MY130758A - Method of molding a molding resin on a substrate having openings, switch substrate with a molding resin, method of forming a switch pattern on a switch subnstrate, and a switch substrate - Google Patents

Method of molding a molding resin on a substrate having openings, switch substrate with a molding resin, method of forming a switch pattern on a switch subnstrate, and a switch substrate

Info

Publication number
MY130758A
MY130758A MYPI99005707A MYPI9905707A MY130758A MY 130758 A MY130758 A MY 130758A MY PI99005707 A MYPI99005707 A MY PI99005707A MY PI9905707 A MYPI9905707 A MY PI9905707A MY 130758 A MY130758 A MY 130758A
Authority
MY
Malaysia
Prior art keywords
switch
substrate
mold
molding resin
molding
Prior art date
Application number
MYPI99005707A
Inventor
Osamu Nomura
Nobuyuki Yagi
Kozo Morita
Original Assignee
Teikoku Tsushin Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP36639098A external-priority patent/JP3533099B2/en
Priority claimed from JP16990799A external-priority patent/JP3388428B2/en
Application filed by Teikoku Tsushin Kogyo Kk filed Critical Teikoku Tsushin Kogyo Kk
Publication of MY130758A publication Critical patent/MY130758A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/12—Contacts characterised by the manner in which co-operating contacts engage
    • H01H1/36—Contacts characterised by the manner in which co-operating contacts engage by sliding
    • H01H1/40—Contact mounted so that its contact-making surface is flush with adjoining insulation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336—Coating a portion of the article, e.g. the edge of the article
    • B29C45/14344—Moulding in or through a hole in the article, e.g. outsert moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/0056—Apparatus or processes specially adapted for the manufacture of electric switches comprising a successive blank-stamping, insert-moulding and severing operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/12—Contacts characterised by the manner in which co-operating contacts engage
    • H01H1/36—Contacts characterised by the manner in which co-operating contacts engage by sliding
    • H01H1/40—Contact mounted so that its contact-making surface is flush with adjoining insulation
    • H01H1/403—Contacts forming part of a printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H19/00—Switches operated by an operating part which is rotatable about a longitudinal axis thereof and which is acted upon directly by a solid body external to the switch, e.g. by a hand
    • H01H19/005—Electromechanical pulse generators
    • H01H2019/006—Electromechanical pulse generators being rotation direction sensitive, e.g. the generated pulse or code depends on the direction of rotation of the operating part
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49105—Switch making

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Manufacture Of Switches (AREA)
  • Rotary Switch, Piano Key Switch, And Lever Switch (AREA)
  • Laser Beam Processing (AREA)
  • Push-Button Switches (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

A SUBSTRATE (10), A FIRST MOLD (200) AND SECOND MOLD (250) ARE PREPARED, AND A PLURALITY OF SWITCH PATTERNS (14), (18) ARE PROVIDED BY PROVIDING OPENING (PAATERN-REMOVAL PORTIONS) (A) IN SUCH A MANNER THAT A PATTERN (11), WHICH HAS BEEN FORMED ON THE SURFACE OF THE SUBSTRATE (10), IS DIVIDED INTO A PLURALITY OF PATTERNS. A SWITCH SUBSTRATE (1) ID FORMED AS A RESULT. NEXT, THE SWITCH SUBSTRATE (1) IS CLAMPED BETWEEN THE FIRST MOLD (200) AND THE SECOND MOLD (250). AT SUCH TIME THE SIDE OF THE SWITCH SUBSTRATE (1) PROVIDED WITH THE SWITCH PATTERNS (14), (18) IS BROUGHT INTO SURFACE CONTACT WITH AN ABUTTING SURFACE CONTACT WITH AN ABUTTING SURFACE (201) OF THE FIRST MOLD (200) AND, AT THE SAME, A CAVITY (253) PROVIDED IN THE SECOND MOLD (250) ID MADE TO OPPOSE THE OTHER SIDE OF THE SWITCH SUBSTRATE. NEXT, A MOLTEN MOLDING RESIN IS CHARGER INTO THECAVITY (253) PROVIDED IN THE SECOND MOLD (250) TO THEREBY FILL THE CAVITY (253) AND THE OPENINGS (A) OF THE SUBSTRATE WITH THE MOLDING RESIN. AFTER THE MOLDING RESIN HARDENS, THE FIRST MOLD (200) AND THE SECOND MOLD (250) ARE SEPARATED AND THE SWITCH SUBSTRATE (1), WHICH WILL HAVE THE MOLDING RESIN (A CASE 40) ATTACHED THERETO, IS EXTRACTED.(FIG. 3)
MYPI99005707A 1998-12-24 1999-12-23 Method of molding a molding resin on a substrate having openings, switch substrate with a molding resin, method of forming a switch pattern on a switch subnstrate, and a switch substrate MY130758A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP36639098A JP3533099B2 (en) 1998-12-24 1998-12-24 Manufacturing method of substrate for switch
JP16990799A JP3388428B2 (en) 1999-06-16 1999-06-16 Mold resin molding method for substrate with opening

Publications (1)

Publication Number Publication Date
MY130758A true MY130758A (en) 2007-07-31

Family

ID=26493104

Family Applications (2)

