DE60220575D1 - Kuhlkörper für Bauelemente auf einer Leiterplatte - Google Patents

Kuhlkörper für Bauelemente auf einer Leiterplatte

Info

Publication number
DE60220575D1
DE60220575D1 DE60220575T DE60220575T DE60220575D1 DE 60220575 D1 DE60220575 D1 DE 60220575D1 DE 60220575 T DE60220575 T DE 60220575T DE 60220575 T DE60220575 T DE 60220575T DE 60220575 D1 DE60220575 D1 DE 60220575D1
Authority
DE
Germany
Prior art keywords
circuit board
components
printed circuit
cooling body
housing unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60220575T
Other languages
English (en)
Other versions
DE60220575T2 (de
Inventor
Gregory A Peterson
Jeffrey S Stebner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Emerson Electric Co
Original Assignee
Emerson Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Emerson Electric Co filed Critical Emerson Electric Co
Application granted granted Critical
Publication of DE60220575D1 publication Critical patent/DE60220575D1/de
Publication of DE60220575T2 publication Critical patent/DE60220575T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
    • H05K7/20918—Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Constitution Of High-Frequency Heating (AREA)
  • Electric Ovens (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Cookers (AREA)
  • Electric Stoves And Ranges (AREA)
DE60220575T 2001-04-03 2002-04-02 Kuhlkörper für Bauelemente auf einer Leiterplatte Expired - Fee Related DE60220575T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US825499 2001-04-03
US09/825,499 US7148452B2 (en) 2001-04-03 2001-04-03 Heat sink for printed circuit board components

Publications (2)

Publication Number Publication Date
DE60220575D1 true DE60220575D1 (de) 2007-07-26
DE60220575T2 DE60220575T2 (de) 2008-02-21

Family

ID=25244153

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60220575T Expired - Fee Related DE60220575T2 (de) 2001-04-03 2002-04-02 Kuhlkörper für Bauelemente auf einer Leiterplatte

Country Status (7)

Country Link
US (1) US7148452B2 (de)
EP (1) EP1248506B1 (de)
JP (1) JP4088094B2 (de)
CN (1) CN1272991C (de)
AT (1) ATE364987T1 (de)
DE (1) DE60220575T2 (de)
MX (1) MXPA02003458A (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4171685B2 (ja) * 2003-03-25 2008-10-22 三菱電機株式会社 電磁調理器
JP2007234623A (ja) * 2003-03-25 2007-09-13 Mitsubishi Electric Corp 電磁調理器
JP5071489B2 (ja) * 2003-03-25 2012-11-14 三菱電機株式会社 電磁調理器
JP2005328659A (ja) * 2004-05-14 2005-11-24 Sansha Electric Mfg Co Ltd 電子負荷装置および電源装置の防塵冷却構造
US7405944B2 (en) * 2005-01-05 2008-07-29 Lumination Llc Printed circuit board retaining device
CN2777753Y (zh) * 2005-01-19 2006-05-03 富准精密工业(深圳)有限公司 散热装置
JP4470857B2 (ja) * 2005-10-28 2010-06-02 トヨタ自動車株式会社 電気機器の冷却構造
US20070146992A1 (en) * 2005-12-27 2007-06-28 Cheng-Hsiung Chang Anti-static structure
US7817421B2 (en) * 2006-09-13 2010-10-19 Kabushiki Kaisha Yaskawa Denki Motor controller
KR101291428B1 (ko) * 2006-12-14 2013-07-30 엘지전자 주식회사 조리기기
TWI328422B (en) * 2007-07-13 2010-08-01 Inventec Corp Heat-dissipating module and electronic apparatus
CN101541156A (zh) * 2008-03-21 2009-09-23 富准精密工业(深圳)有限公司 电源驱动模组装置
US7740380B2 (en) * 2008-10-29 2010-06-22 Thrailkill John E Solid state lighting apparatus utilizing axial thermal dissipation
FI122215B (fi) * 2009-03-13 2011-10-14 Abb Oy Järjestely moottoriohjainta varten
US9312201B2 (en) * 2010-12-30 2016-04-12 Schneider Electric It Corporation Heat dissipation device
ES2412104B1 (es) 2011-03-10 2014-05-21 BSH Electrodomésticos España S.A. Placa de soporte para un soporte de circuito de un aparato doméstico, disposición con una placa de soporte de tal tipo, y campo de cocción por inducción con una disposición
ES2643136T3 (es) 2011-03-29 2017-11-21 BSH Hausgeräte GmbH Dispositivo de conmutación
EP2774454B1 (de) * 2011-11-04 2018-08-08 Arçelik Anonim Sirketi Induktionsherd
DE102012001119B4 (de) * 2012-01-23 2022-11-17 Sew-Eurodrive Gmbh & Co Kg Schaltschrank mit Gehäuse mit darin angeordneten zentral belüfteten Modulen zur Entwärmung
US9713287B2 (en) 2013-01-15 2017-07-18 Artesyn Embedded Computing, Inc. Integrated thermal inserts and cold plate
US9395772B2 (en) 2013-06-07 2016-07-19 Apple Inc. Computer internal architecture
US11899509B2 (en) 2013-06-07 2024-02-13 Apple Inc. Computer housing
EP3501586B1 (de) * 2014-03-17 2021-02-17 Fisher & Paykel Healthcare Limited Medizinische schläuche für atemsysteme
CN104185324A (zh) * 2014-07-23 2014-12-03 中国科学院广州能源研究所 一种电磁加热设备的闭式循环散热系统
US10455202B2 (en) * 2016-05-13 2019-10-22 Lenovo (Beijing) Co., Ltd. Heat dissipating apparatus and electronic device
FR3075562B1 (fr) * 2017-12-18 2019-12-20 IFP Energies Nouvelles Electronique de puissance circulaire ou toroidale refroidie par un flux
FR3075563B1 (fr) * 2017-12-18 2023-09-01 Ifp Energies Now Electronique de puissance refroidie par un flux
US11391523B2 (en) * 2018-03-23 2022-07-19 Raytheon Technologies Corporation Asymmetric application of cooling features for a cast plate heat exchanger
EP3595105B1 (de) * 2018-07-13 2024-01-24 ABB Schweiz AG Kühlkörper für ein hochspannungs-schaltgerät
DE102022108335A1 (de) * 2022-04-06 2023-10-12 Lisa Dräxlmaier GmbH Stromschiene mit aktiver kühlung

