SE429702B - Forfarande och anordning for astadkommande av ledande forbindelser - Google Patents

Forfarande och anordning for astadkommande av ledande forbindelser

Info

Publication number
SE429702B
SE429702B SE7802720A SE7802720A SE429702B SE 429702 B SE429702 B SE 429702B SE 7802720 A SE7802720 A SE 7802720A SE 7802720 A SE7802720 A SE 7802720A SE 429702 B SE429702 B SE 429702B
Authority
SE
Sweden
Prior art keywords
wire
conductor
needle
conductor material
contact
Prior art date
Application number
SE7802720A
Other languages
English (en)
Swedish (sv)
Other versions
SE7802720L (sv
Inventor
R P Burr
R Morino
R J Keogh
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of SE7802720L publication Critical patent/SE7802720L/xx
Publication of SE429702B publication Critical patent/SE429702B/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
SE7802720A 1977-08-09 1978-03-09 Forfarande och anordning for astadkommande av ledande forbindelser SE429702B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US82315377A 1977-08-09 1977-08-09

Publications (2)

Publication Number Publication Date
SE7802720L SE7802720L (sv) 1979-02-10
SE429702B true SE429702B (sv) 1983-09-19

Family

ID=25237948

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7802720A SE429702B (sv) 1977-08-09 1978-03-09 Forfarande och anordning for astadkommande av ledande forbindelser

Country Status (14)

Country Link
JP (1) JPS5430470A (xx)
AT (1) AT377890B (xx)
AU (1) AU508357B2 (xx)
BR (1) BR7707302A (xx)
CA (1) CA1102924A (xx)
CH (1) CH629058A5 (xx)
DE (1) DE2811458C2 (xx)
FR (1) FR2400304A1 (xx)
GB (1) GB1593235A (xx)
IL (1) IL54283A (xx)
IT (1) IT1155890B (xx)
NL (1) NL7806258A (xx)
SE (1) SE429702B (xx)
ZA (1) ZA775455B (xx)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2466936A1 (fr) * 1979-09-28 1981-04-10 Cii Honeywell Bull Appareil de cablage a la surface d'un substrat d'interconnexion
US4500389A (en) * 1981-04-14 1985-02-19 Kollmorgen Technologies Corporation Process for the manufacture of substrates to interconnect electronic components
FR2507855A1 (fr) * 1981-06-11 1982-12-17 Kurganov Vladimir Tete de distribution d'une machine de cablage automatique
FR2509950A1 (fr) * 1981-07-16 1983-01-21 Egorenkov Arvit Dispositif pour le montage d'un cable sur une plaque
JPS59186851A (ja) * 1983-04-04 1984-10-23 Kataoka Kikai Seisakusho:Kk シ−ト巻取り準備装置
US4711026A (en) * 1985-07-19 1987-12-08 Kollmorgen Technologies Corporation Method of making wires scribed circuit boards
FR2585210B1 (fr) * 1985-07-19 1994-05-06 Kollmorgen Technologies Corp Procede de fabrication de plaquettes a circuits d'interconnexion
US4818322A (en) * 1985-07-19 1989-04-04 Kollmorgen Technologies Corporation Method for scribing conductors via laser
US4859807A (en) * 1985-07-19 1989-08-22 Kollmorgen Technologies Corporation Wire scribed circuit boards and method of manufacture
US4641773A (en) * 1985-08-09 1987-02-10 Kollmorgen Technologies Corp. Ultrasonic stylus position stabilizer
US4908939A (en) * 1985-10-18 1990-03-20 Kollmorgen Corporation Method of making coaxial interconnection boards
JP2612038B2 (ja) * 1988-06-22 1997-05-21 大日本印刷株式会社 小巻き用ボビンへのフイルム接着装置
JP2672925B2 (ja) * 1992-08-26 1997-11-05 ワイケイケイ株式会社 テープ状体の自動巻取機
WO2006050691A2 (de) 2004-11-02 2006-05-18 Imasys Ag Verlegevorrichtung, kontaktiervorrichtung, zustellsystem, verlege- und kontaktiereinheit herstellungsanlage, verfahren zur herstellung und eine transpondereinheit
US7971339B2 (en) 2006-09-26 2011-07-05 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US8322624B2 (en) 2007-04-10 2012-12-04 Feinics Amatech Teoranta Smart card with switchable matching antenna
US8608080B2 (en) 2006-09-26 2013-12-17 Feinics Amatech Teoranta Inlays for security documents
US7979975B2 (en) 2007-04-10 2011-07-19 Feinics Amatech Teavanta Methods of connecting an antenna to a transponder chip
US7546671B2 (en) 2006-09-26 2009-06-16 Micromechanic And Automation Technology Ltd. Method of forming an inlay substrate having an antenna wire
US7581308B2 (en) 2007-01-01 2009-09-01 Advanced Microelectronic And Automation Technology Ltd. Methods of connecting an antenna to a transponder chip
US8286332B2 (en) 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US7980477B2 (en) 2007-05-17 2011-07-19 Féinics Amatech Teoranta Dual interface inlays
DE602007010634D1 (de) 2007-09-18 2010-12-30 Baile Na Habhann Co Galway Verfahren zur Kontaktierung eines Drahtleiters gelegt auf ein Substrat
EP2704186A1 (en) * 2012-08-27 2014-03-05 Garreth Finlay Method for laying a wire conductor onto a substrate and for connecting it to a chip

