SE8303489D0 - Electrical circuit assemblies - Google Patents

Electrical circuit assemblies

Info

Publication number
SE8303489D0
SE8303489D0 SE8303489A SE8303489A SE8303489D0 SE 8303489 D0 SE8303489 D0 SE 8303489D0 SE 8303489 A SE8303489 A SE 8303489A SE 8303489 A SE8303489 A SE 8303489A SE 8303489 D0 SE8303489 D0 SE 8303489D0
Authority
SE
Sweden
Prior art keywords
substrates
electrical circuit
stack
axis
stacks
Prior art date
Application number
SE8303489A
Other languages
English (en)
Other versions
SE8303489L (sv
SE456546B (sv
Inventor
H Mcpherson
Original Assignee
Ferranti Plc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ferranti Plc filed Critical Ferranti Plc
Publication of SE8303489D0 publication Critical patent/SE8303489D0/sv
Publication of SE8303489L publication Critical patent/SE8303489L/sv
Publication of SE456546B publication Critical patent/SE456546B/sv

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/144Stacked arrangements of planar printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
SE8303489A 1982-06-19 1983-06-17 Elektriska kretsanordningar SE456546B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8217817 1982-06-19

Publications (3)

Publication Number Publication Date
SE8303489D0 true SE8303489D0 (sv) 1983-06-17
SE8303489L SE8303489L (sv) 1983-12-20
SE456546B SE456546B (sv) 1988-10-10

Family

ID=10531161

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8303489A SE456546B (sv) 1982-06-19 1983-06-17 Elektriska kretsanordningar

Country Status (3)

Country Link
US (1) US4587594A (sv)
DE (1) DE3321321A1 (sv)
SE (1) SE456546B (sv)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3611658A1 (de) * 1985-04-05 1986-10-16 Omron Tateisi Electronics Co., Kyoto Elektronikbauteilaufbau
EP0204568A3 (en) * 1985-06-05 1988-07-27 Harry Arthur Hele Spence-Bate Low power circuitry components
US4800956A (en) * 1986-04-25 1989-01-31 Digital Equipment Corporation Apparatus and method for removal of heat from packaged element
US4739188A (en) * 1986-06-23 1988-04-19 Fl Industries, Inc. Starting circuit enclosure
DE3805851A1 (de) * 1988-02-25 1989-08-31 Standard Elektrik Lorenz Ag Leiterplatte mit einer kuehlvorrichtung
US4862322A (en) * 1988-05-02 1989-08-29 Bickford Harry R Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween
US4950181A (en) * 1988-07-28 1990-08-21 Ncr Corporation Refrigerated plug-in module
JP2760829B2 (ja) * 1989-01-13 1998-06-04 株式会社日立製作所 電子基板
DE4015788C2 (de) * 1990-05-16 1994-06-23 Siemens Nixdorf Inf Syst Baugruppe
JPH07505490A (ja) * 1992-03-17 1995-06-15 マサチユセツツ・インスチチユート・オブ・テクノロジー 低近接3次元インターコネクト
US5676198A (en) * 1994-11-15 1997-10-14 Sundstrand Corporation Cooling apparatus for an electronic component
RU2133523C1 (ru) * 1997-11-03 1999-07-20 Закрытое акционерное общество "Техно-ТМ" Трехмерный электронный модуль
RU2119276C1 (ru) * 1997-11-03 1998-09-20 Закрытое акционерное общество "Техно-ТМ" Трехмерный гибкий электронный модуль
RU2176134C2 (ru) 1998-07-02 2001-11-20 Закрытое акционерное общество "Техно-ТМ" Трехмерный электронный модуль и способ его изготовления
JP4493251B2 (ja) * 2001-12-04 2010-06-30 Toto株式会社 静電チャックモジュールおよび基板処理装置
EP1475836B1 (en) * 2003-05-08 2006-05-03 Infineon Technologies AG Circuit module having interleaved groups of circuit chips
CN1779890B (zh) * 2004-11-26 2010-09-08 乐金电子(天津)电器有限公司 磁控管冷却栓
DE102015225681A1 (de) * 2015-12-17 2017-06-22 Robert Bosch Gmbh Elektrische Vorrichtung mit einer Kühleinheit

