SE516139C2 - Förfarande och anordning för att förbättra termiska och elektriska egenskaper hos komponenter förbunda med ett substrat monterat på en bärare - Google Patents
Förfarande och anordning för att förbättra termiska och elektriska egenskaper hos komponenter förbunda med ett substrat monterat på en bärareInfo
- Publication number
- SE516139C2 SE516139C2 SE9900962A SE9900962A SE516139C2 SE 516139 C2 SE516139 C2 SE 516139C2 SE 9900962 A SE9900962 A SE 9900962A SE 9900962 A SE9900962 A SE 9900962A SE 516139 C2 SE516139 C2 SE 516139C2
- Authority
- SE
- Sweden
- Prior art keywords
- chip
- circuit board
- printed circuit
- carrier
- components
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10477—Inverted
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9900962A SE516139C2 (sv) | 1999-03-17 | 1999-03-17 | Förfarande och anordning för att förbättra termiska och elektriska egenskaper hos komponenter förbunda med ett substrat monterat på en bärare |
TW088111376A TW453144B (en) | 1999-03-17 | 1999-07-05 | A method and an arrangement for the electrical contact of components |
EP00917564A EP1192842A1 (fr) | 1999-03-17 | 2000-03-13 | Procede et dispositif de mise en contact electrique de composants |
KR1020017011648A KR100733684B1 (ko) | 1999-03-17 | 2000-03-13 | 소자의 전기 접촉을 위한 방법 및 장치 |
CA002368057A CA2368057A1 (fr) | 1999-03-17 | 2000-03-13 | Procede et dispositif de mise en contact electrique de composants |
PCT/SE2000/000493 WO2000056130A1 (fr) | 1999-03-17 | 2000-03-13 | Procede et dispositif de mise en contact electrique de composants |
CN00805087A CN1343440A (zh) | 1999-03-17 | 2000-03-13 | 一种用于元件的电接触的方法和装置 |
JP2000605451A JP2002539631A (ja) | 1999-03-17 | 2000-03-13 | 部材を電気的に接触させる方法および構造 |
AU38520/00A AU3852000A (en) | 1999-03-17 | 2000-03-13 | A method and an arrangement for the electrical contact of components |
US09/527,572 US6285554B1 (en) | 1999-03-17 | 2000-03-16 | Method and an arrangement for the electrical contact of components |
HK02107164.3A HK1045624A1 (zh) | 1999-03-17 | 2002-09-27 | 一種用於元件的電接觸的方法和裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9900962A SE516139C2 (sv) | 1999-03-17 | 1999-03-17 | Förfarande och anordning för att förbättra termiska och elektriska egenskaper hos komponenter förbunda med ett substrat monterat på en bärare |
Publications (3)
Publication Number | Publication Date |
---|---|
SE9900962D0 SE9900962D0 (sv) | 1999-03-17 |
SE9900962L SE9900962L (sv) | 2000-09-18 |
SE516139C2 true SE516139C2 (sv) | 2001-11-26 |
Family
ID=20414883
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9900962A SE516139C2 (sv) | 1999-03-17 | 1999-03-17 | Förfarande och anordning för att förbättra termiska och elektriska egenskaper hos komponenter förbunda med ett substrat monterat på en bärare |
Country Status (11)
Country | Link |
---|---|
US (1) | US6285554B1 (fr) |
EP (1) | EP1192842A1 (fr) |
JP (1) | JP2002539631A (fr) |
KR (1) | KR100733684B1 (fr) |
CN (1) | CN1343440A (fr) |
AU (1) | AU3852000A (fr) |
CA (1) | CA2368057A1 (fr) |
HK (1) | HK1045624A1 (fr) |
SE (1) | SE516139C2 (fr) |
TW (1) | TW453144B (fr) |
WO (1) | WO2000056130A1 (fr) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6472743B2 (en) * | 2001-02-22 | 2002-10-29 | Siliconware Precision Industries, Co., Ltd. | Semiconductor package with heat dissipating structure |
US20050057907A1 (en) * | 2003-09-12 | 2005-03-17 | Hewlett-Packard Development Company, L.P. | Circuit board assembly |
US7061126B2 (en) * | 2003-10-07 | 2006-06-13 | Hewlett-Packard Development Company, L.P. | Circuit board assembly |
US7345891B2 (en) | 2003-10-07 | 2008-03-18 | Hewlett-Packard Development Company, L.P. | Circuit board assembly |
US7056144B2 (en) | 2004-02-19 | 2006-06-06 | Hewlett-Packard Development Company, L.P. | Offset compensation system |
DE102006018709B3 (de) * | 2006-04-20 | 2007-10-11 | Nft Nanofiltertechnik Gmbh | Wärmetauscher |
