JPS5645061A - Protective device for semiconductor and manufacture therefor - Google Patents
Protective device for semiconductor and manufacture thereforInfo
- Publication number
- JPS5645061A JPS5645061A JP12099379A JP12099379A JPS5645061A JP S5645061 A JPS5645061 A JP S5645061A JP 12099379 A JP12099379 A JP 12099379A JP 12099379 A JP12099379 A JP 12099379A JP S5645061 A JPS5645061 A JP S5645061A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- thermal fuse
- printed board
- protective device
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/62—Protection against overvoltage, e.g. fuses, shunts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE:To protect a semiconductor and a thermal fuse from heating by inserting a wedge between a printed substrate and a semiconductor for close adhesion. CONSTITUTION:A semiconductor 2 is soldered on a printed board 1 for conductive connection. A thermal fuse 4 is conductively connected to the printed board 1 by closely adhering or moving to the heat sink section 3 of the semiconductor 2. Next, with a wedge inserted between the printed board 1 and the semiconductor 2 by pressing, the semiconductor 2 and the thermal fuse 4 will stably and closely be adhered. In this composition, easy work and sure adhesion are attained and heating will be protected with high reliability.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12099379A JPS5645061A (en) | 1979-09-19 | 1979-09-19 | Protective device for semiconductor and manufacture therefor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12099379A JPS5645061A (en) | 1979-09-19 | 1979-09-19 | Protective device for semiconductor and manufacture therefor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5645061A true JPS5645061A (en) | 1981-04-24 |
Family
ID=14800118
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12099379A Pending JPS5645061A (en) | 1979-09-19 | 1979-09-19 | Protective device for semiconductor and manufacture therefor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5645061A (en) |
-
1979
- 1979-09-19 JP JP12099379A patent/JPS5645061A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS57201058A (en) | Insulated semiconductor device | |
JPS57130441A (en) | Integrated circuit device | |
FR2363891B1 (en) | ||
MY115175A (en) | Semiconductor chip package with enhanced thermal conductivity | |
EP0031448A3 (en) | Thermal conduction module for integrated circuit chips | |
JPS5762539A (en) | Mounting method for semiconductor element | |
JPS57107063A (en) | Semiconductor package | |
JPS54124678A (en) | Lead frame | |
EP0233824A3 (en) | Microcircuit package | |
JPS5645061A (en) | Protective device for semiconductor and manufacture therefor | |
JPS6481330A (en) | Film carrier semiconductor device | |
JPS6459841A (en) | Semiconductor device | |
WO1999038196A3 (en) | Electronic devices having thermodynamic encapsulant portions predominating over thermostatic encapsulant portions | |
JPS55107251A (en) | Electronic part and its packaging construction | |
JPS53110371A (en) | Ceramic package type semiconductor device | |
JPS53124072A (en) | Semiconductor device | |
JPS57184239A (en) | Substrate for semiconductor device | |
JPS5488081A (en) | Mounting method of semiconductor device | |
JPS57114242A (en) | Semiconductor device | |
JPS55128837A (en) | Base for mounting semiconductor chip | |
JPS56161662A (en) | Semiconductor device | |
JPS5440583A (en) | Semiconductor device | |
JPS6459895A (en) | Electronic part mounting device | |
JPS54153586A (en) | Semiconductor device | |
JPS5394885A (en) | Mount structure for semiconductor laser element |