SE7902014L - Plastinklett skivformat halvledarelement for stor effekt - Google Patents
Plastinklett skivformat halvledarelement for stor effektInfo
- Publication number
- SE7902014L SE7902014L SE7902014A SE7902014A SE7902014L SE 7902014 L SE7902014 L SE 7902014L SE 7902014 A SE7902014 A SE 7902014A SE 7902014 A SE7902014 A SE 7902014A SE 7902014 L SE7902014 L SE 7902014L
- Authority
- SE
- Sweden
- Prior art keywords
- pair
- edge region
- semiconductor device
- metal bodies
- large power
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2810416A DE2810416C2 (de) | 1978-03-10 | 1978-03-10 | Halbleiterbauelement mit Kunststoffummantelung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| SE7902014L true SE7902014L (sv) | 1979-09-11 |
| SE435771B SE435771B (sv) | 1984-10-15 |
Family
ID=6034077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE7902014A SE435771B (sv) | 1978-03-10 | 1979-03-06 | Skivformat halvledarelement som er tett omslutet av en plastmantel |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4240099A (sv) |
| JP (1) | JPS54124973A (sv) |
| DE (1) | DE2810416C2 (sv) |
| FR (1) | FR2419587A1 (sv) |
| GB (1) | GB2016807B (sv) |
| SE (1) | SE435771B (sv) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2915862C2 (de) * | 1979-04-19 | 1985-04-25 | Siemens AG, 1000 Berlin und 8000 München | Halbleiterbauelement mit scheibenförmigem Gehäuse |
| JPS57143849A (en) * | 1981-03-02 | 1982-09-06 | Toshiba Corp | Flat semiconductor element |
| US4582556A (en) * | 1982-11-22 | 1986-04-15 | Olin Corporation | Adhesion primers for encapsulating epoxies |
| US4521469A (en) * | 1982-11-22 | 1985-06-04 | Olin Corporation | Casing for electronic components |
| US4525422A (en) * | 1982-11-22 | 1985-06-25 | Olin Corporation | Adhesion primers for encapsulating epoxies |
| DE4227063A1 (de) * | 1992-08-15 | 1994-02-17 | Abb Research Ltd | Abschaltbares Hochleistungs-Halbleiterbauelement |
| US6703707B1 (en) * | 1999-11-24 | 2004-03-09 | Denso Corporation | Semiconductor device having radiation structure |
| US7145254B2 (en) * | 2001-07-26 | 2006-12-05 | Denso Corporation | Transfer-molded power device and method for manufacturing transfer-molded power device |
| US7132698B2 (en) * | 2002-01-25 | 2006-11-07 | International Rectifier Corporation | Compression assembled electronic package having a plastic molded insulation ring |
| KR20040006636A (ko) * | 2002-07-13 | 2004-01-24 | 천기완 | 전자장치의 수냉식 연질 냉각재킷 및 이를 이용한 완충재킷 |
| US7382059B2 (en) * | 2005-11-18 | 2008-06-03 | Semiconductor Components Industries, L.L.C. | Semiconductor package structure and method of manufacture |
| JP5126278B2 (ja) * | 2010-02-04 | 2013-01-23 | 株式会社デンソー | 半導体装置およびその製造方法 |
| DE102015223415A1 (de) * | 2015-11-26 | 2017-06-01 | Robert Bosch Gmbh | Verfahren zur Herstellung einer elektrischen Vorrichtung mit einer Umhüllmasse |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB555876A (en) * | 1942-04-27 | 1943-09-10 | Percy Archibald Sporing | Improvements in or relating to electric terminals |
| GB737855A (en) * | 1952-12-19 | 1955-10-05 | Philips Nv | Improvements in or relating to bodies comprising a synthetic resin mass having a metal article partly embedded therein |
| US3437887A (en) * | 1966-06-03 | 1969-04-08 | Westinghouse Electric Corp | Flat package encapsulation of electrical devices |
| FR1531714A (fr) * | 1966-06-03 | 1968-07-05 | Westinghouse Electric Corp | Dispositif semi-conducteur du type à disques |
| GB1191232A (en) * | 1968-02-14 | 1970-05-13 | Westinghouse Brake & Signal | Semiconductor Devices and Their Manufacture |