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1519673A (en) * 1921-08-01 1924-12-16 Doble Lab Heater
US2930405A (en) * 1955-05-31 1960-03-29 Brown Fintube Co Tube with internal fins and method of making same
US3149666A (en) * 1961-06-15 1964-09-22 Wakefield Eng Inc Cooler
NL122287C (de) * 1962-08-29
GB2059569B (en) 1979-09-12 1983-04-13 Racal Communications Equip Cooling apparatus
IT1128365B (it) * 1980-02-18 1986-05-28 Ricerche Spa Centro Scambiatore di calore gas liquido
DE3041656A1 (de) * 1980-11-05 1982-05-13 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiter-schaltungsaufbau
US4695924A (en) * 1986-07-17 1987-09-22 Zenith Electronics Corporation Two piece heat sink with serrated coupling
DE4015030C1 (de) * 1990-05-10 1991-11-21 Bicc-Vero Elektronics Gmbh, 2800 Bremen, De
JP2976633B2 (ja) 1991-10-21 1999-11-10 松下電器産業株式会社 誘導加熱調理器
US5304735A (en) * 1992-02-14 1994-04-19 Aavid Engineering, Inc. Heat sink for an electronic pin grid array
EP0675672A1 (de) * 1994-03-31 1995-10-04 Superluck Electrics Corp. Wärmeausstrahllvorrichtung für Induktionsheizer
DE4419866A1 (de) * 1994-06-07 1995-12-14 Ego Elektro Blanc & Fischer Steuerungsanordnung für ein Elektrowärmegerät
US6352103B1 (en) * 1996-05-22 2002-03-05 Intel Corporation High performance notebook PC cooling system
US5828549A (en) * 1996-10-08 1998-10-27 Dell U.S.A., L.P. Combination heat sink and air duct for cooling processors with a series air flow
US6219242B1 (en) * 1999-10-21 2001-04-17 Raul Martinez Apparatus for cooling a heat producing member
US6339212B1 (en) * 2000-09-26 2002-01-15 General Electric Company Cooking appliance having controls cooled by natural convection and method of cooling the same

Also Published As

Publication number Publication date
EP1248506A3 (de) 2005-10-26
CN1272991C (zh) 2006-08-30
US20020170905A1 (en) 2002-11-21
MXPA02003458A (es) 2004-07-16
US7148452B2 (en) 2006-12-12
JP2003017883A (ja) 2003-01-17
EP1248506B1 (de) 2007-06-13
JP4088094B2 (ja) 2008-05-21
DE60220575T2 (de) 2008-02-21
EP1248506A2 (de) 2002-10-09
CN1386047A (zh) 2002-12-18
ATE364987T1 (de) 2007-07-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee