SE9402084L - Sätt att formspruta plast för elektriska skärmningshöljen - Google Patents

Sätt att formspruta plast för elektriska skärmningshöljen

Info

Publication number
SE9402084L
SE9402084L SE9402084A SE9402084A SE9402084L SE 9402084 L SE9402084 L SE 9402084L SE 9402084 A SE9402084 A SE 9402084A SE 9402084 A SE9402084 A SE 9402084A SE 9402084 L SE9402084 L SE 9402084L
Authority
SE
Sweden
Prior art keywords
plastic
pct
laminate
tool
ways
Prior art date
Application number
SE9402084A
Other languages
English (en)
Other versions
SE9402084D0 (sv
SE504039C2 (sv
Inventor
Karl-Erik Leeb
Lars Persson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9402084A priority Critical patent/SE504039C2/sv
Publication of SE9402084D0 publication Critical patent/SE9402084D0/sv
Priority to US08/750,619 priority patent/US5837086A/en
Priority to AU27579/95A priority patent/AU2757995A/en
Priority to PCT/SE1995/000688 priority patent/WO1995034423A1/en
Publication of SE9402084L publication Critical patent/SE9402084L/sv
Publication of SE504039C2 publication Critical patent/SE504039C2/sv

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/1418Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/098Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14778Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
    • B29C45/14811Multilayered articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/42Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/0045Casings being rigid plastic containers having a coating of shielding material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2705/00Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0003Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
    • B29K2995/0011Electromagnetic wave shielding material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00Other particular articles
    • B29L2031/22Hinges, pivots
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212Electromagnetic interference shielding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/714Inert, i.e. inert to chemical degradation, corrosion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2361/00Phenoplast, aminoplast
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2398/00Unspecified macromolecular compounds
    • B32B2398/10Thermosetting resins

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
SE9402084A 1994-06-14 1994-06-14 Sätt att formspruta plast SE504039C2 (sv)

Priority Applications (4)

Application Number Priority Date Filing Date Title
SE9402084A SE504039C2 (sv) 1994-06-14 1994-06-14 Sätt att formspruta plast
US08/750,619 US5837086A (en) 1994-06-14 1995-06-08 Method of injection-moulding plastics for electrical shielding casings
AU27579/95A AU2757995A (en) 1994-06-14 1995-06-08 Method of injection-moulding plastics for electrical shielding casings
PCT/SE1995/000688 WO1995034423A1 (en) 1994-06-14 1995-06-08 Method of injection-moulding plastics for electrical shielding casings

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9402084A SE504039C2 (sv) 1994-06-14 1994-06-14 Sätt att formspruta plast

Publications (3)

Publication Number Publication Date
SE9402084D0 SE9402084D0 (sv) 1994-06-14
SE9402084L true SE9402084L (sv) 1996-01-17
SE504039C2 SE504039C2 (sv) 1996-10-21

Family

ID=20394382

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9402084A SE504039C2 (sv) 1994-06-14 1994-06-14 Sätt att formspruta plast

Country Status (4)

Country Link
US (1) US5837086A (sv)
AU (1) AU2757995A (sv)
SE (1) SE504039C2 (sv)
WO (1) WO1995034423A1 (sv)

