SE9400077D0 - Maskinkoncept - Google Patents

Maskinkoncept

Info

Publication number
SE9400077D0
SE9400077D0 SE9400077A SE9400077A SE9400077D0 SE 9400077 D0 SE9400077 D0 SE 9400077D0 SE 9400077 A SE9400077 A SE 9400077A SE 9400077 A SE9400077 A SE 9400077A SE 9400077 D0 SE9400077 D0 SE 9400077D0
Authority
SE
Sweden
Prior art keywords
pick
devices
pcb
axes
carrying
Prior art date
Application number
SE9400077A
Other languages
English (en)
Swedish (sv)
Inventor
Lennart Stridsberg
Original Assignee
Mytronic Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mytronic Ab filed Critical Mytronic Ab
Priority to SE9400077A priority Critical patent/SE9400077D0/xx
Publication of SE9400077D0 publication Critical patent/SE9400077D0/xx
Priority to DE69517676T priority patent/DE69517676T2/de
Priority to PCT/SE1995/000015 priority patent/WO1995019099A1/en
Priority to EP00106579A priority patent/EP1009211B1/en
Priority to DE69526381T priority patent/DE69526381T2/de
Priority to US08/669,414 priority patent/US5778524A/en
Priority to EP95906581A priority patent/EP0739580B1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49137—Different components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53187—Multiple station assembly apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/534—Multiple station assembly or disassembly apparatus
    • Y10T29/53409—Multiple station assembly or disassembly apparatus including converging conveyors
    • Y10T29/53413—Multiple station assembly or disassembly apparatus including converging conveyors and primary central conveyor

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Automatic Assembly (AREA)
SE9400077A 1994-01-10 1994-01-10 Maskinkoncept SE9400077D0 (sv)

Priority Applications (7)

Application Number Priority Date Filing Date Title
SE9400077A SE9400077D0 (sv) 1994-01-10 1994-01-10 Maskinkoncept
DE69517676T DE69517676T2 (de) 1994-01-10 1995-01-10 Verfahren und vorrichtung für die montage von komponenten
PCT/SE1995/000015 WO1995019099A1 (en) 1994-01-10 1995-01-10 A surface mount machine concept
EP00106579A EP1009211B1 (en) 1994-01-10 1995-01-10 A surface mount machine concept
DE69526381T DE69526381T2 (de) 1994-01-10 1995-01-10 Maschinenkonzept für Oberflächenmontage
US08/669,414 US5778524A (en) 1994-01-10 1995-01-10 Surface mount machine concept
EP95906581A EP0739580B1 (en) 1994-01-10 1995-01-10 Method and device for mounting components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9400077A SE9400077D0 (sv) 1994-01-10 1994-01-10 Maskinkoncept

Publications (1)

Publication Number Publication Date
SE9400077D0 true SE9400077D0 (sv) 1994-01-14

Family

ID=20392549

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9400077A SE9400077D0 (sv) 1994-01-10 1994-01-10 Maskinkoncept

Country Status (5)

Country Link
US (1) US5778524A (xx)
EP (2) EP1009211B1 (xx)
DE (2) DE69526381T2 (xx)
SE (1) SE9400077D0 (xx)
WO (1) WO1995019099A1 (xx)

