SE0402657L - Hybridarmatur - Google Patents

Hybridarmatur

Info

Publication number
SE0402657L
SE0402657L SE0402657A SE0402657A SE0402657L SE 0402657 L SE0402657 L SE 0402657L SE 0402657 A SE0402657 A SE 0402657A SE 0402657 A SE0402657 A SE 0402657A SE 0402657 L SE0402657 L SE 0402657L
Authority
SE
Sweden
Prior art keywords
fittings
hybrid
components
thermo
led
Prior art date
Application number
SE0402657A
Other languages
English (en)
Swedish (sv)
Other versions
SE0402657D0 (sv
Inventor
Jouko Kuisma
Original Assignee
Teknoware Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teknoware Oy filed Critical Teknoware Oy
Publication of SE0402657D0 publication Critical patent/SE0402657D0/sv
Publication of SE0402657L publication Critical patent/SE0402657L/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H05B33/0803—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
SE0402657A 2003-11-07 2004-11-03 Hybridarmatur SE0402657L (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20031619A FI116116B (fi) 2003-11-07 2003-11-07 Hybridivalaisin

Publications (2)

Publication Number Publication Date
SE0402657D0 SE0402657D0 (sv) 2004-11-03
SE0402657L true SE0402657L (sv) 2005-05-08

Family

ID=29558594

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0402657A SE0402657L (sv) 2003-11-07 2004-11-03 Hybridarmatur

Country Status (7)

Country Link
US (1) US8794797B2 (fi)
DE (1) DE102004053680B4 (fi)
ES (1) ES2249184B1 (fi)
FI (1) FI116116B (fi)
FR (1) FR2862178B1 (fi)
GB (1) GB2409105B (fi)
SE (1) SE0402657L (fi)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5066333B2 (ja) * 2005-11-02 2012-11-07 シチズン電子株式会社 Ｌｅｄ発光装置。
DE102006018603B3 (de) * 2006-04-21 2007-12-27 Paul Heinrich Neuhorst Leuchte
WO2009016436A2 (en) * 2006-08-31 2009-02-05 Koninklijke Philips Electronics N.V. Door for a cold storage device such as a refrigerator or freezer
US20090141506A1 (en) * 2007-12-03 2009-06-04 Shih-Chi Lan Illumination Device for Kitchen Hood
DE202008008977U1 (de) 2008-07-04 2009-11-19 Pasedag, Roland Beleuchtungskörper, insbesondere in der Form einer Rettungszeichenleuchte
US9016915B2 (en) * 2009-05-28 2015-04-28 The Hong Kong University Of Science And Technology Light tube
US8197098B2 (en) * 2009-09-14 2012-06-12 Wyndsor Lighting, Llc Thermally managed LED recessed lighting apparatus
DE102010014128A1 (de) 2010-04-07 2011-10-13 Vivid Chi Matter And Light Gmbh Pendelleuchte
DE102010003805A1 (de) * 2010-04-09 2011-10-13 Zumtobel Lighting Gmbh Leuchte mit LEDs und den LEDs zugeordneten Linsen
DE102010024264B4 (de) * 2010-06-18 2014-05-15 Diehl Aerospace Gmbh Inneneinrichtungsanordnung für eine Passagierkabine
TWM498990U (zh) * 2014-10-21 2015-04-11 Lustrous Technology Ltd 具突波保護功能的ac led模組
DE102016104221B4 (de) * 2016-01-26 2022-01-05 Siteco Gmbh LED-Leuchte mit Lichtlenkelement

