JPH053383A - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPH053383A JPH053383A JP15322291A JP15322291A JPH053383A JP H053383 A JPH053383 A JP H053383A JP 15322291 A JP15322291 A JP 15322291A JP 15322291 A JP15322291 A JP 15322291A JP H053383 A JPH053383 A JP H053383A
- Authority
- JP
- Japan
- Prior art keywords
- potting material
- printed board
- circuit board
- printed circuit
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、各種電子機器に搭載さ
れ、発熱性の半導体素子等の搭載部品（電子部品）が実
装されたプリント基板に係り、特に、搭載部品の冷却を
効果的に行うことができるプリント基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board mounted on various electronic devices and mounted with mounting components (electronic components) such as heat-generating semiconductor elements, and more particularly to effectively cool the mounting components. A printed circuit board that can be made.
【０００２】[0002]
【従来の技術】プリント基板に搭載された発熱性の半導
体素子等の搭載部品を冷却する技術が、例えば実開平１
−８６２９５号公報に記載されている。ここでは、搭載
部品を実装したプリント基板全面に軟粘性樹脂を被覆し
て（この被覆した軟粘性材料を以下「ポッティング材」
と称す）、このポッティング材の表面を空気、水等の冷
媒を介して熱伝導により冷却する技術が開示されてい
る。2. Description of the Related Art A technique for cooling mounted components such as heat-generating semiconductor elements mounted on a printed circuit board is disclosed in
-86295. Here, the entire surface of the printed circuit board on which the mounted components are mounted is coated with a soft-viscosity resin (this coated soft-viscosity material is referred to as "potting material" hereinafter).
(Referred to as "), a technique of cooling the surface of this potting material by heat conduction through a refrigerant such as air or water is disclosed.
【０００３】[0003]
【発明が解決しようとする課題】上記従来技術では、搭
載部品の通電部分を含めたプリント基板全面をポッティ
ング材で覆っていたので、電子回路にインピーダンスア
ンマッチ、クロストーク、信号遅延等の電気的悪影響を
及ぼすという問題があった。また、プリント基板に半田
付けされた半導体素子のリード端子とポッティング材と
の熱膨張差により、半田付け部へストレスが加わり、リ
ード端子の半田部に破断が生じるという問題があった。
従来技術では、これらの対策について考慮されておら
ず、また、自然空冷、強制空冷等に関する冷却方法につ
いても開示されていなかった。In the above-mentioned prior art, since the entire surface of the printed circuit board including the energized parts of the mounted parts is covered with the potting material, the electronic circuit is adversely affected by electrical impedance such as impedance mismatch, crosstalk and signal delay. There was a problem of affecting. In addition, there is a problem that a stress is applied to the soldering portion due to a difference in thermal expansion between the lead terminal of the semiconductor element soldered to the printed board and the potting material, and the soldering portion of the lead terminal is broken.
In the prior art, these measures have not been taken into consideration, nor has a cooling method for natural air cooling, forced air cooling, etc. been disclosed.
【０００４】本発明の目的は、ポッティング材による上
記の電気的悪影響や機械的悪影響を排除することがで
き、空気冷却にも対応可能なプリント基板を提供するこ
とにある。An object of the present invention is to provide a printed circuit board which can eliminate the above-mentioned electrical and mechanical adverse effects due to the potting material and can be used for air cooling.
【０００５】[0005]
【課題を解決するための手段】上記の目的を達成するた
めに、本発明のプリント基板は、冷却用のポッティング
材を半導体素子のリード端子等の搭載部品の通電部分を
除いて上記プリント基板上に被覆したことを要旨とす
る。In order to achieve the above object, the printed circuit board of the present invention has a cooling potting material on the printed circuit board except for the energized portions of mounted components such as lead terminals of semiconductor elements. The gist is that it is coated.
【０００６】また、放熱片の一部を上記ポッティング材
に埋め込み、該放熱片を該ポッティング材の表面から突
出させたことを特徴とする。Further, a part of the heat dissipation piece is embedded in the potting material, and the heat dissipation piece is projected from the surface of the potting material.
【０００７】また、上記ポッティング材の表面に凹凸を
設け、該表面積を増加したことを特徴とする。Also, the surface of the potting material is increased by providing irregularities on the surface thereof.
【０００８】さらに、冷媒が流れるように構成した管の
少なくとも一部を上記ポッティング材に埋め込んだこと
を特徴とする。Further, the invention is characterized in that at least a part of the pipe configured to allow the refrigerant to flow is embedded in the potting material.
