908157A EP1169734A1 (en) | 1999-02-10 | 2000-02-02 | Semiconductor device with deep substrate contacts |
AU29530/00A AU2953000A (en) | 1999-02-10 | 2000-02-02 | Semiconductor device with deep substrate contacts |
CA002356868A CA2356868A1 (en) | 1999-02-10 | 2000-02-02 | Semiconductor device with deep substrate contacts |
JP2000599078A JP2002536847A (ja) | 1999-02-10 | 2000-02-02 | 深い基板接触を有する半導体素子 |
US09/500,994 US6953981B1 (en) | 1999-02-10 | 2000-02-09 | Semiconductor device with deep substrates contacts |
HK02106518.8A HK1045024B (zh) | 1999-02-10 | 2002-09-04 | 具有深襯底接觸的半導體器件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9900446A SE515158C2 (sv) | 1999-02-10 | 1999-02-10 | Halvledaranordning med jordanslutning via en ej genomgående plugg |
Publications (3)
Publication Number | Publication Date |
---|---|
SE9900446D0 SE9900446D0 (sv) | 1999-02-10 |
SE9900446L true SE9900446L (sv) | 2000-08-11 |
SE515158C2 SE515158C2 (sv) | 2001-06-18 |
Family
ID=20414420
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9900446A SE515158C2 (sv) | 1999-02-10 | 1999-02-10 | Halvledaranordning med jordanslutning via en ej genomgående plugg |
Country Status (11)
Country | Link |
---|---|
US (1) | US6953981B1 (sv) |
EP (1) | EP1169734A1 (sv) |
JP (1) | JP2002536847A (sv) |
KR (1) | KR100781826B1 (sv) |
CN (1) | CN1160786C (sv) |
AU (1) | AU2953000A (sv) |
CA (1) | CA2356868A1 (sv) |
HK (1) | HK1045024B (sv) |
SE (1) | SE515158C2 (sv) |
TW (1) | TW466732B (sv) |
WO (1) | WO2000048248A1 (sv) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7078743B2 (en) | 2003-05-15 | 2006-07-18 | Matsushita Electric Industrial Co., Ltd. | Field effect transistor semiconductor device |
US7227237B2 (en) * | 2003-12-22 | 2007-06-05 | Palo Alto Research Center Incorporated | Systems and methods for biasing high fill-factor sensor arrays and the like |
US7589417B2 (en) | 2004-02-12 | 2009-09-15 | Intel Corporation | Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same |
US7598521B2 (en) * | 2004-03-29 | 2009-10-06 | Sanyo Electric Co., Ltd. | Semiconductor device in which the emitter resistance is reduced |
JP2006086398A (ja) | 2004-09-17 | 2006-03-30 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
US7651897B2 (en) * | 2004-12-07 | 2010-01-26 | National Semiconductor Corporation | Integrated circuit with metal heat flow path coupled to transistor and method for manufacturing such circuit |
DE602005021796D1 (de) * | 2005-11-16 | 2010-07-22 | St Microelectronics Srl | Herstellungsprozess für "deep through vias" in einem Halbleiterbauelement |
JP2007243140A (ja) * | 2006-02-09 | 2007-09-20 | Renesas Technology Corp | 半導体装置、電子装置および半導体装置の製造方法 |
JP5319084B2 (ja) * | 2007-06-19 | 2013-10-16 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
EP2180517A1 (en) * | 2008-10-24 | 2010-04-28 | Epcos Ag | Pnp bipolar transistor with lateral collector and method of production |
US9130006B2 (en) * | 2013-10-07 | 2015-09-08 | Freescale Semiconductor, Inc. | Semiconductor device with buried conduction path |
CN104576715A (zh) * | 2014-07-24 | 2015-04-29 | 上海华虹宏力半导体制造有限公司 | 锗硅异质结双极晶体管及制造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT8048031A0 (it) * | 1979-04-09 | 1980-02-28 | Raytheon Co | Perfezionamento nei dispositivi a semiconduttore ad effetto di campo |
US5240867A (en) * | 1989-02-09 | 1993-08-31 | Fujitsu Limited | Semiconductor integrated circuit having interconnection with improved design flexibility, and method of production |
JPH063840B2 (ja) * | 1989-03-31 | 1994-01-12 | 株式会社東芝 | 半導体装置 |
US5202752A (en) * | 1990-05-16 | 1993-04-13 | Nec Corporation | Monolithic integrated circuit device |
DE4118255A1 (de) * | 1991-06-04 | 1992-12-10 | Itt Ind Gmbh Deutsche | Monolithisch integrierter sensorschaltkreis in cmos-technik |
US6472723B1 (en) * | 1996-03-22 | 2002-10-29 | Telefonaktiebolaget Lm Ericsson (Publ) | Substrate contacts and shielding devices in a semiconductor component |
US5841166A (en) * | 1996-09-10 | 1998-11-24 | Spectrian, Inc. | Lateral DMOS transistor for RF/microwave applications |
US6063678A (en) * | 1998-05-04 | 2000-05-16 | Xemod, Inc. | Fabrication of lateral RF MOS devices with enhanced RF properties |
-
1999
- 1999-02-10 SE SE9900446A patent/SE515158C2/sv not_active IP Right Cessation
- 1999-11-17 TW TW088102471A patent/TW466732B/zh not_active IP Right Cessation
-
2000
- 2000-02-02 EP EP00908157A patent/EP1169734A1/en not_active Withdrawn
- 2000-02-02 CN CNB008036888A patent/CN1160786C/zh not_active Expired - Fee Related
- 2000-02-02 AU AU29530/00A patent/AU2953000A/en not_active Abandoned
- 2000-02-02 CA CA002356868A patent/CA2356868A1/en not_active Abandoned
- 2000-02-02 KR KR1020017009652A patent/KR100781826B1/ko not_active IP Right Cessation
- 2000-02-02 WO PCT/SE2000/000207 patent/WO2000048248A1/en not_active Application Discontinuation
- 2000-02-02 JP JP2000599078A patent/JP2002536847A/ja active Pending
- 2000-02-09 US US09/500,994 patent/US6953981B1/en not_active Expired - Fee Related
-
2002
- 2002-09-04 HK HK02106518.8A patent/HK1045024B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
SE515158C2 (sv) | 2001-06-18 |
KR100781826B1 (ko) | 2007-12-03 |
TW466732B (en) | 2001-12-01 |
EP1169734A1 (en) | 2002-01-09 |
AU2953000A (en) | 2000-08-29 |
HK1045024B (zh) | 2005-04-29 |
WO2000048248A1 (en) | 2000-08-17 |
US6953981B1 (en) | 2005-10-11 |
SE9900446D0 (sv) | 1999-02-10 |
CN1160786C (zh) | 2004-08-04 |
HK1045024A1 (en) | 2002-11-08 |
JP2002536847A (ja) | 2002-10-29 |
CN1340211A (zh) | 2002-03-13 |
CA2356868A1 (en) | 2000-08-17 |
KR20010110426A (ko) | 2001-12-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NUG | Patent has lapsed |