RU93005019A - Способ обработки алмаза - Google Patents
Способ обработки алмазаInfo
- Publication number
- RU93005019A RU93005019A RU93005019/33A RU93005019A RU93005019A RU 93005019 A RU93005019 A RU 93005019A RU 93005019/33 A RU93005019/33 A RU 93005019/33A RU 93005019 A RU93005019 A RU 93005019A RU 93005019 A RU93005019 A RU 93005019A
- Authority
- RU
- Russia
- Prior art keywords
- diamond
- treatment method
- light
- light beam
- processed
- Prior art date
Links
- 229910003460 diamond Inorganic materials 0.000 title claims 3
- 239000010432 diamond Substances 0.000 title claims 3
- 239000000463 material Substances 0.000 claims 1
- 238000001228 spectrum Methods 0.000 claims 1
Claims (1)
- Способ заключается в том, что алмаз подвергают обработке, например шлифованию или резке, при облучении поверхности алмаза светом, имеющим длину волны в области от 190 до 360 нм. Плотность энергии падающего света, угол рассеяния светового пучка и полуширина спектра выбираются соответствующим образом. Световой пучок лучей сводят цилиндрической линзой. Кроме того, обработку проводят в определенном материале, за счет чего улучшают плоскостность обрабатываемой лицевой стороны и скорость обработки.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4-104483 | 1992-04-23 | ||
JP10448392 | 1992-04-23 | ||
JP5048452A JPH0640797A (ja) | 1992-04-23 | 1993-03-10 | ダイヤモンドの加工方法 |
JP5-48452 | 1993-03-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
RU93005019A true RU93005019A (ru) | 1995-06-09 |
RU2094225C1 RU2094225C1 (ru) | 1997-10-27 |
Family
ID=26388725
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
RU9393005019A RU2094225C1 (ru) | 1992-04-23 | 1993-04-22 | Способ обработки материала |
Country Status (5)
Country | Link |
---|---|
US (1) | US5483038A (ru) |
EP (1) | EP0567129B1 (ru) |
JP (1) | JPH0640797A (ru) |
DE (1) | DE69313709T2 (ru) |
RU (1) | RU2094225C1 (ru) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
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EP0669298A1 (en) * | 1994-02-23 | 1995-08-30 | Sumitomo Electric Industries, Ltd. | Method of working silicon nitride ceramics |
EP0669297A1 (en) * | 1994-02-23 | 1995-08-30 | Sumitomo Electric Industries, Ltd. | Method of working aluminum nitride ceramics |
US5631190A (en) * | 1994-10-07 | 1997-05-20 | Cree Research, Inc. | Method for producing high efficiency light-emitting diodes and resulting diode structures |
US5814194A (en) * | 1994-10-20 | 1998-09-29 | Matsushita Electric Industrial Co., Ltd | Substrate surface treatment method |
US5788766A (en) * | 1994-11-30 | 1998-08-04 | Sumitomo Electric Industries, Ltd. | Window and preparation thereof |
US5569399A (en) * | 1995-01-20 | 1996-10-29 | General Electric Company | Lasing medium surface modification |
US5742026A (en) * | 1995-06-26 | 1998-04-21 | Corning Incorporated | Processes for polishing glass and glass-ceramic surfaces using excimer laser radiation |
GB9514558D0 (en) * | 1995-07-17 | 1995-09-13 | Gersan Ets | Marking diamond |
US5932119A (en) * | 1996-01-05 | 1999-08-03 | Lazare Kaplan International, Inc. | Laser marking system |
IL121890A (en) * | 1997-10-06 | 2000-11-21 | Dov Zahavi | Laser assisted polishing |
US5983238A (en) * | 1997-12-26 | 1999-11-09 | Diamond Id | Gemstons identification tracking and recovery system |
DE69919579T2 (de) | 1998-12-22 | 2005-09-15 | Element Six (Pty) Ltd. | Schneiden von ultraharten materialen |
US6660964B1 (en) * | 2000-09-22 | 2003-12-09 | David Benderly | Optical modification of laser beam cross section in object marking systems |
JP2005534914A (ja) * | 2002-07-31 | 2005-11-17 | ソルヴィーアス アクチェンゲゼルシャフト | 装置および測定方法 |
JP4126377B2 (ja) * | 2004-02-05 | 2008-07-30 | 独立行政法人産業技術総合研究所 | ダイヤモンドの加工方法 |