【０００９】[0009]
【作用】本発明では、搭載部品の通電部分を除いてポッ
ティング材を被覆するので、ポッティング材が電子回路
の誘電体とならないため、電子回路に上記電気的悪影響
を及ぼすことなく、すべての搭載部品の温度上昇を抑制
することができる。また、プリント基板に半田付けされ
た半導体素子のリード端子部のポッティング材を除いた
ので、該リード端子とポッティング材との熱膨張差に起
因するリード端子の半田部破断等の機械的悪影響も排除
することができる。According to the present invention, since the potting material is covered except for the energized portions of the mounted parts, the potting material does not serve as a dielectric of the electronic circuit, so that the electronic circuit is not adversely affected by the above-mentioned electrical adverse effects. It is possible to suppress the temperature rise. Further, since the potting material of the lead terminal portion of the semiconductor element soldered to the printed circuit board is removed, mechanical adverse effects such as breakage of the solder portion of the lead terminal due to the difference in thermal expansion between the lead terminal and the potting material are also eliminated. can do.
【００１０】また、ポッティング材に放熱片を設けた
り、ポッティング材の表面積を増やしたり、あるいは冷
媒が流れる管をポッティング材に埋め込むことによっ
て、搭載部品を効果的に冷却することができるプリント
基板を提供することができる。Further, by providing a heat radiating piece on the potting material, increasing the surface area of the potting material, or embedding a pipe through which a coolant flows in the potting material, a printed circuit board capable of effectively cooling mounted components is provided. can do.
【００１１】[0011]
【実施例】実施例１
図１は、本発明の第１の実施例のプリント基板の断面図
である。EXAMPLE 1 FIG. 1 is a sectional view of a printed circuit board according to a first example of the present invention.
【００１２】１はプリント基板、２はプリント基板１の
片面に搭載した半導体素子、３は半導体素子２のリード
端子、４は半導体素子２のリード端子３等の通電部位を
除いてプリント基板１上に被覆した例えばシリコン等の
熱伝導性の良い軟粘性樹脂からなるポッティング材、５
はポッティング材の表面を冷却するための水、空気等の
冷媒、６はポッティング材４をプリント基板１に支持、
固定するための金属板等からなる支持部材である。1 is a printed board, 2 is a semiconductor element mounted on one side of the printed board 1, 3 is a lead terminal of the semiconductor element 2, 4 is a lead terminal 3 of the semiconductor element 2, etc. A potting material 5 made of a soft viscous resin with good thermal conductivity such as silicon
Is a coolant such as water or air for cooling the surface of the potting material, 6 is the potting material 4 supported on the printed circuit board 1,
It is a supporting member made of a metal plate or the like for fixing.
【００１３】半導体素子２等の搭載部品から発生する熱
は、ポッティング材４に熱伝導し、冷媒５で吸収され、
半導体素子２は冷却され、温度上昇を抑えられる。な
お、半導体素子２のリード端子３はポッティング材４と
接していないので、ポッティング材４が電子回路の誘電
体とならず、電子回路へのインピーダンスアンマッチ、
クロストーク、信号遅延等の電気的悪影響を抑制するこ
とができる。また、半導体素子２のリード端子３の回り
にはポッティング材４が存在しないので、リード端子３
とポッティング材４との熱膨張差に起因するリード端子
３の半田部破断等の機械的悪影響も抑制することができ
る。The heat generated from the mounted parts such as the semiconductor element 2 is conducted to the potting material 4 and absorbed by the coolant 5.
The semiconductor element 2 is cooled and the temperature rise can be suppressed. Since the lead terminal 3 of the semiconductor element 2 is not in contact with the potting material 4, the potting material 4 does not serve as a dielectric of the electronic circuit, and impedance unmatching to the electronic circuit,
Electrical adverse effects such as crosstalk and signal delay can be suppressed. Further, since the potting material 4 does not exist around the lead terminals 3 of the semiconductor element 2, the lead terminals 3
It is also possible to suppress mechanical adverse effects such as breakage of the solder portion of the lead terminal 3 caused by the difference in thermal expansion between the potting material 4 and the potting material 4.
