JPS6477998A - Heat radiating device for heating part - Google Patents

Heat radiating device for heating part

Info

Publication number
JPS6477998A
JPS6477998A JP23514187A JP23514187A JPS6477998A JP S6477998 A JPS6477998 A JP S6477998A JP 23514187 A JP23514187 A JP 23514187A JP 23514187 A JP23514187 A JP 23514187A JP S6477998 A JPS6477998 A JP S6477998A
Authority
JP
Japan
Prior art keywords
board
metal piece
chip
alumina
heating part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23514187A
Other languages
Japanese (ja)
Inventor
Susumu Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP23514187A priority Critical patent/JPS6477998A/en
Publication of JPS6477998A publication Critical patent/JPS6477998A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PURPOSE:To improve a heat radiating effect without decreasing the reliability of soldering of a heating part and without imparting adverse effect on a board itself, by mounting a metal piece, on the opposite surface of the board, on which a chip is mounted. CONSTITUTION:A circuit is formed on a board 2 comprising alumina base material by thick film printing of copper conductor. A bear chip of an IC is mounted on one surface. A square shaped metal piece 5 is fixed to the opposite surface of the board 2 through the thickness of the board 2 by soldering. At this time, Fe/Ni material having the approximately same thermal expansion coefficient as that of the alumina base material is used for the metal piece 5. The reason is as follows: when the difference between the thermal expansion coefficient of the alumina board 2 and the metal piece 5 is large, deviation stress is applied between the alumina board 2 and metal piece 5 by the repetition of heating and cooling of the IC bear chip 1, and cracks due to metal fatigue of a solder 9 is yielded. Therefore the heat of the heating part such as the IC chip is dissipated from the metal piece, which is mounted on the rear surface through the board. Thus the temperature increase of the IC chip itself and the board can be alleviated very effectively.
JP23514187A 1987-09-18 1987-09-18 Heat radiating device for heating part Pending JPS6477998A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23514187A JPS6477998A (en) 1987-09-18 1987-09-18 Heat radiating device for heating part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23514187A JPS6477998A (en) 1987-09-18 1987-09-18 Heat radiating device for heating part

Publications (1)

Publication Number Publication Date
JPS6477998A true JPS6477998A (en) 1989-03-23

Family

ID=16981660

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23514187A Pending JPS6477998A (en) 1987-09-18 1987-09-18 Heat radiating device for heating part

Country Status (1)

Country Link
JP (1) JPS6477998A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0348451A (en) * 1989-07-17 1991-03-01 Nec Corp Mounting structure of heat sink for surface mount semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0348451A (en) * 1989-07-17 1991-03-01 Nec Corp Mounting structure of heat sink for surface mount semiconductor device

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