SE9801798A0 - Termoelektrisk anordning - Google Patents
Termoelektrisk anordningInfo
- Publication number
- SE9801798A0 SE9801798A0 SE9801798A SE9801798A SE9801798A0 SE 9801798 A0 SE9801798 A0 SE 9801798A0 SE 9801798 A SE9801798 A SE 9801798A SE 9801798 A SE9801798 A SE 9801798A SE 9801798 A0 SE9801798 A0 SE 9801798A0
- Authority
- SE
- Sweden
- Prior art keywords
- thermocouples
- thermoelectric
- elements
- layer
- ceramic
- Prior art date
Links
- 230000000476 thermogenic effect Effects 0.000 claims abstract 2
- 239000010410 layer Substances 0.000 claims description 86
- 229910010293 ceramic material Inorganic materials 0.000 claims description 43
- 239000000919 ceramic Substances 0.000 claims description 33
- 239000000463 material Substances 0.000 claims description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 29
- 229910052802 copper Inorganic materials 0.000 claims description 29
- 239000010949 copper Substances 0.000 claims description 29
- 239000004020 conductor Substances 0.000 claims description 27
- 238000010438 heat treatment Methods 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 22
- 239000004065 semiconductor Substances 0.000 claims description 20
- 238000004519 manufacturing process Methods 0.000 claims description 18
- 238000005266 casting Methods 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 238000005507 spraying Methods 0.000 claims description 16
- 238000007751 thermal spraying Methods 0.000 claims description 16
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 14
- 210000003298 dental enamel Anatomy 0.000 claims description 13
- 239000002344 surface layer Substances 0.000 claims description 11
- 230000007704 transition Effects 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 230000008901 benefit Effects 0.000 claims description 10
- 150000002739 metals Chemical class 0.000 claims description 10
- 239000004005 microsphere Substances 0.000 claims description 9
- 239000010802 sludge Substances 0.000 claims description 9
- 229920002472 Starch Polymers 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 8
- 238000004544 sputter deposition Methods 0.000 claims description 8
- 235000019698 starch Nutrition 0.000 claims description 8
- 239000008107 starch Substances 0.000 claims description 8
- 230000005676 thermoelectric effect Effects 0.000 claims description 8
- 230000005678 Seebeck effect Effects 0.000 claims description 7
- 239000004568 cement Substances 0.000 claims description 7
- 230000005611 electricity Effects 0.000 claims description 7
- 239000011241 protective layer Substances 0.000 claims description 7
- 238000005245 sintering Methods 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- TUFZVLHKHTYNTN-UHFFFAOYSA-N antimony;nickel Chemical compound [Sb]#[Ni] TUFZVLHKHTYNTN-UHFFFAOYSA-N 0.000 claims description 6
- 239000011230 binding agent Substances 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 6
- WYUZTTNXJUJWQQ-UHFFFAOYSA-N tin telluride Chemical compound [Te]=[Sn] WYUZTTNXJUJWQQ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- 238000005336 cracking Methods 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 238000007750 plasma spraying Methods 0.000 claims description 4
- 239000011148 porous material Substances 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 230000004888 barrier function Effects 0.000 claims description 3
- 239000003054 catalyst Substances 0.000 claims description 3
- 238000009826 distribution Methods 0.000 claims description 3
- 238000011049 filling Methods 0.000 claims description 3
- 238000010285 flame spraying Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 241001580017 Jana Species 0.000 claims description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 claims description 2
- 238000002485 combustion reaction Methods 0.000 claims description 2
- -1 copper Chemical class 0.000 claims description 2
- 230000001419 dependent effect Effects 0.000 claims description 2
- 238000010292 electrical insulation Methods 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 239000012212 insulator Substances 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- 239000011368 organic material Substances 0.000 claims description 2
- 230000008092 positive effect Effects 0.000 claims description 2
- 238000007650 screen-printing Methods 0.000 claims description 2
- 239000003981 vehicle Substances 0.000 claims description 2
- 229910052727 yttrium Inorganic materials 0.000 claims description 2
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 2
- 239000002002 slurry Substances 0.000 claims 1