【００１４】なお、図１に示すように、ポッティング材
４の表面に冷媒５を直接流すように構成してもよいし、
冷媒が通る管や、冷却部材をポッティング材４上に設置
してもよい。また、ポッティング材４が搭載部品の通電
部分と接触しないので、ポッティング材４に熱伝導性の
高い金属粉や金属繊維を混入することができ、ポッティ
ング材４の熱伝導率を向上することができるので、放熱
量を増加し、冷却効果を向上することができる。したが
って、ファンを使用する強制空冷を行わない自然空冷や
水冷方式を採用することができるので、低騒音化、省エ
ネルギー化を図ることができる。It should be noted that, as shown in FIG. 1, the cooling medium 5 may be made to flow directly on the surface of the potting material 4,
A pipe through which the refrigerant passes or a cooling member may be installed on the potting material 4. Further, since the potting material 4 does not come into contact with the energized portion of the mounted component, it is possible to mix metal powder or metal fiber having high thermal conductivity into the potting material 4 and improve the thermal conductivity of the potting material 4. Therefore, the amount of heat radiation can be increased and the cooling effect can be improved. Therefore, since it is possible to adopt a natural air cooling or a water cooling system that does not perform forced air cooling using a fan, it is possible to reduce noise and save energy.
【００１５】次に、上記実施例のようにポッティング材
を搭載部品の通電部分を除いてプリント基板上に被覆す
る方法について述べる。まず、所定の容器にポッティン
グ材となる軟粘性樹脂を所定の量満たしておき、プリン
ト基板の搭載部品が搭載された側を下面にして、搭載部
品の通電部分を除いてポッティング材が被覆できる深さ
までプリント基板を浸漬し、樹脂を硬化させる。硬化し
たら、プリント基板を容器から取り出し、支持部材（図
１の６）をねじ等により取り付け、ポッティング材をプ
リント基板に固定する。Next, a method of coating the potting material on the printed circuit board except the energized portion of the mounted component as in the above embodiment will be described. First, a given container is filled with a given amount of soft viscous resin, which will be the potting material, and the side of the printed circuit board on which the mounted components are mounted is the bottom surface, and the potting material can be covered except for the energized parts. The printed circuit board is soaked to cure the resin. After curing, the printed circuit board is taken out of the container, the support member (6 in FIG. 1) is attached by screws or the like, and the potting material is fixed to the printed circuit board.
【００１６】実施例２
図２は、本発明の第２の実施例のプリント基板の断面図
である。Second Embodiment FIG. 2 is a sectional view of a printed circuit board according to a second embodiment of the present invention.
【００１７】本実施例では、ポッティング材４に放熱片
（冷却フィン）７の一部を埋め込み、放熱片７を該ポッ
ティング材４の表面から突出させてある。これにより、
空気等の冷媒と接する面積が増加するので、搭載部品の
冷却効果をさらに高めることができる。In this embodiment, a part of the heat dissipation piece (cooling fin) 7 is embedded in the potting material 4, and the heat dissipation piece 7 is projected from the surface of the potting material 4. This allows
Since the area in contact with the coolant such as air increases, the cooling effect of the mounted components can be further enhanced.
【００１８】実施例３
図３は、本発明の第３の実施例のプリント基板の断面図
である。Third Embodiment FIG. 3 is a sectional view of a printed circuit board according to a third embodiment of the present invention.
【００１９】本実施例では、ポッティング材４の表面に
図示のような凹凸を設けることにより、ポッティング材
４の表面積を増加して放熱面積を拡大し、冷却効果を高
めた例である。The present embodiment is an example in which the surface of the potting material 4 is provided with irregularities as shown to increase the surface area of the potting material 4 to expand the heat radiation area and enhance the cooling effect.
【００２０】実施例４
図４は、本発明の第４の実施例のプリント基板の断面図
である。Fourth Embodiment FIG. 4 is a sectional view of a printed circuit board according to a fourth embodiment of the present invention.
【００２１】８は、水等の冷媒が流れるように構成した
管（パイプ）であり、この管８をポッティング材４に埋
め込んである。Reference numeral 8 denotes a pipe configured to allow a coolant such as water to flow, and the pipe 8 is embedded in the potting material 4.
【００２２】以上本発明を実施例に基づいて具体的に説
明したが、本発明は上記実施例に限定されるものではな
く、その要旨を逸脱しない範囲において種々変更可能で
あることは勿論である。例えば、冷却手段としては自然
空冷、水冷のほか、種々のものを用いることができる。Although the present invention has been specifically described based on the embodiments, the present invention is not limited to the above embodiments, and it is needless to say that various modifications can be made without departing from the scope of the invention. . For example, as the cooling means, various types can be used in addition to natural air cooling and water cooling.
