SE7709310L - Kylt kretspaket och metod for tillverkning derav - Google Patents

Kylt kretspaket och metod for tillverkning derav

Info

Publication number
SE7709310L
SE7709310L SE7709310A SE7709310A SE7709310L SE 7709310 L SE7709310 L SE 7709310L SE 7709310 A SE7709310 A SE 7709310A SE 7709310 A SE7709310 A SE 7709310A SE 7709310 L SE7709310 L SE 7709310L
Authority
SE
Sweden
Prior art keywords
chip
heat
solder
cover
metallurgically bonded
Prior art date
Application number
SE7709310A
Other languages
English (en)
Other versions
SE435126B (sv
Inventor
N G Koopman
P A Totta
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of SE7709310L publication Critical patent/SE7709310L/sv
Publication of SE435126B publication Critical patent/SE435126B/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
    • H01L2224/13109—Indium [In] as principal constituent
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    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/732—Location after the connecting process
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    • H01L2224/73257—Bump and wire connectors
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
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    • H01L2924/1025—Semiconducting materials
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
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    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
SE7709310A 1976-09-03 1977-08-18 Kylt kretspaket och metod for framstellning derav SE435126B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/720,471 US4034469A (en) 1976-09-03 1976-09-03 Method of making conduction-cooled circuit package

Publications (2)

Publication Number Publication Date
SE7709310L true SE7709310L (sv) 1978-03-04
SE435126B SE435126B (sv) 1984-09-03

Family

ID=24894127

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7709310A SE435126B (sv) 1976-09-03 1977-08-18 Kylt kretspaket och metod for framstellning derav

Country Status (9)

Country Link
US (2) US4034469A (sv)
JP (1) JPS5928989B2 (sv)
AR (1) AR219299A1 (sv)
BE (1) BE857399A (sv)
CA (1) CA1093699A (sv)
FR (1) FR2363892A1 (sv)
GB (1) GB1569453A (sv)
IT (1) IT1114116B (sv)
SE (1) SE435126B (sv)

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US4279292A (en) * 1978-09-29 1981-07-21 The United States Of America As Represented By The Secretary Of The Navy Charge coupled device temperature gradient and moisture regulator
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US4237086A (en) * 1979-02-22 1980-12-02 Rockwell International Corporation Method for releasably mounting a substrate on a base providing heat transfer and electrical conduction
DE2926785C2 (de) * 1979-07-03 1985-12-12 HIGRATHERM electric GmbH, 7100 Heilbronn Bipolarer Transistor und Verfahren zu seiner Herstellung
US4388967A (en) * 1980-09-02 1983-06-21 Thermalloy Incorporated Solderable mounting stakes for heat sinks
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US5032897A (en) * 1990-02-28 1991-07-16 International Business Machines Corp. Integrated thermoelectric cooling
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US5339216A (en) * 1993-03-02 1994-08-16 National Semiconductor Corporation Device and method for reducing thermal cycling in a semiconductor package
US5730636A (en) * 1995-09-29 1998-03-24 Micron Display Technology, Inc. Self-dimensioning support member for use in a field emission display
US5808874A (en) 1996-05-02 1998-09-15 Tessera, Inc. Microelectronic connections with liquid conductive elements
US6016006A (en) * 1996-06-24 2000-01-18 Intel Corporation Thermal grease insertion and retention
TW406454B (en) 1996-10-10 2000-09-21 Berg Tech Inc High density connector and method of manufacture
US5891753A (en) * 1997-01-24 1999-04-06 Micron Technology, Inc. Method and apparatus for packaging flip chip bare die on printed circuit boards
US5796038A (en) * 1997-06-16 1998-08-18 Vlsi Technology, Inc. Technique to produce cavity-up HBGA packages
US5981310A (en) * 1998-01-22 1999-11-09 International Business Machines Corporation Multi-chip heat-sink cap assembly
US6117797A (en) 1998-09-03 2000-09-12 Micron Technology, Inc. Attachment method for heat sinks and devices involving removal of misplaced encapsulant
US6214647B1 (en) 1998-09-23 2001-04-10 International Business Machines Corporation Method for bonding heatsink to multiple-height chip
US5986887A (en) * 1998-10-28 1999-11-16 Unisys Corporation Stacked circuit board assembly adapted for heat dissipation
US6084775A (en) * 1998-12-09 2000-07-04 International Business Machines Corporation Heatsink and package structures with fusible release layer
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Also Published As

Publication number Publication date
IT1114116B (it) 1986-01-27
FR2363892A1 (fr) 1978-03-31
AR219299A1 (es) 1980-08-15
US4081825A (en) 1978-03-28
JPS5928989B2 (ja) 1984-07-17
FR2363892B1 (sv) 1979-03-02
US4034469A (en) 1977-07-12
BE857399A (fr) 1977-12-01
CA1093699A (en) 1981-01-13
JPS5331968A (en) 1978-03-25
SE435126B (sv) 1984-09-03
GB1569453A (en) 1980-06-18

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