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5811050A (en) * 1994-06-06 1998-09-22 Gabower; John F. Electromagnetic interference shield for electronic devices
DE19617656A1 (de) * 1996-05-03 1997-11-06 Siegfried Schaal Metallveredel Abschirm-Formteil für elektronische Bauelemente
DE19629230A1 (de) * 1996-07-20 1998-01-22 Siegfried Schaal Metallveredel Elektronisches Gerät sowie Abschirm-Formteil für ein elektronisches Gerät
FI963872A (sv) * 1996-09-27 1998-03-28 Jari Ruuttu Skyddsmedel för att skydda en elektrisk anordning mot miljöförhållanden
GB2318758A (en) * 1996-10-31 1998-05-06 Motorola Inc Metod for applying conductive shielding to a non-conductive part
NL1008197C2 (nl) * 1998-02-04 1999-08-05 Stork Screens Bv Werkwijze voor het vervaardigen van een drager met een afscherming voor stoorstraling, alsmede afschermingsmateriaal.
JPH11277582A (ja) * 1998-02-12 1999-10-12 Natl Standard Co 電磁遮蔽ハウジングの成形方法及び成形装置
FR2790424B1 (fr) * 1999-03-04 2001-04-27 Nobel Plastiques Procede de fabrication de pieces ayant une surface decorative d'aspect metallique
US6497567B1 (en) * 1999-10-04 2002-12-24 Serigraph Inc. Multi-purpose processing apparatus
US6768654B2 (en) * 2000-09-18 2004-07-27 Wavezero, Inc. Multi-layered structures and methods for manufacturing the multi-layered structures
JP3456473B2 (ja) * 2000-11-16 2003-10-14 日本電気株式会社 携帯電話機筐体
WO2002052915A1 (en) * 2000-12-27 2002-07-04 Telefonaktiebolaget L M Ericsson (Publ) Shield can
SE520529C2 (sv) 2000-12-27 2003-07-22 Ericsson Telefon Ab L M Metod för tillverkning av avskärmningslåda och avskärmningslåda
US20020180108A1 (en) * 2001-04-16 2002-12-05 Kiyofumi Koshiba Electromagnetic shielding box and method of manufacturing the same
DE10120463B4 (de) * 2001-04-26 2017-03-09 Robert Bosch Gmbh Verfahren zur Herstellung eines Kunststoffbauteils mit einer mikrostrukturierten, hinterspritzten Folienschicht, insbesondere einer Abdeckplatte vor einer Anzeige eines Autoradios
US7396500B2 (en) * 2002-07-29 2008-07-08 Dow Technologies Inc. Molded parts with metal or wood surface areas and processes for their production
DE102004032362A1 (de) * 2004-07-03 2006-01-26 Rehau Ag + Co Verfahren zur Herstellung eines Verbund-Bauteils sowie Verbund-Bauteil
US20060051445A1 (en) * 2004-09-03 2006-03-09 Sten Rundberg Injection molding system, apparatus, method and quick-connect mechanism
MX2007002660A (es) * 2004-09-03 2007-10-10 Nypro Inc Sistema, aparato y metodo de moldeo por inyeccion convertible.
US7570082B2 (en) * 2006-08-15 2009-08-04 International Business Machines Corporation Voltage comparator apparatus and method having improved kickback and jitter characteristics
WO2008083524A1 (fr) * 2007-01-12 2008-07-17 Xiamen Hualian Electronics Co., Ltd. Méthode de fabrication d'une télécommande ir à amplificateur/récepteur
US8198979B2 (en) 2007-04-20 2012-06-12 Ink-Logix, Llc In-molded resistive and shielding elements
WO2008131305A1 (en) 2007-04-20 2008-10-30 Ink-Logix, Llc In-molded capacitive switch
US8192815B2 (en) 2007-07-13 2012-06-05 Apple Inc. Methods and systems for forming a dual layer housing
KR20100085084A (ko) 2007-10-04 2010-07-28 인테그란 테크놀로지즈 인코포레이티드 휴대용 전자 디바이스를 위한 금속 코팅된 구조부
TW200927439A (en) * 2007-12-28 2009-07-01 Univ Chung Yuan Christian Injection molding mold and surface quality improvement apparatus and method for injection molding
US8315043B2 (en) * 2008-01-24 2012-11-20 Apple Inc. Methods and systems for forming housings from multi-layer materials
