JPS55103923A - Molding method of synthetic resin - Google Patents

Molding method of synthetic resin

Info

Publication number
JPS55103923A
JPS55103923A JP1108279A JP1108279A JPS55103923A JP S55103923 A JPS55103923 A JP S55103923A JP 1108279 A JP1108279 A JP 1108279A JP 1108279 A JP1108279 A JP 1108279A JP S55103923 A JPS55103923 A JP S55103923A
Authority
JP
Japan
Prior art keywords
conductor strip
synthetic resin
epoxy resin
layer
molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1108279A
Other languages
Japanese (ja)
Other versions
JPS6226293B2 (en
Inventor
Taneo Murata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP1108279A priority Critical patent/JPS55103923A/en
Publication of JPS55103923A publication Critical patent/JPS55103923A/en
Publication of JPS6226293B2 publication Critical patent/JPS6226293B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE:To insert an electronic part, such as a conductor strip into a molded structure of a synthetic resin so as not to cause a gap between the synthetic resin structure and the conductor strip inserted thereinto, by forming in advance a layer of a coating of an excellent adhesiveness on that part of the conductor strip which is to come into contact with the synthetic resin structure. CONSTITUTION:A hoop type conductor strip 6 having a plurality of contacts, i.e. a centeal contact 7a and peripheral contacts 7b, 7b is integrally formed by punching. Before subjecting the conductor strip 6 to an insertion molding, a layer 8 of a coating of an uncured epoxy resin in a semipolymerized state is formed on both sides of that portion of the conductor strip 6 which is to be inserted into a molded structure. The conductor strip 6 is then placed in a mold, and an epoxy resin is injected into the mold so as to be hardened. Thus, the conductor strip 6 is insertion-molded in a molded structure 9, which consists of epoxy resin. The layer 8 is already in an excellent bonded state with respect to the conductor strip 6 so that, even when the epoxy resin is contacted, a gap never occurs between the conductor strip 6 and molded structure 9. Therefore, the insertion-molding of the conductor strip can be carried out excellently.
JP1108279A 1979-02-02 1979-02-02 Molding method of synthetic resin Granted JPS55103923A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1108279A JPS55103923A (en) 1979-02-02 1979-02-02 Molding method of synthetic resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1108279A JPS55103923A (en) 1979-02-02 1979-02-02 Molding method of synthetic resin

Publications (2)

Publication Number Publication Date
JPS55103923A true JPS55103923A (en) 1980-08-08
JPS6226293B2 JPS6226293B2 (en) 1987-06-08

Family

ID=11768045

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1108279A Granted JPS55103923A (en) 1979-02-02 1979-02-02 Molding method of synthetic resin

Country Status (1)

Country Link
JP (1) JPS55103923A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5609652A (en) * 1994-04-13 1997-03-11 Koito Manufacturing Co., Ltd. Method of manufacturing a synthetic resin part integrally formed with metal members

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5609652A (en) * 1994-04-13 1997-03-11 Koito Manufacturing Co., Ltd. Method of manufacturing a synthetic resin part integrally formed with metal members

Also Published As

Publication number Publication date
JPS6226293B2 (en) 1987-06-08

Similar Documents

Publication Publication Date Title
SG70600A1 (en) Semiconductor element-mounting board manufacturing method for the board semiconductor device and manufacturing method for the device
EP0377937A3 (en) Ic card
SE9402084D0 (en) Ways of injection molding plastic for electric shielding housings
CA2008601A1 (en) Molded electrical connector and method for manufacturing same
KR870008495A (en) Synthetic Resin Unit
JPS55103923A (en) Molding method of synthetic resin
JPS5340055A (en) Method of injection molding thermosetting resin and mold device
BR8800755A (en) ELECTRIC CAPACITOR AND PROCESS FOR ITS MANUFACTURING
EP0358504A3 (en) Electrical components
KR930016230A (en) Manufacturing Method of Disk Board
JPH1075040A (en) Method for manufacturing resin-coated circuit board
JPS53112063A (en) Semiconductor and method of coating same
MY130758A (en) Method of molding a molding resin on a substrate having openings, switch substrate with a molding resin, method of forming a switch pattern on a switch subnstrate, and a switch substrate
EP0052540A3 (en) Molded plastic connector
KR890004270A (en) Manufacturing method of magnetic head
ES542399A0 (en) METHOD AND ITS CORRESPONDING MOLD FOR INJECTION MOLDING OF AN ARTICLE.
JPH0342985Y2 (en)
JPH01170088A (en) Manufacture of molded circuit substrate
JPS5372570A (en) Manufacture of semiconductor device
GB1257944A (en)
JPS59185897U (en) Electromagnetic shield molded product
JPS5632737A (en) Manufacture of electronic equipment
JPS56124222A (en) Manufacture of resin molded coil
JPS6450497A (en) Manufacture of printed wiring board
JPS55138847A (en) Method of fabricating circuit substrate for watch