【００２３】[0023]
【発明の効果】以上説明したように、本発明では、電気
的、機械的悪影響を及ぼすことなく、効果的に冷却でき
る信頼性の高いプリント基板を提供することができる。As described above, according to the present invention, it is possible to provide a highly reliable printed circuit board that can be effectively cooled without adversely affecting electrical or mechanical conditions.
【図１】本発明の第１の実施例のプリント基板の断面図
である。FIG. 1 is a sectional view of a printed circuit board according to a first embodiment of the present invention.
【図２】本発明の第２の実施例のプリント基板の断面図
である。FIG. 2 is a sectional view of a printed circuit board according to a second embodiment of the present invention.
【図３】本発明の第３の実施例のプリント基板の断面図
である。FIG. 3 is a sectional view of a printed circuit board according to a third embodiment of the present invention.
【図４】本発明の第４の実施例のプリント基板の断面図
である。FIG. 4 is a sectional view of a printed board according to a fourth embodiment of the present invention.
１…プリント基板、２…半導体素子、３…リード端子、
４…ポッティング材、５…冷媒、６…支持部材、７…放
熱片、８…管。1 ... Printed circuit board, 2 ... Semiconductor element, 3 ... Lead terminal,
4 ... Potting material, 5 ... Refrigerant, 6 ... Support member, 7 ... Heat dissipation piece, 8 ... Tube.
Claims (4)
搭載部品の通電部分を除いて上記プリント基板上に被覆
したことを特徴とするプリント基板。1. A printed circuit board, characterized in that a potting material for cooling is coated on the printed circuit board except the energized portion of a mounting component of the printed circuit board.
込み、該放熱片を該ポッティング材の表面から突出させ
たことを特徴とする請求項１記載のプリント基板。2. The printed circuit board according to claim 1, wherein a part of the heat dissipation piece is embedded in the potting material, and the heat dissipation piece is projected from the surface of the potting material.
該ポッティング材の表面積を増加したことを特徴とする
請求項１または２記載のプリント基板。3. The surface of the potting material is provided with irregularities,
The printed circuit board according to claim 1, wherein the surface area of the potting material is increased.
も一部を上記ポッティング材に埋め込んだことを特徴と
する請求項１、２または３記載のプリント基板。4. The printed circuit board according to claim 1, 2 or 3, wherein at least a part of a pipe configured to allow a refrigerant to flow therein is embedded in the potting material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15322291A JPH053383A (en) | 1991-06-25 | 1991-06-25 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15322291A JPH053383A (en) | 1991-06-25 | 1991-06-25 | Printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH053383A true JPH053383A (en) | 1993-01-08 |
Family
ID=15557726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15322291A Pending JPH053383A (en) | 1991-06-25 | 1991-06-25 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH053383A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004172370A (en) * | 2002-11-20 | 2004-06-17 | Matsushita Electric Ind Co Ltd | Circuit board and manufacturing method therefor |
| US7701053B2 (en) | 2003-05-09 | 2010-04-20 | Murata Manufacturing Co., Ltd. | Electronic component and method for producing the same |
| JP2010226010A (en) * | 2009-03-25 | 2010-10-07 | Alps Electric Co Ltd | Electronic circuit unit, and method of manufacturing the same |
| JP2013077604A (en) * | 2011-09-29 | 2013-04-25 | Shindengen Electric Mfg Co Ltd | Electronic component unit |
| JP2014099550A (en) * | 2012-11-15 | 2014-05-29 | Shindengen Electric Mfg Co Ltd | Electronic apparatus |
| US11346823B2 (en) | 2019-07-11 | 2022-05-31 | Shimadzu Corporation | Analyzer |
-
1991
- 1991-06-25 JP JP15322291A patent/JPH053383A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004172370A (en) * | 2002-11-20 | 2004-06-17 | Matsushita Electric Ind Co Ltd | Circuit board and manufacturing method therefor |
| US7701053B2 (en) | 2003-05-09 | 2010-04-20 | Murata Manufacturing Co., Ltd. | Electronic component and method for producing the same |
| JP2010226010A (en) * | 2009-03-25 | 2010-10-07 | Alps Electric Co Ltd | Electronic circuit unit, and method of manufacturing the same |
| JP2013077604A (en) * | 2011-09-29 | 2013-04-25 | Shindengen Electric Mfg Co Ltd | Electronic component unit |
| JP2014099550A (en) * | 2012-11-15 | 2014-05-29 | Shindengen Electric Mfg Co Ltd | Electronic apparatus |
| US11346823B2 (en) | 2019-07-11 | 2022-05-31 | Shimadzu Corporation | Analyzer |
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