TWI365695B (en) * 2008-04-02 2012-06-01 Pegatron Corp Case of an electronic device and method of fabricating the same
US8646637B2 (en) * 2008-04-18 2014-02-11 Apple Inc. Perforated substrates for forming housings
US8367304B2 (en) 2008-06-08 2013-02-05 Apple Inc. Techniques for marking product housings
US20100159273A1 (en) 2008-12-24 2010-06-24 John Benjamin Filson Method and Apparatus for Forming a Layered Metal Structure with an Anodized Surface
US9173336B2 (en) 2009-05-19 2015-10-27 Apple Inc. Techniques for marking product housings
US9884342B2 (en) * 2009-05-19 2018-02-06 Apple Inc. Techniques for marking product housings
US8663806B2 (en) 2009-08-25 2014-03-04 Apple Inc. Techniques for marking a substrate using a physical vapor deposition material
US8809733B2 (en) 2009-10-16 2014-08-19 Apple Inc. Sub-surface marking of product housings
US9845546B2 (en) 2009-10-16 2017-12-19 Apple Inc. Sub-surface marking of product housings
US10071583B2 (en) 2009-10-16 2018-09-11 Apple Inc. Marking of product housings
CN102118925A (zh) * 2009-12-30 2011-07-06 深圳富泰宏精密工业有限公司 电子装置外壳及其制作方法
US8628836B2 (en) 2010-03-02 2014-01-14 Apple Inc. Method and apparatus for bonding metals and composites
US8489158B2 (en) 2010-04-19 2013-07-16 Apple Inc. Techniques for marking translucent product housings
US8724285B2 (en) 2010-09-30 2014-05-13 Apple Inc. Cosmetic conductive laser etching
US20120248001A1 (en) 2011-03-29 2012-10-04 Nashner Michael S Marking of Fabric Carrying Case for Portable Electronic Device
US9280183B2 (en) 2011-04-01 2016-03-08 Apple Inc. Advanced techniques for bonding metal to plastic
CN102815066B (zh) * 2011-06-08 2016-03-02 联想(北京)有限公司 工件的制备方法与电子设备
US8879266B2 (en) 2012-05-24 2014-11-04 Apple Inc. Thin multi-layered structures providing rigidity and conductivity
MX357215B (es) * 2012-06-28 2018-06-29 Jain Irrigation Systems Ltd Pesa de tubo de encendido y apagado para la irrigacion por goteo.
US10071584B2 (en) 2012-07-09 2018-09-11 Apple Inc. Process for creating sub-surface marking on plastic parts
US9434197B2 (en) 2013-06-18 2016-09-06 Apple Inc. Laser engraved reflective surface structures
US9314871B2 (en) 2013-06-18 2016-04-19 Apple Inc. Method for laser engraved reflective surface structures
KR20160040927A (ko) 2014-10-06 2016-04-15 삼성전자주식회사 반도체 패키지 및 그 제조 방법
KR101966151B1 (ko) * 2018-05-03 2019-04-05 주식회사 서연이화 리얼우드를 포함하는 성형품 제조방법
US10999917B2 (en) 2018-09-20 2021-05-04 Apple Inc. Sparse laser etch anodized surface for cosmetic grounding
JP7358792B2 (ja) * 2019-06-13 2023-10-12 株式会社レゾナック 電子基板筐体及びその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0101095B1 (en) * 1982-08-17 1988-11-17 Dai Nippon Insatsu Kabushiki Kaisha Method and device for injection molding articles while simultaneously forming patterns thereon
JPS60129224A (ja) * 1983-12-16 1985-07-10 Showa Denko Kk 電磁波遮蔽用筐体の製造方法
JPS61197221A (ja) * 1985-02-28 1986-09-01 Kyoraku Co Ltd 電磁波遮蔽性成形品の製造方法
DE4130691A1 (de) * 1991-09-14 1993-03-25 Reinshagen Kabelwerk Gmbh Verfahren zur herstellung eines formkoerpers
SE505658C2 (sv) * 1993-03-24 1997-09-29 Ericsson Telefon Ab L M Anordning för elektrisk kontaktering i fogar

Also Published As

Publication number Publication date
AU2757995A (en) 1996-01-05
US5837086A (en) 1998-11-17
SE9402084D0 (sv) 1994-06-14
WO1995034423A1 (en) 1995-12-21
SE504039C2 (sv) 1996-10-21

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