US7742310B2 (en) * | 2006-09-29 | 2010-06-22 | Hewlett-Packard Development Company, L.P. | Sequencer |
US7397666B2 (en) * | 2006-10-25 | 2008-07-08 | Hewlett-Packard Development Company, L.P. | Wedge lock |
JP6569375B2 (ja) | 2015-08-11 | 2019-09-04 | 株式会社ソシオネクスト | 半導体装置、半導体装置の製造方法及び電子装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4855867A (en) | 1987-02-02 | 1989-08-08 | International Business Machines Corporation | Full panel electronic packaging structure |
US5170931A (en) * | 1987-03-11 | 1992-12-15 | International Business Machines Corporation | Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate |
US4868349A (en) * | 1988-05-09 | 1989-09-19 | National Semiconductor Corporation | Plastic molded pin-grid-array power package |
JPH02271558A (ja) | 1989-04-12 | 1990-11-06 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
US5045921A (en) | 1989-12-26 | 1991-09-03 | Motorola, Inc. | Pad array carrier IC device using flexible tape |
JPH0548000A (ja) * | 1991-08-13 | 1993-02-26 | Fujitsu Ltd | 半導体装置 |
US5757620A (en) * | 1994-12-05 | 1998-05-26 | International Business Machines Corporation | Apparatus for cooling of chips using blind holes with customized depth |
US5517753A (en) * | 1995-04-06 | 1996-05-21 | International Business Machines Corporation | Adjustable spacer for flat plate cooling applications |
US5572405A (en) * | 1995-06-07 | 1996-11-05 | International Business Machines Corporation (Ibm) | Thermally enhanced ball grid array package |
US5633533A (en) * | 1995-07-26 | 1997-05-27 | International Business Machines Corporation | Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto |
US5724230A (en) * | 1996-06-21 | 1998-03-03 | International Business Machines Corporation | Flexible laminate module including spacers embedded in an adhesive |
US5825087A (en) | 1996-12-03 | 1998-10-20 | International Business Machines Corporation | Integral mesh flat plate cooling module |
US5786635A (en) * | 1996-12-16 | 1998-07-28 | International Business Machines Corporation | Electronic package with compressible heatsink structure |
US5834839A (en) * | 1997-05-22 | 1998-11-10 | Lsi Logic Corporation | Preserving clearance between encapsulant and PCB for cavity-down single-tier package assembly |
US5854507A (en) * | 1998-07-21 | 1998-12-29 | Hewlett-Packard Company | Multiple chip assembly |
US6122171A (en) * | 1999-07-30 | 2000-09-19 | Micron Technology, Inc. | Heat sink chip package and method of making |
-
1999
- 1999-03-17 SE SE9900962A patent/SE516139C2/sv not_active IP Right Cessation
- 1999-07-05 TW TW088111376A patent/TW453144B/zh not_active IP Right Cessation
-
2000
- 2000-03-13 AU AU38520/00A patent/AU3852000A/en not_active Abandoned
- 2000-03-13 WO PCT/SE2000/000493 patent/WO2000056130A1/fr active Application Filing
- 2000-03-13 EP EP00917564A patent/EP1192842A1/fr not_active Withdrawn
- 2000-03-13 CA CA002368057A patent/CA2368057A1/fr not_active Abandoned
- 2000-03-13 JP JP2000605451A patent/JP2002539631A/ja not_active Abandoned
- 2000-03-13 CN CN00805087A patent/CN1343440A/zh active Pending
- 2000-03-13 KR KR1020017011648A patent/KR100733684B1/ko not_active IP Right Cessation
- 2000-03-16 US US09/527,572 patent/US6285554B1/en not_active Expired - Lifetime
-
2002
- 2002-09-27 HK HK02107164.3A patent/HK1045624A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
EP1192842A1 (fr) | 2002-04-03 |
KR20010112322A (ko) | 2001-12-20 |
AU3852000A (en) | 2000-10-04 |
SE9900962D0 (sv) | 1999-03-17 |
JP2002539631A (ja) | 2002-11-19 |
TW453144B (en) | 2001-09-01 |
KR100733684B1 (ko) | 2007-06-28 |
US6285554B1 (en) | 2001-09-04 |
CA2368057A1 (fr) | 2000-09-21 |
SE9900962L (sv) | 2000-09-18 |
CN1343440A (zh) | 2002-04-03 |
WO2000056130A1 (fr) | 2000-09-21 |
HK1045624A1 (zh) | 2002-11-29 |
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