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2931003A (en) * 1955-09-27 1960-03-29 Mallory & Co Inc P R Spring pin cascaded circuit cards
DE1150721B (de) * 1960-01-18 1963-06-27 Siemens Ag Miniaturbaugruppen besonders kleinen Raumbedarfs
DE1150725B (de) * 1961-08-16 1963-06-27 Siemens Ag Elektrisches Bauelement der Fernmeldetechnik und Elektronik
FR1493471A (fr) * 1966-05-05 1967-09-01 Radiotechnique Coprim Rtc Procédé d'assemblage de dispositifs électroniques comportant une pluralité de plaquettes parallèles
US3406368A (en) * 1966-05-16 1968-10-15 Solitron Devices Interconnection system
US3467892A (en) * 1968-01-25 1969-09-16 Burroughs Corp Electrical module and system
FR2085476A1 (sv) * 1970-04-24 1971-12-24 Bull General Electric
US3643135A (en) * 1970-06-29 1972-02-15 Ibm Triaxially expandable circuit arrays
US3691432A (en) * 1970-11-12 1972-09-12 Honeywell Inf Systems Computer package cabinet and module system
US3684943A (en) * 1971-02-01 1972-08-15 Gen Electric Converter valve-pair arrangement
GB1336076A (en) * 1971-06-10 1973-11-07 Int Computers Ltd Apparatus for cooling electrical circuit components
GB1326972A (en) * 1972-03-16 1973-08-15 Elliott Brothers London Ltd Electrical circuit assemblies
FR2184443B1 (sv) * 1972-05-17 1978-12-08 Cii Honeywell Bull
US3829598A (en) * 1972-09-25 1974-08-13 Hutson Ind Inc Copper heat sinks for electronic devices and method of making same
US3999105A (en) * 1974-04-19 1976-12-21 International Business Machines Corporation Liquid encapsulated integrated circuit package
US3949274A (en) * 1974-05-30 1976-04-06 International Business Machines Corporation Packaging and interconnection for superconductive circuitry
US3967874A (en) * 1975-09-30 1976-07-06 Calabro Anthony Denis Uniformly cooled printed circuit board mounting assembly
FR2340018A1 (fr) * 1976-01-29 1977-08-26 Alsthom Cgee Systeme mecanique de support de cartes de circuits imprimes
US4103737A (en) * 1976-12-16 1978-08-01 Marantz Company, Inc. Heat exchanger structure for electronic apparatus
DE7909731U1 (de) * 1978-04-10 1979-09-13 N.V. Philips' Gloeilampenfabrieken, Eindhoven (Niederlande) Vorrichtung für ein datenverarbeitendes System
GB2052164B (en) * 1979-06-30 1983-12-07 Burroughs Corp Assemblies of electrical components
GB2059569B (en) * 1979-09-12 1983-04-13 Racal Communications Equip Cooling apparatus
DE2939088C2 (de) * 1979-09-27 1988-07-28 Rohde & Schwarz GmbH & Co KG, 8000 München Einrichtung zum Abführen der Verlustleistungswärme von in einem Schrankgestell eingebauten elektronischen Geräteeinschüben
US4291364A (en) * 1979-12-26 1981-09-22 International Business Machines Corporation Air-cooled hybrid electronic package

Also Published As

Publication number Publication date
DE3321321C2 (sv) 1989-07-27
SE8303489L (sv) 1983-12-20
DE3321321A1 (de) 1983-12-22
SE456546B (sv) 1988-10-10
US4587594A (en) 1986-05-06

Similar Documents

Publication Publication Date Title
SE8303489D0 (sv) Electrical circuit assemblies
US4823233A (en) Circuit assembly
US3277346A (en) Cooler package for electronic components
US3240628A (en) Thermoelectric panel
CA1198224A (en) Heat pipe cooling module for high power circuit boards
US3040538A (en) Thermoelectric air conditioning unit
US4322776A (en) Thermal interconnection
KR970072372A (ko) 스택 모듈
WO1990007255A1 (en) Cooling plate with interboard connector apertures
DE3682797D1 (de) Kuehlungsstruktur fuer halbleitermodul.
SE7903442L (sv) Anordning vid vermevexlare
DE3674927D1 (de) Plattenwaermeaustauscher.
US5283716A (en) Electrical component support structure
GB1172332A (en) Improvements in or relating to Heat Dissipating Devices for Semiconductors and the like
JPS6453440A (en) Three-dimensional semiconductor integrated circuit device
GB2095039A (en) Circuit assembly
SE8103779L (sv) Kylkropp for halvledare eller liknande
DE2621705C3 (de) Wärmeabführendes Gehäuse
ATE26520T1 (de) Baugruppentraeger.
US3304207A (en) Thermoelectric generator
GB2122032A (en) Electrical circuit assemblies
JPH0563118B2 (sv)
SU1457018A1 (ru) Полупроводниковый модуль силовой электропреобразовательной установки
WO2023090646A1 (ko) 파워 모듈을 위한 히트싱크
DK421083D0 (da) Gulvvarmeindretning

Legal Events

Date Code Title Description
NUG Patent has lapsed

Ref document number: 8303489-2

Effective date: 19910131

Format of ref document f/p: F