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8815418U1 (de) 1988-12-12 1989-02-16 Isensee-Electronic-GmbH, 7012 Fellbach Infrarot-Scheinwerfer
DE9003623U1 (de) 1990-03-28 1990-10-31 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum Abführen der Verlustwärme von einer Leiterplatte
US6045240A (en) * 1996-06-27 2000-04-04 Relume Corporation LED lamp assembly with means to conduct heat away from the LEDS
JP3849143B2 (ja) 1996-09-24 2006-11-22 セイコーエプソン株式会社 光源装置および投写型表示装置
JP2850906B1 (ja) 1997-10-24 1999-01-27 日本電気株式会社 有機ｅｌ素子およびその製造方法
DE19752797A1 (de) 1997-11-28 1999-06-10 Bosch Gmbh Robert Kühlvorrichtung für ein auf einer Leiterplatte angeordnetes, wärmeerzeugendes Bauelement
WO2000036336A1 (en) 1998-12-17 2000-06-22 Koninklijke Philips Electronics N.V. Light engine
DE19912463A1 (de) 1999-03-19 2000-09-28 Sensor Line Ges Fuer Optoelekt Verfahren zur Stabilisierung der optischen Ausgangsleistung von Leuchtdioden und Laserdioden
JP3406862B2 (ja) 1999-05-25 2003-05-19 ペンタックス株式会社 リアフォーカス式中望遠レンズ
DE19926561A1 (de) 1999-06-11 2000-12-14 Diehl Stiftung & Co Strahler, insbesondere Leseleuchte in Kabinen von Fahrzeugen
US6318886B1 (en) * 2000-02-11 2001-11-20 Whelen Engineering Company High flux led assembly
EP1363810B1 (en) * 2001-01-23 2007-05-30 Donnelly Corporation Improved vehicular lighting system
JP2003007938A (ja) 2001-06-27 2003-01-10 Ando Electric Co Ltd Ｉｃの冷却装置
US6749310B2 (en) * 2001-09-07 2004-06-15 Contrast Lighting Services, Inc. Wide area lighting effects system
US6871981B2 (en) * 2001-09-13 2005-03-29 Heads Up Technologies, Inc. LED lighting device and system
US6866401B2 (en) 2001-12-21 2005-03-15 General Electric Company Zoomable spot module
JP4067802B2 (ja) * 2001-09-18 2008-03-26 松下電器産業株式会社 照明装置
US6932495B2 (en) 2001-10-01 2005-08-23 Sloanled, Inc. Channel letter lighting using light emitting diodes
JP2003178602A (ja) * 2001-12-10 2003-06-27 Koito Mfg Co Ltd 照明装置
DE10162404A1 (de) 2001-12-19 2003-07-03 Hella Kg Hueck & Co Schaltungsanordnung für die Ansteuerung mindestens einer Leuchtdiode
US6641284B2 (en) * 2002-02-21 2003-11-04 Whelen Engineering Company, Inc. LED light assembly
US6880952B2 (en) 2002-03-18 2005-04-19 Wintriss Engineering Corporation Extensible linear light emitting diode illumination source
DE10216085A1 (de) 2002-04-11 2003-11-06 Sill Franz Gmbh Farbwechselstrahler
US6787999B2 (en) 2002-10-03 2004-09-07 Gelcore, Llc LED-based modular lamp
DE10302231A1 (de) * 2003-01-20 2004-07-29 Aqua Signal Aktiengesellschaft Spezialleuchtenfabrik Leuchten, insbesondere Flugsicherungs-Blinkleuchten
CA2634475C (en) * 2003-07-07 2014-05-20 Brasscorp Limited Led-based inspection lamp with improved collimation optics

Also Published As

Publication number Publication date
GB2409105A (en) 2005-06-15
ES2249184B1 (es) 2007-07-16
GB2409105B (en) 2006-11-29
US20050117351A1 (en) 2005-06-02
US8794797B2 (en) 2014-08-05
GB0423232D0 (en) 2004-11-24
FI20031619A (fi) 2005-05-08
FR2862178B1 (fr) 2007-01-05
FI116116B (fi) 2005-09-15
FI20031619A0 (fi) 2003-11-07
DE102004053680A1 (de) 2005-06-02
FR2862178A1 (fr) 2005-05-13
DE102004053680B4 (de) 2015-12-24
ES2249184A1 (es) 2006-03-16
SE0402657D0 (sv) 2004-11-03

Similar Documents

Publication Publication Date Title
TW200639353A (en) Illumination device having at least one light-emitting diode and vehicle headlight
ATE357123T1 (de) Elektrischer platinenheizbaustein, elektronikplatine und verfahren zum beheizen
HK1098625A1 (en) Power supply with improved cooling
DE60223050D1 (de) Fahrzeuglampenanordnung mit kühlkörper
ATE401760T1 (de) Modulare led-lampe
DE60220575D1 (de) Kuhlkörper für Bauelemente auf einer Leiterplatte
SE0402657L (sv) Hybridarmatur
TWI265644B (en) Arrangement of light-emitting diodes for a high-power light-emitting diode and method for producing the same
ATE339775T1 (de) Anschlussdose zum anschliessen an ein solarpaneel
GB0618893D0 (en) Impingement cooling of components in an electronic system
IL204698A (en) Convection cooling by direct injection for electronics
DE50305666D1 (de) Lichthärtgerät
ATE538345T1 (de) Elektrische schaltungsanordnung
ATE398262T1 (de) Beleuchtungsvorrichtung, insbesondere tunnelbeleuchtung
SE0502703L (sv) Elektrisk drivenhet med positioneringsaggregat, vilket trycker komponenter mot en kylare
ATE410642T1 (de) Lampe
ATE415805T1 (de) Wärmeableitung für mehrere integrierte schaltkreise montiert auf einer leiterplatte
TW200717977A (en) Power converter comprising a controller and a power component monuted on separate circuit boards
TW200640349A (en) Electronic device
PL364153A1 (en) Cooling system for the pcb board containing at least one heat generating electronic component
ATE370488T1 (de) Lichtabgabeeinrichtung, insbesondere verkehrssignal-lichtabgabeeinrichtung, die mit leuchtdioden aufgebaut ist
TW200520622A (en) Operating circuit for a lamp with a heat sink
WO2005008790A3 (de) Leuchtdiode sowie led-lichtquelle
TW200725078A (en) Backlight module and driving circuit module thereof
TWI265776B (en) Electronic device

Legal Events

Date Code Title Description
NAV Patent application has lapsed
NAV Patent application has lapsed