SE431272B - Sett att framstella en halvledaranordning - Google Patents
Sett att framstella en halvledaranordningInfo
- Publication number
- SE431272B SE431272B SE7711985A SE7711985A SE431272B SE 431272 B SE431272 B SE 431272B SE 7711985 A SE7711985 A SE 7711985A SE 7711985 A SE7711985 A SE 7711985A SE 431272 B SE431272 B SE 431272B
- Authority
- SE
- Sweden
- Prior art keywords
- region
- concentration
- isolation region
- insulation
- diffusion
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims 2
- 238000009792 diffusion process Methods 0.000 claims description 16
- 238000002955 isolation Methods 0.000 claims description 15
- 238000009413 insulation Methods 0.000 claims description 13
- 239000000126 substance Substances 0.000 claims description 10
- 230000002452 interceptive effect Effects 0.000 claims description 8
- 230000007704 transition Effects 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 claims description 7
- 230000006866 deterioration Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 claims 4
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000005468 ion implantation Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 230000004888 barrier function Effects 0.000 description 8
- 230000001052 transient effect Effects 0.000 description 7
- 238000000407 epitaxy Methods 0.000 description 6
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052785 arsenic Inorganic materials 0.000 description 4
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 229910001423 beryllium ion Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/761—PN junctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Element Separation (AREA)
- Electroluminescent Light Sources (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/736,646 US4113512A (en) | 1976-10-28 | 1976-10-28 | Technique for preventing forward biased epi-isolation degradation |
Publications (2)
Publication Number | Publication Date |
---|---|
SE7711985L SE7711985L (sv) | 1978-04-29 |
SE431272B true SE431272B (sv) | 1984-01-23 |
Family
ID=24960699
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE7711985A SE431272B (sv) | 1976-10-28 | 1977-10-25 | Sett att framstella en halvledaranordning |
Country Status (12)
Country | Link |
---|---|
US (1) | US4113512A (es) |
JP (1) | JPS5354490A (es) |
BR (1) | BR7706777A (es) |
CA (1) | CA1057419A (es) |
CH (1) | CH619072A5 (es) |
DE (1) | DE2746700A1 (es) |
ES (1) | ES463621A1 (es) |
FR (1) | FR2369687A1 (es) |
GB (1) | GB1584990A (es) |
IT (1) | IT1114162B (es) |
NL (1) | NL7711278A (es) |
SE (1) | SE431272B (es) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4178190A (en) * | 1975-06-30 | 1979-12-11 | Rca Corporation | Method of making a bipolar transistor with high-low emitter impurity concentration |
US5041896A (en) * | 1989-07-06 | 1991-08-20 | General Electric Company | Symmetrical blocking high voltage semiconductor device and method of fabrication |
TW274628B (es) * | 1994-06-03 | 1996-04-21 | At & T Corp | |
JP3408098B2 (ja) * | 1997-02-20 | 2003-05-19 | キヤノン株式会社 | 固体撮像装置及びx線撮像装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USB377311I5 (es) * | 1964-06-23 | 1900-01-01 | ||
US3551760A (en) * | 1966-03-28 | 1970-12-29 | Hitachi Ltd | Semiconductor device with an inversion preventing layer formed in a diffused region |
US3653988A (en) * | 1968-02-05 | 1972-04-04 | Bell Telephone Labor Inc | Method of forming monolithic semiconductor integrated circuit devices |
US3631311A (en) * | 1968-03-26 | 1971-12-28 | Telefunken Patent | Semiconductor circuit arrangement with integrated base leakage resistance |
US3964705A (en) * | 1970-12-23 | 1976-06-22 | Bassani S.P.A. | Frame for the mounting of interchangeable electrical units |
US3697827A (en) * | 1971-02-09 | 1972-10-10 | Unitrode Corp | Structure and formation of semiconductors with transverse conductivity gradients |