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US6789310B1 (en) * 1995-11-06 2004-09-14 Matsushita Electric Industrial Co., Ltd. Component mounting apparatus
FI105315B (fi) * 1996-05-06 2000-07-14 Pmj Automec Oyj Laite piirilevyjen tai sen tapaisten levyjen valmistusvaiheiden automaattiseksi suorittamiseksi
US6066206A (en) 1997-02-21 2000-05-23 Speedline Technologies, Inc. Dual track stenciling system with solder gathering head
US6230393B1 (en) * 1997-07-07 2001-05-15 Matsushita Electric Industrial Co., Ltd. Method and device for mounting electronic component
US6007631A (en) † 1997-11-10 1999-12-28 Speedline Technologies, Inc. Multiple head dispensing system and method
JP4303345B2 (ja) * 1998-03-12 2009-07-29 Ｊｕｋｉ株式会社 表面実装部品搭載機
US6701610B1 (en) * 1998-07-28 2004-03-09 Koninklijke Philips Electronics N.V. Pick and place machine with varied nozzle lengths
DE19905958C1 (de) * 1999-02-12 2000-06-21 Siemens Ag Vorrichtung zum Bestücken von Substraten mit elektrischen Bauelementen mittels mehrerer unabhängiger Handhabungsssyteme
US6866881B2 (en) 1999-02-19 2005-03-15 Speedline Technologies, Inc. Dispensing system and method
DE50000651D1 (de) * 1999-03-08 2002-11-21 Siemens Dematic Ag Vorrichtung zum bestücken von substraten mit elektrischen bauelementen
US6054682A (en) * 1999-03-11 2000-04-25 Micron Electronics, Inc. Method and system for reducing water vapor in integrated circuit packages prior to reflow
SG111046A1 (en) 1999-05-21 2005-05-30 Matsushita Electric Ind Co Ltd Device and method for conveying and holding plate-like member
JP4551599B2 (ja) * 1999-11-05 2010-09-29 パナソニック株式会社 部品実装装置及び方法
US6836960B2 (en) * 2000-05-15 2005-01-04 Matsushita Electric Industrial Co., Ltd. Board transfer apparatus, board transfer method, and component mounting apparatus
JP4498561B2 (ja) * 2000-08-04 2010-07-07 富士機械製造株式会社 配線板支持装置の段取替え装置
KR100363898B1 (ko) * 2000-11-24 2002-12-11 미래산업 주식회사 표면실장장치 및 그 방법
KR100363902B1 (ko) * 2000-11-24 2002-12-11 미래산업 주식회사 표면실장장치 및 그 방법
EP1389344B1 (de) * 2001-05-23 2014-07-16 ASM Assembly Systems GmbH & Co. KG Bestücksystem und verfahren zum bestücken von substraten mit bauelementen
JP2004521512A (ja) * 2001-05-23 2004-07-15 シーメンス　アクチエンゲゼルシヤフト 基板に構成素子を実装するための実装システムおよび方法
DE10125398B4 (de) * 2001-05-23 2005-10-06 Siemens Ag Bestücksystem und Verfahren zum Bestücken von Substraten mit Bauelementen
US7082680B2 (en) * 2001-11-21 2006-08-01 Mirae Corporation Mounting method of electronic components
DE10201879A1 (de) * 2002-01-18 2003-08-07 Siemens Ag Bestückeinrichtung, Bestücksystem und Verfahren zum Bestücken von Substraten mit Bauelementen
DE10236004B4 (de) * 2002-08-06 2007-08-23 Siemens Ag Vorrichtung zum Bestücken von Substraten mit elektrischen Bauelementen
US6993818B2 (en) * 2003-03-17 2006-02-07 Memx, Inc. Multi-fixture assembly of cutting tools
EP1642486A1 (en) * 2003-07-03 2006-04-05 Assembléon N.V. Component placement device
DE112007001476T5 (de) 2006-07-31 2009-04-30 Panasonic Corporation, Kadoma-shi Verfahren zum Bestimmen der Montagebedingungen für Bauelemente
US7836582B2 (en) * 2006-12-12 2010-11-23 Universal Instruments Corporation Printed circuit board assembly machine
US8132317B2 (en) * 2007-06-11 2012-03-13 Research In Motion Limited Apparatus for manufacture of electronic assemblies
JP4957453B2 (ja) * 2007-08-23 2012-06-20 パナソニック株式会社 電子部品実装システムおよび電子部品実装方法
DE102009013353B3 (de) * 2009-03-16 2010-10-07 Siemens Aktiengesellschaft Verfahren zur Bestimmung von Rüstungen für konstante Tische von Bestückautomaten
JP5906399B2 (ja) * 2013-02-22 2016-04-20 パナソニックＩｐマネジメント株式会社 電子部品実装システムおよび電子部品実装方法

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GB2150098B (en) * 1983-11-24 1986-10-08 Dyna Pert Precima Limited Machine for placing electronic components on a substrate
US4631812A (en) * 1984-05-10 1986-12-30 Quad Systems Corporation Programmable substrate transport for electronic assembly
GB2173426A (en) * 1985-04-09 1986-10-15 Dynapert Precima Ltd Component placement machine
DE3586105D1 (de) * 1985-11-27 1992-06-25 Matsushita Electric Ind Co Ltd Montagevorrichtung.
EP0248904A4 (en) * 1985-11-27 1988-02-17 Matsushita Electric Ind Co Ltd PROCESS FOR PERFORMING OPERATIONS IN A MOUNTING INSTALLATION.
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KR900015590A (ko) * 1989-03-23 1990-10-27 프레데릭 얀 스미트 캐리어상에 부품을 배치하는 방법 및 그 방법을 수행하기 위한 장치
GB9000726D0 (en) * 1990-01-12 1990-03-14 Automation Tooling Syst System for mounting components on circuit boards
DE4002075A1 (de) * 1990-01-25 1991-08-08 Antriebs Steuerungstech Ges Handhabungsvorrichtung und verfahren zum handhaben von werkstuecken
FR2661311B1 (fr) * 1990-04-20 1992-08-07 Eurosoft Robotique Dispositif et procede de montage automatique de composants electroniques.
EP0497129B1 (de) * 1991-01-28 1995-07-26 Siemens Aktiengesellschaft Vorrichtung zum Bestücken von Leiterplatten
US5145052A (en) * 1991-04-10 1992-09-08 Axis Usa, Inc. Apparatus for substantially simultaneously processing multiple electric motor parts
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US5452509A (en) * 1992-01-21 1995-09-26 Yamaha Hatsudoki Kabushiki Kaisha Surface mounter
JP2767018B2 (ja) * 1993-02-26 1998-06-18 株式会社村田製作所 電子部品の組立方法および組立装置
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US5517748A (en) * 1994-10-07 1996-05-21 Samsung Electronics Co., Ltd. Apparatus for conveying circuit boards through a component-mounting station

Also Published As

Publication number Publication date
US5778524A (en) 1998-07-14
EP1009211A3 (en) 2000-07-12
DE69526381T2 (de) 2002-11-07
DE69517676T2 (de) 2000-12-28
DE69526381D1 (de) 2002-05-16
EP1009211B1 (en) 2002-04-10
EP0739580A1 (en) 1996-10-30
EP1009211A2 (en) 2000-06-14
WO1995019099A1 (en) 1995-07-13
DE69517676D1 (de) 2000-08-03
EP0739580B1 (en) 2000-06-28

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