NO970777D0 - Koblingsanordning som representerer og/eller dominerer en kapasitans ved et kort med trykte kretser - Google Patents

Koblingsanordning som representerer og/eller dominerer en kapasitans ved et kort med trykte kretser

Info

Publication number
NO970777D0
NO970777D0 NO970777A NO970777A NO970777D0 NO 970777 D0 NO970777 D0 NO 970777D0 NO 970777 A NO970777 A NO 970777A NO 970777 A NO970777 A NO 970777A NO 970777 D0 NO970777 D0 NO 970777D0
Authority
NO
Norway
Prior art keywords
dominating
capacitance
circuit board
printed circuit
switching device
Prior art date
Application number
NO970777A
Other languages
English (en)
Other versions
NO970777L (no
Inventor
Helge Bodahl Johnsen
Mats Olav Timgren
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Publication of NO970777D0 publication Critical patent/NO970777D0/no
Publication of NO970777L publication Critical patent/NO970777L/no

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00Details of apparatus for conversion
    • H02M1/14Arrangements for reducing ripples from dc input or output
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0254High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0262Arrangements for regulating voltages or for using plural voltages
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0183Dielectric layers
    • H05K2201/0191Dielectric layers wherein the thickness of the dielectric plays an important role
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/0929Conductive planes
    • H05K2201/09309Core having two or more power planes; Capacitive laminate of two power planes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Polysaccharides And Polysaccharide Derivatives (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)
  • Logic Circuits (AREA)
NO970777A 1994-08-22 1997-02-20 Koblingsanordning som representerer og/eller dominerer en kapasitans ved et kort med trykte kretser NO970777L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9402792A SE503166C2 (sv) 1994-08-22 1994-08-22 Kapacitansuppvisande mönsterkortstillhörigt kopplingsarrangemang
PCT/SE1995/000892 WO1996006389A1 (en) 1994-08-22 1995-07-31 A coupling device presenting and/or dominating a capacitance belonging to a board with a printed circuit

Publications (2)

Publication Number Publication Date
NO970777D0 true NO970777D0 (no) 1997-02-20
NO970777L NO970777L (no) 1997-04-21

Family

ID=20394981

Family Applications (1)

Application Number Title Priority Date Filing Date
NO970777A NO970777L (no) 1994-08-22 1997-02-20 Koblingsanordning som representerer og/eller dominerer en kapasitans ved et kort med trykte kretser

Country Status (11)

Country Link
US (1) US5815373A (no)
EP (1) EP0777873B1 (no)
KR (1) KR100217514B1 (no)
AU (1) AU698863B2 (no)
CA (1) CA2190458A1 (no)
DE (1) DE69516879T2 (no)
ES (1) ES2146768T3 (no)
FI (1) FI970321A0 (no)
NO (1) NO970777L (no)
SE (1) SE503166C2 (no)
WO (1) WO1996006389A1 (no)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
JP3610221B2 (ja) * 1998-01-27 2005-01-12 キヤノン株式会社 多層プリント配線基板
US6014319A (en) * 1998-05-21 2000-01-11 International Business Machines Corporation Multi-part concurrently maintainable electronic circuit card assembly
US20060179305A1 (en) * 2004-03-11 2006-08-10 Junbiao Zhang WLAN session management techniques with secure rekeying and logoff
WO2006104613A2 (en) 2005-03-01 2006-10-05 X2Y Attenuators, Llc Conditioner with coplanar conductors
US8025634B1 (en) * 2006-09-18 2011-09-27 Baxter International Inc. Method and system for controlled infusion of therapeutic substances
CN109496057A (zh) * 2018-11-12 2019-03-19 晶晨半导体(上海)股份有限公司 一种印制电路板布局
FR3089341B1 (fr) * 2018-12-03 2022-04-22 Psa Automobiles Sa Dispositif de couplage à pièces assurant un couplage entre une liaison électrique et un élément conducteur

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4441070A (en) * 1982-02-26 1984-04-03 Motorola, Inc. Voltage regulator circuit with supply voltage ripple rejection to transient spikes
DE3242023A1 (de) * 1982-11-12 1984-05-17 Siemens AG, 1000 Berlin und 8000 München Schaltungsanordnung zur speisung von elektrischen verbrauchern mit einer gleichspannung
US5065284A (en) * 1988-08-01 1991-11-12 Rogers Corporation Multilayer printed wiring board
US5010641A (en) * 1989-06-30 1991-04-30 Unisys Corp. Method of making multilayer printed circuit board
US5161086A (en) * 1989-08-23 1992-11-03 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
US5079069A (en) * 1989-08-23 1992-01-07 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
JPH03258101A (ja) * 1990-03-08 1991-11-18 Nec Corp 回路基板
US5198969A (en) * 1990-07-13 1993-03-30 Design Automation, Inc. Soft-switching full-bridge dc/dc converting
US5162977A (en) * 1991-08-27 1992-11-10 Storage Technology Corporation Printed circuit board having an integrated decoupling capacitive element
JPH05219729A (ja) * 1992-02-07 1993-08-27 Sony Corp 直流電源装置

Also Published As

Publication number Publication date
ES2146768T3 (es) 2000-08-16
SE9402792L (sv) 1996-02-23
SE9402792D0 (sv) 1994-08-22
EP0777873B1 (en) 2000-05-10
US5815373A (en) 1998-09-29
EP0777873A1 (en) 1997-06-11
DE69516879D1 (de) 2000-06-15
CA2190458A1 (en) 1996-02-29
FI970321A (fi) 1997-01-24
WO1996006389A1 (en) 1996-02-29
NO970777L (no) 1997-04-21
KR100217514B1 (ko) 1999-09-01
AU3357695A (en) 1996-03-14
DE69516879T2 (de) 2000-11-09
FI970321A0 (fi) 1997-01-24
SE503166C2 (sv) 1996-04-15
AU698863B2 (en) 1998-11-12

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Legal Events

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FC2A Withdrawal, rejection or dismissal of laid open patent application