SE503166C2 - Kapacitansuppvisande mönsterkortstillhörigt kopplingsarrangemang - Google Patents

Kapacitansuppvisande mönsterkortstillhörigt kopplingsarrangemang

Info

Publication number
SE503166C2
SE503166C2 SE9402792A SE9402792A SE503166C2 SE 503166 C2 SE503166 C2 SE 503166C2 SE 9402792 A SE9402792 A SE 9402792A SE 9402792 A SE9402792 A SE 9402792A SE 503166 C2 SE503166 C2 SE 503166C2
Authority
SE
Sweden
Prior art keywords
layers
coupling arrangement
arrangement according
circuit board
printed circuit
Prior art date
Application number
SE9402792A
Other languages
English (en)
Swedish (sv)
Other versions
SE9402792L (sv
SE9402792D0 (sv
Inventor
Johnsen Helge Bodahl
Mats Olav Timgren
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9402792A priority Critical patent/SE503166C2/sv
Publication of SE9402792D0 publication Critical patent/SE9402792D0/xx
Priority to KR1019970701149A priority patent/KR100217514B1/ko
Priority to US08/776,765 priority patent/US5815373A/en
Priority to AU33576/95A priority patent/AU698863B2/en
Priority to CA002190458A priority patent/CA2190458A1/en
Priority to ES95930072T priority patent/ES2146768T3/es
Priority to PCT/SE1995/000892 priority patent/WO1996006389A1/en
Priority to EP95930072A priority patent/EP0777873B1/en
Priority to FI970321A priority patent/FI970321A0/fi
Priority to DE69516879T priority patent/DE69516879T2/de
Publication of SE9402792L publication Critical patent/SE9402792L/xx
Publication of SE503166C2 publication Critical patent/SE503166C2/sv
Priority to NO970777A priority patent/NO970777L/no

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/14—Arrangements for reducing ripples from DC input or output
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0262—Arrangements for regulating voltages or for using plural voltages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Polysaccharides And Polysaccharide Derivatives (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)
  • Logic Circuits (AREA)
SE9402792A 1994-08-22 1994-08-22 Kapacitansuppvisande mönsterkortstillhörigt kopplingsarrangemang SE503166C2 (sv)

Priority Applications (11)

Application Number Priority Date Filing Date Title
SE9402792A SE503166C2 (sv) 1994-08-22 1994-08-22 Kapacitansuppvisande mönsterkortstillhörigt kopplingsarrangemang
DE69516879T DE69516879T2 (de) 1994-08-22 1995-07-31 Zu einer gedruckten schaltplatte gehörende koppelvorrichtung, die eine kapazität anzeigt und/oder steuert
CA002190458A CA2190458A1 (en) 1994-08-22 1995-07-31 A coupling device presenting and/or dominating a capacitance belonging to a board with a printed circuit
US08/776,765 US5815373A (en) 1994-08-22 1995-07-31 Coupling device presenting and/or dominating a capacitance belonging to a board with a printed circuit
AU33576/95A AU698863B2 (en) 1994-08-22 1995-07-31 A coupling device presenting and/or dominating a capacitance belonging to a board with a printed circuit
KR1019970701149A KR100217514B1 (ko) 1994-08-22 1995-07-31 인쇄회로기판에 있는 커패시턴스 제공 및/또는 제어하는 커플링장치
ES95930072T ES2146768T3 (es) 1994-08-22 1995-07-31 Un dispositivo de acoplamiento que presenta y/o domina una capacidad perteneciente a una placa con un circuito impreso.
PCT/SE1995/000892 WO1996006389A1 (en) 1994-08-22 1995-07-31 A coupling device presenting and/or dominating a capacitance belonging to a board with a printed circuit
EP95930072A EP0777873B1 (en) 1994-08-22 1995-07-31 A coupling device presenting and/or dominating a capacitance belonging to a board with a printed circuit
FI970321A FI970321A0 (fi) 1994-08-22 1995-07-31 Liitäntälaite, joka tarjoaa ja/tai dominoi painettuun piirilevyyn kuuluvaa kapasitanssia
NO970777A NO970777L (no) 1994-08-22 1997-02-20 Koblingsanordning som representerer og/eller dominerer en kapasitans ved et kort med trykte kretser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9402792A SE503166C2 (sv) 1994-08-22 1994-08-22 Kapacitansuppvisande mönsterkortstillhörigt kopplingsarrangemang

Publications (3)

Publication Number Publication Date
SE9402792D0 SE9402792D0 (sv) 1994-08-22
SE9402792L SE9402792L (sv) 1996-02-23
SE503166C2 true SE503166C2 (sv) 1996-04-15

Family

ID=20394981

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9402792A SE503166C2 (sv) 1994-08-22 1994-08-22 Kapacitansuppvisande mönsterkortstillhörigt kopplingsarrangemang

Country Status (11)

Country Link
US (1) US5815373A (fi)
EP (1) EP0777873B1 (fi)
KR (1) KR100217514B1 (fi)
AU (1) AU698863B2 (fi)
CA (1) CA2190458A1 (fi)
DE (1) DE69516879T2 (fi)
ES (1) ES2146768T3 (fi)
FI (1) FI970321A0 (fi)
NO (1) NO970777L (fi)
SE (1) SE503166C2 (fi)
WO (1) WO1996006389A1 (fi)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
JP3610221B2 (ja) * 1998-01-27 2005-01-12 キヤノン株式会社 多層プリント配線基板
US6014319A (en) * 1998-05-21 2000-01-11 International Business Machines Corporation Multi-part concurrently maintainable electronic circuit card assembly
US20060179305A1 (en) * 2004-03-11 2006-08-10 Junbiao Zhang WLAN session management techniques with secure rekeying and logoff
GB2439862A (en) 2005-03-01 2008-01-09 X2Y Attenuators Llc Conditioner with coplanar conductors
US8025634B1 (en) * 2006-09-18 2011-09-27 Baxter International Inc. Method and system for controlled infusion of therapeutic substances
CN109496057A (zh) * 2018-11-12 2019-03-19 晶晨半导体(上海)股份有限公司 一种印制电路板布局
FR3089341B1 (fr) * 2018-12-03 2022-04-22 Psa Automobiles Sa Dispositif de couplage à pièces assurant un couplage entre une liaison électrique et un élément conducteur

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4441070A (en) * 1982-02-26 1984-04-03 Motorola, Inc. Voltage regulator circuit with supply voltage ripple rejection to transient spikes
DE3242023A1 (de) * 1982-11-12 1984-05-17 Siemens AG, 1000 Berlin und 8000 München Schaltungsanordnung zur speisung von elektrischen verbrauchern mit einer gleichspannung
US5065284A (en) * 1988-08-01 1991-11-12 Rogers Corporation Multilayer printed wiring board
US5010641A (en) * 1989-06-30 1991-04-30 Unisys Corp. Method of making multilayer printed circuit board
US5079069A (en) * 1989-08-23 1992-01-07 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
US5161086A (en) * 1989-08-23 1992-11-03 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
JPH03258101A (ja) * 1990-03-08 1991-11-18 Nec Corp 回路基板
US5198969A (en) * 1990-07-13 1993-03-30 Design Automation, Inc. Soft-switching full-bridge dc/dc converting
US5162977A (en) * 1991-08-27 1992-11-10 Storage Technology Corporation Printed circuit board having an integrated decoupling capacitive element
JPH05219729A (ja) * 1992-02-07 1993-08-27 Sony Corp 直流電源装置

Also Published As

Publication number Publication date
ES2146768T3 (es) 2000-08-16
EP0777873B1 (en) 2000-05-10
FI970321L (fi) 1997-01-24
AU3357695A (en) 1996-03-14
DE69516879D1 (de) 2000-06-15
SE9402792L (sv) 1996-02-23
SE9402792D0 (sv) 1994-08-22
NO970777D0 (no) 1997-02-20
NO970777L (no) 1997-04-21
CA2190458A1 (en) 1996-02-29
EP0777873A1 (en) 1997-06-11
FI970321A7 (fi) 1997-01-24
KR100217514B1 (ko) 1999-09-01
FI970321A0 (fi) 1997-01-24
WO1996006389A1 (en) 1996-02-29
DE69516879T2 (de) 2000-11-09
US5815373A (en) 1998-09-29
AU698863B2 (en) 1998-11-12

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