- QFLWZFQWSBQYPS-AWRAUJHKSA-N (3S)-3-[[(2S)-2-[[(2S)-2-[5-[(3aS,6aR)-2-oxo-1,3,3a,4,6,6a-hexahydrothieno[3,4-d]imidazol-4-yl]pentanoylamino]-3-methylbutanoyl]amino]-3-(4-hydroxyphenyl)propanoyl]amino]-4-[1-bis(4-chlorophenoxy)phosphorylbutylamino]-4-oxobutanoic acid Chemical compound CCCC(NC(=O)[C@H](CC(O)=O)NC(=O)[C@H](Cc1ccc(O)cc1)NC(=O)[C@@H](NC(=O)CCCCC1SC[C@@H]2NC(=O)N[C@H]12)C(C)C)P(=O)(Oc1ccc(Cl)cc1)Oc1ccc(Cl)cc1 QFLWZFQWSBQYPS-AWRAUJHKSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000007749 high velocity oxygen fuel spraying Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- XFWJKVMFIVXPKK-UHFFFAOYSA-N calcium;oxido(oxo)alumane Chemical compound [Ca+2].[O-][Al]=O.[O-][Al]=O XFWJKVMFIVXPKK-UHFFFAOYSA-N 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- OCGWQDWYSQAFTO-UHFFFAOYSA-N tellanylidenelead Chemical compound [Pb]=[Te] OCGWQDWYSQAFTO-UHFFFAOYSA-N 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 101100495270 Caenorhabditis elegans cdc-26 gene Proteins 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000003546 flue gas Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Powder Metallurgy (AREA)
- Coating By Spraying Or Casting (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE9801798A SE9801798A0 (sv) | 1998-05-20 | 1998-05-20 | Termoelektrisk anordning |
| AU46619/99A AU4661999A (en) | 1998-05-20 | 1999-05-20 | Thermoelectric device |
| PCT/SE1999/000861 WO1999063791A2 (en) | 1998-05-20 | 1999-05-20 | Thermoelectric device and method for manufacturing of said device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE9801798A SE9801798A0 (sv) | 1998-05-20 | 1998-05-20 | Termoelektrisk anordning |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| SE9801798L SE9801798L (enrdf_load_stackoverflow) | |
| SE9801798D0 SE9801798D0 (sv) | 1998-05-20 |
| SE9801798A0 true SE9801798A0 (sv) | 1999-11-21 |
Family
ID=20411403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE9801798A SE9801798A0 (sv) | 1998-05-20 | 1998-05-20 | Termoelektrisk anordning |
Country Status (3)
| Country | Link |
|---|---|
| AU (1) | AU4661999A (enrdf_load_stackoverflow) |
| SE (1) | SE9801798A0 (enrdf_load_stackoverflow) |
| WO (1) | WO1999063791A2 (enrdf_load_stackoverflow) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010035724A1 (de) | 2010-08-28 | 2012-03-01 | Daimler Ag | Verfahren zum Herstellen eines Kraftwagenbauteils mit thermoelektrischem Generator sowie Kraftwagenbauteil mit thermoelektrischem Generator |
| DE102012205098B4 (de) * | 2012-03-29 | 2020-04-02 | Evonik Operations Gmbh | Thermoelektrische Bauelemente auf Basis trocken verpresster Pulvervorstufen |
| DE102013219541B4 (de) * | 2013-09-27 | 2019-05-09 | Evonik Degussa Gmbh | Verbessertes Verfahren zur pulvermetallurgischen Herstellung thermoelektrischer Bauelemente |
| PL3196951T3 (pl) | 2016-01-21 | 2019-07-31 | Evonik Degussa Gmbh | Racjonalny sposób wytwarzania elementów termoelektrycznych za pomocą metalurgii proszkowej |
| US20190181320A1 (en) * | 2017-12-13 | 2019-06-13 | Purdue Research Foundation | Electric generator and method of making the same |
| JP2020150215A (ja) * | 2019-03-15 | 2020-09-17 | 三菱マテリアル株式会社 | 熱電変換モジュール |
| GB2585045A (en) * | 2019-06-25 | 2020-12-30 | Sumitomo Chemical Co | Thermoelectric device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5364495A (en) * | 1976-11-22 | 1978-06-08 | Matsushita Electric Ind Co Ltd | Ceramic case for thermoelectric transducer |
| US4459428A (en) * | 1982-04-28 | 1984-07-10 | Energy Conversion Devices, Inc. | Thermoelectric device and method of making same |
| US4687879A (en) * | 1985-04-25 | 1987-08-18 | Varo, Inc. | Tiered thermoelectric unit and method of fabricating same |
| US4907060A (en) * | 1987-06-02 | 1990-03-06 | Nelson John L | Encapsulated thermoelectric heat pump and method of manufacture |
| EP0455051B1 (en) * | 1990-04-20 | 1998-12-23 | Matsushita Electric Industrial Co., Ltd. | Thermoelectric semiconductor having a porous structure deaerated into a vacuum and thermoelectric panel |
| CH680541A5 (enrdf_load_stackoverflow) * | 1990-07-12 | 1992-09-15 | Landis & Gyr Betriebs Ag | |
| JPH09153647A (ja) * | 1995-11-29 | 1997-06-10 | Chichibu Onoda Cement Corp | 熱電変換モジュール用熱伝導性基板 |
-
1998
- 1998-05-20 SE SE9801798A patent/SE9801798A0/sv not_active Application Discontinuation
-
1999
- 1999-05-20 WO PCT/SE1999/000861 patent/WO1999063791A2/en active Application Filing
- 1999-05-20 AU AU46619/99A patent/AU4661999A/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| SE9801798L (enrdf_load_stackoverflow) | |
| SE9801798D0 (sv) | 1998-05-20 |
| WO1999063791A3 (en) | 2000-03-16 |
| WO1999063791A2 (en) | 1999-12-09 |
| AU4661999A (en) | 1999-12-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| NAV | Patent application has lapsed |
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