SE518642C2 - Förfarande, anordning för att förse ett substrat med visköst medium, anordning för korrigering av applikationsfel samt användningen av utskjutnings- organ för korrigering av appliceringsfel - Google Patents

Förfarande, anordning för att förse ett substrat med visköst medium, anordning för korrigering av applikationsfel samt användningen av utskjutnings- organ för korrigering av appliceringsfel

Info

Publication number
SE518642C2
SE518642C2 SE0002618A SE0002618A SE518642C2 SE 518642 C2 SE518642 C2 SE 518642C2 SE 0002618 A SE0002618 A SE 0002618A SE 0002618 A SE0002618 A SE 0002618A SE 518642 C2 SE518642 C2 SE 518642C2
Authority
SE
Sweden
Prior art keywords
viscous medium
substrate
application
errors
correction
Prior art date
Application number
SE0002618A
Other languages
English (en)
Swedish (sv)
Other versions
SE0002618L (sv
SE0002618D0 (sv
Inventor
William Holm
Nils Jacobsson
Original Assignee
Mydata Automation Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mydata Automation Ab filed Critical Mydata Automation Ab
Priority to SE0002618A priority Critical patent/SE518642C2/sv
Publication of SE0002618D0 publication Critical patent/SE0002618D0/xx
Priority to AT01945902T priority patent/ATE488982T1/de
Priority to KR1020037000314A priority patent/KR100796875B1/ko
Priority to PCT/SE2001/001566 priority patent/WO2002005607A1/en
Priority to CNB018126189A priority patent/CN1269389C/zh
Priority to DE60143485T priority patent/DE60143485D1/de
Priority to EP01945902A priority patent/EP1308072B1/en
Priority to JP2002508878A priority patent/JP4917236B2/ja
Priority to AU2001268010A priority patent/AU2001268010A1/en
Priority to US09/902,110 priority patent/US7201802B2/en
Publication of SE0002618L publication Critical patent/SE0002618L/xx
Publication of SE518642C2 publication Critical patent/SE518642C2/sv
Priority to US11/503,195 priority patent/US7931933B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
    • B23K31/125—Weld quality monitoring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Quality & Reliability (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Screen Printers (AREA)
  • Coating Apparatus (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Inking, Control Or Cleaning Of Printing Machines (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Manufacturing Of Printed Wiring (AREA)
SE0002618A 2000-07-11 2000-07-11 Förfarande, anordning för att förse ett substrat med visköst medium, anordning för korrigering av applikationsfel samt användningen av utskjutnings- organ för korrigering av appliceringsfel SE518642C2 (sv)

Priority Applications (11)

Application Number Priority Date Filing Date Title
SE0002618A SE518642C2 (sv) 2000-07-11 2000-07-11 Förfarande, anordning för att förse ett substrat med visköst medium, anordning för korrigering av applikationsfel samt användningen av utskjutnings- organ för korrigering av appliceringsfel
AU2001268010A AU2001268010A1 (en) 2000-07-11 2001-07-06 Method and apparatus for providing a substrate with viscous medium and use of jetting means for the correction of application errors
CNB018126189A CN1269389C (zh) 2000-07-11 2001-07-06 为衬底提供粘性介质及使用喷射装置改正涂敷错误的方法和设备
KR1020037000314A KR100796875B1 (ko) 2000-07-11 2001-07-06 점성 매체를 기판에 제공하는 방법과 장치 및 도포 에러의수정을 위한 분사 수단의 사용 방법
PCT/SE2001/001566 WO2002005607A1 (en) 2000-07-11 2001-07-06 Method and apparatus for providing a substrate with viscous medium and use of jetting means for the correction of application errors
AT01945902T ATE488982T1 (de) 2000-07-11 2001-07-06 Verfahren und vorrichtung zur bereitstellung eines substrats mit viskosem medium und verwendung eines jet-mittels zur korrektur von auftragfehlern
DE60143485T DE60143485D1 (de) 2000-07-11 2001-07-06 Substrats mit viskosem medium und verwendung eines jet-mittels zur korrektur von auftragfehlern
EP01945902A EP1308072B1 (en) 2000-07-11 2001-07-06 Method and apparatus for providing a substrate with viscous medium and use of jetting means for the correction of application errors
JP2002508878A JP4917236B2 (ja) 2000-07-11 2001-07-06 粘性媒体を備えた基板を用意する方法と装置及び塗布誤りの訂正のための噴射手段の使用
US09/902,110 US7201802B2 (en) 2000-07-11 2001-07-11 Apparatus for providing a substrate with viscous medium
US11/503,195 US7931933B2 (en) 2000-07-11 2006-08-14 Method and apparatus for providing a substrate with viscous medium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0002618A SE518642C2 (sv) 2000-07-11 2000-07-11 Förfarande, anordning för att förse ett substrat med visköst medium, anordning för korrigering av applikationsfel samt användningen av utskjutnings- organ för korrigering av appliceringsfel

Publications (3)

Publication Number Publication Date
SE0002618D0 SE0002618D0 (sv) 2000-07-11
SE0002618L SE0002618L (sv) 2002-03-06
SE518642C2 true SE518642C2 (sv) 2002-11-05

Family

ID=20280454

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0002618A SE518642C2 (sv) 2000-07-11 2000-07-11 Förfarande, anordning för att förse ett substrat med visköst medium, anordning för korrigering av applikationsfel samt användningen av utskjutnings- organ för korrigering av appliceringsfel

Country Status (10)

Country Link
US (2) US7201802B2 (ja)
EP (1) EP1308072B1 (ja)
JP (1) JP4917236B2 (ja)
KR (1) KR100796875B1 (ja)
CN (1) CN1269389C (ja)
AT (1) ATE488982T1 (ja)
AU (1) AU2001268010A1 (ja)
DE (1) DE60143485D1 (ja)
SE (1) SE518642C2 (ja)
WO (1) WO2002005607A1 (ja)

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US8746139B2 (en) * 2010-12-08 2014-06-10 Illinois Tool Works Inc. Combination stencil printer and dispenser and related methods
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Also Published As

Publication number Publication date
ATE488982T1 (de) 2010-12-15
US7201802B2 (en) 2007-04-10
AU2001268010A1 (en) 2002-01-21
US20060275538A1 (en) 2006-12-07
SE0002618L (sv) 2002-03-06
CN1269389C (zh) 2006-08-09
KR100796875B1 (ko) 2008-01-22
DE60143485D1 (de) 2010-12-30
JP2004502538A (ja) 2004-01-29
EP1308072B1 (en) 2010-11-17
JP4917236B2 (ja) 2012-04-18
SE0002618D0 (sv) 2000-07-11
US20020014602A1 (en) 2002-02-07
US7931933B2 (en) 2011-04-26
CN1442030A (zh) 2003-09-10
KR20030016389A (ko) 2003-02-26
EP1308072A1 (en) 2003-05-07
WO2002005607A1 (en) 2002-01-17

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