| US3559001A (en) * | 1968-08-21 | 1971-01-26 | Motorola Inc | Semiconductor housing assembly |
| JPS4826675B1 (sv) * | 1968-10-16 | 1973-08-14 | ||
| DE2014289A1 (de) * | 1970-03-25 | 1971-10-14 | Semikron Gleichrichterbau | Scheibenförmiges Halbleiterbauele ment und Verfahren zu seiner Herstellung |
| US3831067A (en) * | 1972-05-15 | 1974-08-20 | Int Rectifier Corp | Semiconductor device with pressure connection electrodes and with headers cemented to insulation ring |
| DE2364728A1 (de) * | 1973-12-27 | 1975-07-03 | Licentia Gmbh | Scheibenfoermiges halbleiterbauelement grosser leistungsfaehigkeit mit kunststoffummantelung |
| US4008486A (en) * | 1975-06-02 | 1977-02-15 | International Rectifier Corporation | Compression-assembled semiconductor device with nesting circular flanges and flexible locating ring |
-
1978
- 1978-03-10 DE DE2810416A patent/DE2810416C2/de not_active Expired
-
1979
- 1979-03-01 FR FR7905400A patent/FR2419587A1/fr active Granted
- 1979-03-06 SE SE7902014A patent/SE435771B/sv not_active IP Right Cessation
- 1979-03-07 JP JP2570379A patent/JPS54124973A/ja active Granted
- 1979-03-07 GB GB7908049A patent/GB2016807B/en not_active Expired
- 1979-03-12 US US06/019,607 patent/US4240099A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6136710B2 (sv) | 1986-08-20 |
| FR2419587A1 (fr) | 1979-10-05 |
| SE435771B (sv) | 1984-10-15 |
| GB2016807B (en) | 1982-07-21 |
| JPS54124973A (en) | 1979-09-28 |
| US4240099A (en) | 1980-12-16 |
| GB2016807A (en) | 1979-09-26 |
| DE2810416C2 (de) | 1983-09-01 |
| DE2810416A1 (de) | 1979-09-13 |
| FR2419587B1 (sv) | 1985-03-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SE7902014L (sv) | Plastinklett skivformat halvledarelement for stor effekt | |
| SE7906395L (sv) | Drivladdningstendare | |
| SE8106889L (sv) | Berelement for komponenter i form av integrerade kretsar | |
| IT7921287A0 (it) | Valvola per servosterzo eprocedimento di fabbricazione relativo. | |
| NO792152L (no) | Elektrisk kontaktinnretning. | |
| SE7711731L (sv) | Vermeavledande plastholje for en integrerad krets | |
| ATE21539T1 (de) | Druckentlastungsvorrichtung. | |
| ES300088A1 (es) | Procedimiento de fabricaciën de un elemento intercambiador de calor y elemento intercambiador obtenido por el procedimiento | |
| ATE1727T1 (de) | Leistungs-halbleiterbauelement. | |
| ES2014281B3 (es) | Jaula | |
| ES464364A1 (es) | Perfeccionamientos en dispositivos para la fabricacion de elementos de tuberias | |
| SE7710046L (sv) | Halvledarelement | |
| IT963530B (it) | Dispositivo semiconduttore senza fatica termica | |
| IT7926674A0 (it) | Procedimento di applicazione della vetrinatura su materiali ceramici in un campo elettrico. | |
| NO148905C (no) | Elektrisk kontaktanordning. | |
| IT7947513A0 (it) | Valvola di limitazione di pressione e di corrente precomandata | |
| NO790448L (no) | Elektrisk kontakt-innretning. | |
| JPS52114285A (en) | Mis type semiconductor device | |
| IT979053B (it) | Circuito integrato con strati di materiale semiconduttore su un substrato isolante | |
| IT7927011A0 (it) | Materiale di contatto per dispositivo elettrico eprocedimento di fabbricazione. | |
| JPS5576742A (en) | Power doubling device | |
| JPS5270766A (en) | Semiconductor device | |
| JPS5629351A (en) | Semiconductor device | |
| IT7921414A0 (it) | Valvola per servosterzo eprocedimento di fabbricazione relativo. | |
| JPS5530542A (en) | Cylindrical surface seal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| NUG | Patent has lapsed |
Ref document number: 7902014-5 Effective date: 19921005 Format of ref document f/p: F |