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE663052A (xx) * 1964-04-27
US3674914A (en) * 1968-02-09 1972-07-04 Photocircuits Corp Wire scribed circuit boards and method of manufacture
JPS5550399B1 (xx) * 1970-03-05 1980-12-17
FR2304247A1 (fr) * 1975-03-12 1976-10-08 Commissariat Energie Atomique Procede et dispositif d'interconnexion de composants electroniques

Also Published As

Publication number Publication date
IT7848473A0 (it) 1978-03-17
JPS618596B2 (xx) 1986-03-15
IT1155890B (it) 1987-01-28
ZA775455B (en) 1978-07-26
DE2811458A1 (de) 1979-02-15
DE2811458C2 (de) 1983-12-29
SE7802720L (sv) 1979-02-10
JPS5430470A (en) 1979-03-06
AU508357B2 (en) 1980-03-20
IL54283A0 (en) 1978-06-15
AU3026177A (en) 1979-05-10
ATA183578A (de) 1984-09-15
BR7707302A (pt) 1979-05-29
IL54283A (en) 1980-07-31
CA1102924A (en) 1981-06-09
GB1593235A (en) 1981-07-15
CH629058A5 (en) 1982-03-31
NL7806258A (nl) 1979-02-13
FR2400304A1 (fr) 1979-03-09
AT377890B (de) 1985-05-10
FR2400304B1 (xx) 1982-02-12

Similar Documents

Publication Publication Date Title
SE429702B (sv) Forfarande och anordning for astadkommande av ledande forbindelser
US10354895B2 (en) Support substrate for transfer of semiconductor devices
US4450623A (en) Process for the manufacture of circuit boards
KR102548832B1 (ko) 반도체 디바이스들의 다중 직접 이송 방법 및 장치
US10615153B2 (en) Apparatus for direct transfer of semiconductor device die
CA1289006C (en) Computer aided printer-etcher
DE69011647D1 (de) Tintenstrahlkopf, sein Herstellungsverfahren, Substrat für einen Tintenstrahlkopf, Kontrollmethode hierzu und Tintenstrahlgerät.
EP0113979B1 (en) Method of forming thick film circuit patterns with a sufficiently wide and uniformly thick strip
JP7455118B2 (ja) 半導体デバイスの転写中に転写パラメータを制御する方法および装置
SE7605633L (sv) Anordning for jemn fordelning av en strom av varandra delvis overlappande tryckeriprodukter
GB2105224A (en) Micro component assembly machine
US2187637A (en) Apparatus for the electrostatic separation of particles having different electrical susceptibilities
EP0090000A1 (en) GUIDING AND COATING METHOD AND DEVICE DURING DRAWING OF OPTICAL FIBERS.
JPS60182192A (ja) はんだ接続装置
JPS63239895A (ja) 印刷回路の製造装置
JPS56118879A (en) Thermal head
ATE52055T1 (de) Verfahren und vorrichtung zum formschneiden.
JP2022542476A (ja) 半導体ダイ転写のためのブリッジ装置および方法
JPS63181394A (ja) プリント基板検査装置
JPH04298016A (ja) レジスト形成装置
JPS60198900A (ja) ジヤンパ配線装置
JPH04348899A (ja) ビアホール形成方法およびビアホール形成装置
JPS59145506A (ja) チツプ抵抗レ−ザトリミング装置
JPH04369239A (ja) 半導体チップの観察装置
JPH05212875A (ja) 印字装置

Legal Events

Date Code Title Description
NAL Patent in force

Ref document number: 7802720-8

Format of ref document f/p: F

NUG Patent has lapsed

Ref document number: 7802720-8

Format of ref document f/p: F