JPS55103923A - Molding method of synthetic resin - Google Patents
Molding method of synthetic resinInfo
- Publication number
- JPS55103923A JPS55103923A JP1108279A JP1108279A JPS55103923A JP S55103923 A JPS55103923 A JP S55103923A JP 1108279 A JP1108279 A JP 1108279A JP 1108279 A JP1108279 A JP 1108279A JP S55103923 A JPS55103923 A JP S55103923A
- Authority
- JP
- Japan
- Prior art keywords
- conductor strip
- synthetic resin
- epoxy resin
- layer
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE:To insert an electronic part, such as a conductor strip into a molded structure of a synthetic resin so as not to cause a gap between the synthetic resin structure and the conductor strip inserted thereinto, by forming in advance a layer of a coating of an excellent adhesiveness on that part of the conductor strip which is to come into contact with the synthetic resin structure. CONSTITUTION:A hoop type conductor strip 6 having a plurality of contacts, i.e. a centeal contact 7a and peripheral contacts 7b, 7b is integrally formed by punching. Before subjecting the conductor strip 6 to an insertion molding, a layer 8 of a coating of an uncured epoxy resin in a semipolymerized state is formed on both sides of that portion of the conductor strip 6 which is to be inserted into a molded structure. The conductor strip 6 is then placed in a mold, and an epoxy resin is injected into the mold so as to be hardened. Thus, the conductor strip 6 is insertion-molded in a molded structure 9, which consists of epoxy resin. The layer 8 is already in an excellent bonded state with respect to the conductor strip 6 so that, even when the epoxy resin is contacted, a gap never occurs between the conductor strip 6 and molded structure 9. Therefore, the insertion-molding of the conductor strip can be carried out excellently.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1108279A JPS55103923A (en) | 1979-02-02 | 1979-02-02 | Molding method of synthetic resin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1108279A JPS55103923A (en) | 1979-02-02 | 1979-02-02 | Molding method of synthetic resin |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55103923A true JPS55103923A (en) | 1980-08-08 |
JPS6226293B2 JPS6226293B2 (en) | 1987-06-08 |
Family
ID=11768045
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1108279A Granted JPS55103923A (en) | 1979-02-02 | 1979-02-02 | Molding method of synthetic resin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55103923A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5609652A (en) * | 1994-04-13 | 1997-03-11 | Koito Manufacturing Co., Ltd. | Method of manufacturing a synthetic resin part integrally formed with metal members |
-
1979
- 1979-02-02 JP JP1108279A patent/JPS55103923A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5609652A (en) * | 1994-04-13 | 1997-03-11 | Koito Manufacturing Co., Ltd. | Method of manufacturing a synthetic resin part integrally formed with metal members |
Also Published As
Publication number | Publication date |
---|---|
JPS6226293B2 (en) | 1987-06-08 |
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