Application Number Title Priority Date Filing Date
MYPI20051517A MY137851A (en) 1998-12-24 1999-12-23 A method of forming a switch pattern on a switch substrate
MYPI99005707A MY130758A (en) 1998-12-24 1999-12-23 Method of molding a molding resin on a substrate having openings, switch substrate with a molding resin, method of forming a switch pattern on a switch subnstrate, and a switch substrate

Family Applications Before (1)

Application Number Title Priority Date Filing Date
MYPI20051517A MY137851A (en) 1998-12-24 1999-12-23 A method of forming a switch pattern on a switch substrate

Country Status (6)

Country Link
US (1) US6388211B1 (en)
EP (2) EP1013391B1 (en)
KR (1) KR100375192B1 (en)
DE (2) DE69918727T2 (en)
MY (2) MY137851A (en)
TW (1) TW452536B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3941603B2 (en) * 2002-06-25 2007-07-04 松下電器産業株式会社 Rotary encoder
JP2004095242A (en) * 2002-08-30 2004-03-25 Tsubame Musen Kk Rotary encoder and manufacturing method for substrate of the same
JP4622879B2 (en) * 2006-02-17 2011-02-02 パナソニック株式会社 Rotary operation type encoder
JP2013114886A (en) * 2011-11-29 2013-06-10 Hosiden Corp Movable contact and contact structure with the same
US10285277B1 (en) * 2015-12-31 2019-05-07 Lockheed Martin Corporation Method of manufacturing circuits using thick metals and machined bulk dielectrics

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB526381A (en) * 1939-03-14 1940-09-17 Lines Bros Ltd Improvements relating to the manufacture of articles having transparent windows
US3457537A (en) * 1966-11-23 1969-07-22 Paul J Hines Flexible resistance element film
US3809733A (en) * 1968-11-06 1974-05-07 Ici Ltd Production of double layer laminates
JPS6034049B2 (en) * 1979-09-14 1985-08-06 松下電器産業株式会社 Contact board manufacturing method
DE3336130A1 (en) * 1983-10-05 1985-04-18 Standard Elektrik Lorenz Ag, 7000 Stuttgart ELECTRIC SWITCH
US4728755A (en) * 1984-11-29 1988-03-01 Robertshaw Controls Company Rotary switch construction and method of making the same
EP0304112B1 (en) * 1987-08-21 1993-10-06 Teikoku Tsushin Kogyo Co. Ltd. Molded resin casing of electronic part incorporating flexible board
EP0307977B1 (en) * 1987-09-07 1992-09-30 Teikoku Tsushin Kogyo Co. Ltd. Molded resin casing of electronic part with flat cable
GB8821103D0 (en) * 1988-09-08 1988-10-05 Lucas Ind Plc Electrical circuit element
US4944908A (en) * 1988-10-28 1990-07-31 Eaton Corporation Method for forming a molded plastic article
JPH03219509A (en) * 1989-11-25 1991-09-26 Seiko Epson Corp Switch substrate and manufacture of switch substrate
JPH0742096Y2 (en) * 1990-10-26 1995-09-27 株式会社ニコン Encoder
US5359165A (en) * 1993-07-16 1994-10-25 Eaton Corporation Illuminated rotary switch assembly
US6229103B1 (en) * 1995-08-23 2001-05-08 Matsushita Electric Industrial Co., Ltd. Electronic component with built-in push switch driven by rotary and pushing operation of an operating knob
DE29614317U1 (en) * 1996-08-20 1997-12-18 Ridder GmbH, 56377 Nassau Mat in the form of an insert or template for sanitary facilities
FR2753043B1 (en) * 1996-09-03 1998-11-20 Valeo Vision METHOD FOR PRODUCING A CONTROLLED ADJUSTING CIRCUIT OF THE POSITION OF A MOBILE MEMBER, PARTICULARLY IN A BEAM ORIENTATION CORRECTOR OF A MOTOR VEHICLE PROJECTOR, AND ADJUSTING CIRCUIT ACCORDING TO THE METHOD
FR2753042B1 (en) * 1996-09-03 1998-11-20 Valeo Vision METHOD FOR PRODUCING A CONTROLLER ADJUSTING CIRCUIT FOR THE POSITION OF A MOBILE MEMBER IN PARTICULAR IN A BEAM ORIENTATION CORRECTOR OF A MOTOR VEHICLE PROJECTOR, AND ADJUSTED ADJUSTMENT CIRCUIT
US5743380A (en) * 1996-12-02 1998-04-28 Augat Inc. Rotary door lock switch assembly and method for manufacturing same
US6248964B1 (en) * 1999-03-30 2001-06-19 Bourns, Inc. Thick film on metal encoder element

Also Published As

Publication number Publication date
EP1190830A2 (en) 2002-03-27
EP1013391A2 (en) 2000-06-28
EP1190830B1 (en) 2004-07-14
EP1190830A3 (en) 2002-09-11
KR20000048370A (en) 2000-07-25
DE69918727T2 (en) 2005-07-21
DE69918727D1 (en) 2004-08-19
US6388211B1 (en) 2002-05-14
KR100375192B1 (en) 2003-03-08
TW452536B (en) 2001-09-01
EP1013391B1 (en) 2003-04-09
DE69906673T2 (en) 2004-01-22
EP1013391A3 (en) 2000-08-23
MY137851A (en) 2009-03-31
DE69906673D1 (en) 2003-05-15

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