US3760239A (en) * | 1971-06-09 | 1973-09-18 | Cress S | Coaxial inverted geometry transistor having buried emitter |
DE2241600A1 (de) * | 1971-08-26 | 1973-03-01 | Dionics Inc | Hochspannungs-p-n-uebergang und seine anwendung in halbleiterschaltelementen, sowie verfahren zu seiner herstellung |
US3921199A (en) * | 1973-07-31 | 1975-11-18 | Texas Instruments Inc | Junction breakdown voltage by means of ion implanted compensation guard ring |
US4021270A (en) * | 1976-06-28 | 1977-05-03 | Motorola, Inc. | Double master mask process for integrated circuit manufacture |
-
1976
- 1976-10-28 US US05/736,646 patent/US4113512A/en not_active Expired - Lifetime
-
1977
- 1977-08-31 JP JP10373377A patent/JPS5354490A/ja active Granted
- 1977-09-09 FR FR7727688A patent/FR2369687A1/fr active Granted
- 1977-09-20 IT IT27706/77A patent/IT1114162B/it active
- 1977-09-26 CA CA287,528A patent/CA1057419A/en not_active Expired
- 1977-09-30 GB GB40835/77A patent/GB1584990A/en not_active Expired
- 1977-10-05 CH CH1215777A patent/CH619072A5/de not_active IP Right Cessation
- 1977-10-07 BR BR7706777A patent/BR7706777A/pt unknown
- 1977-10-14 NL NL7711278A patent/NL7711278A/xx not_active Application Discontinuation
- 1977-10-18 DE DE19772746700 patent/DE2746700A1/de active Granted
- 1977-10-25 SE SE7711985A patent/SE431272B/sv unknown
- 1977-10-27 ES ES463621A patent/ES463621A1/es not_active Expired
Also Published As
Publication number | Publication date |
---|---|
BR7706777A (pt) | 1978-08-22 |
GB1584990A (en) | 1981-02-18 |
DE2746700A1 (de) | 1978-05-11 |
US4113512A (en) | 1978-09-12 |
SE7711985L (sv) | 1978-04-29 |
FR2369687A1 (fr) | 1978-05-26 |
FR2369687B1 (es) | 1980-08-01 |
NL7711278A (es) | 1978-05-03 |
CH619072A5 (es) | 1980-08-29 |
ES463621A1 (es) | 1978-07-01 |
CA1057419A (en) | 1979-06-26 |
JPS5354490A (en) | 1978-05-17 |
IT1114162B (it) | 1986-01-27 |
JPS5424270B2 (es) | 1979-08-20 |
DE2746700C2 (es) | 1988-12-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE19822763B4 (de) | Leistungshalbleitervorrichtung und Herstellungsverfahren einer Leistungshalbleitervorrichtung | |
US4305085A (en) | Semiconductor component with at least one planar PN junction and zone guard rings | |
DE102015208097A1 (de) | Herstellen einer Halbleitervorrichtung durch Epitaxie | |
US3538399A (en) | Pn junction gated field effect transistor having buried layer of low resistivity | |
Stork et al. | Small geometry depleted base bipolar transistors (BSIT)—VLSI devices? | |
Daly et al. | Analog BiCMOS Design: practices and pitfalls | |
Ashburn et al. | Comparison of experimental and computed results on arsenic-and phosphorus-doped polysilicon emitter bipolar transistors | |
JP3352160B2 (ja) | 固体サプレッサ | |
SE431272B (sv) | Sett att framstella en halvledaranordning | |
US3901735A (en) | Integrated circuit device and method utilizing ion implanted and up diffusion for isolated region | |
Veloric et al. | High-voltage conductivity-modulated silicon rectifier | |
DE102016102733B4 (de) | Bipolares Halbleiterbauelement mit einer Tief-Ladungsausgeglichenen-Struktur | |
US20080315260A1 (en) | Diode Structure | |
US3422322A (en) | Drift transistor | |
Goben et al. | Anomalous base current component in neutron irradiated transistors | |
US4881111A (en) | Radiation hard, high emitter-base breakdown bipolar transistor | |
US4106043A (en) | Zener diodes | |
JPS6136979A (ja) | 定電圧ダイオ−ド | |
Fairfield et al. | Precipitation effects in diffused transistor structures | |
US20030222272A1 (en) | Semiconductor devices using minority carrier controlling substances | |
Bhattacharya et al. | Parametric study of latchup immunity of deep trench-isolated, bulk, nonepitaxial CMOS | |
JP3396125B2 (ja) | 定電圧ダイオード | |
EP0109888A2 (en) | Subsurface Zener diode | |
JPS56150862A (en) | Semiconductor device | |
Shin et al. | A two-dimensional model for the excess interstitial distribution in silicon during thermal oxidation |