WO2006038017A2 (en) * | 2004-10-07 | 2006-04-13 | Powerlase Limited | An apparatus and a method for processing hard material using a laser having an irradiance in the range 10 '6 to 10 '9 w/cm'2 and a repetition rate in the range 10 to 50 khz |
JP5002982B2 (ja) † | 2005-04-15 | 2012-08-15 | 住友電気工業株式会社 | 単結晶ダイヤモンドの製造方法 |
WO2006138442A2 (en) | 2005-06-14 | 2006-12-28 | Ebstein Steven M | Applications of laser-processed substrate for molecular diagnostics |
US8184284B2 (en) * | 2005-06-14 | 2012-05-22 | Ebstein Steven M | Laser-processed substrate for molecular diagnostics |
US20070062917A1 (en) * | 2005-09-21 | 2007-03-22 | Quantronix Corporation | Laser cutting and sawing method and apparatus |
US8319145B2 (en) * | 2006-07-10 | 2012-11-27 | Lazare Kaplan International, Inc. | System and method for gemstone micro-inscription |
US10016876B2 (en) | 2007-11-05 | 2018-07-10 | Baker Hughes, A Ge Company, Llc | Methods of forming polycrystalline compacts and earth-boring tools including polycrystalline compacts |
CA2704758C (en) * | 2007-11-05 | 2014-03-18 | Baker Hughes Incorporated | Methods and apparatuses for forming cutting elements having a chamfered edge for earth-boring tools |
JP2009262188A (ja) * | 2008-04-24 | 2009-11-12 | Disco Abrasive Syst Ltd | 透明板状物のレーザー加工方法 |
US8722507B2 (en) | 2011-01-06 | 2014-05-13 | Hitachi Metals, Ltd. | Method for forming identification marks on silicon carbide single crystal substrate, and silicon carbide single crystal substrate |
RU2479395C1 (ru) * | 2011-10-12 | 2013-04-20 | Общество с ограниченной ответственностью "Лазерный Центр" | Способ лазерной резки металла или сплава |
RU2479396C1 (ru) * | 2011-10-12 | 2013-04-20 | Общество с ограниченной ответственностью "Лазерный Центр" | Способ лазерной гравировки металла или сплава |
CN103192199B (zh) * | 2013-04-18 | 2015-04-29 | 苏州光韵达光电科技有限公司 | 一种用于光纤激光切割陶瓷的吸收剂 |
WO2016002036A1 (ja) * | 2014-07-03 | 2016-01-07 | 新日鐵住金株式会社 | レーザ加工装置 |
GB201603991D0 (en) | 2016-03-08 | 2016-04-20 | Univ Dundee | Processing method and apparatus |
RU2018102523A (ru) | 2015-06-24 | 2019-07-25 | Юниверсити Оф Данди | Способ и устройство для уменьшения фотоэлектронного выхода и/или выхода вторичных электронов |
US9931714B2 (en) | 2015-09-11 | 2018-04-03 | Baker Hughes, A Ge Company, Llc | Methods and systems for removing interstitial material from superabrasive materials of cutting elements using energy beams |
RU2760694C2 (ru) * | 2017-01-18 | 2021-11-29 | Айпиджи Фотоникс Корпорэйшн | Способ и системы для формирования изображений в когерентном излучении и управления с обратной связью для модификации материалов |
WO2018147959A1 (en) * | 2017-02-09 | 2018-08-16 | Us Synthetic Corporation | Energy machined polycrystalline diamond compacts and related methods |
DE102017120051B4 (de) * | 2017-08-31 | 2023-01-12 | Baosteel Tailored Blanks Gmbh | Verfahren zum Laserstrahlschweißen eines oder mehrerer Stahlbleche aus presshärtbarem Mangan-Borstahl |
KR102416293B1 (ko) | 2018-08-01 | 2022-07-01 | 고쿠리쓰다이가쿠호진 규슈다이가쿠 | 다이아몬드 평활화 방법 |
US12030143B2 (en) * | 2019-08-01 | 2024-07-09 | Sumitomo Electric Hardmetal Corp. | Method for manufacturing a cutting tool, and the cutting tool |
CN112461263B (zh) * | 2020-11-20 | 2023-03-24 | 大连理工大学 | 一种金刚石陀螺谐振子纳米制造方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3527198A (en) * | 1966-03-26 | 1970-09-08 | Tokyo Shibaura Electric Co | Method and apparatus for working diamonds by means of laser light beam |
US4401876A (en) * | 1980-05-20 | 1983-08-30 | Martin Cooper | Working gemstones |
JPS5886924A (ja) * | 1981-11-18 | 1983-05-24 | Sumitomo Electric Ind Ltd | 極細穴径ダイス用ニブ |
US4480169A (en) * | 1982-09-13 | 1984-10-30 | Macken John A | Non contact laser engraving apparatus |
US4467172A (en) * | 1983-01-03 | 1984-08-21 | Jerry Ehrenwald | Method and apparatus for laser engraving diamonds with permanent identification markings |
US4546231A (en) * | 1983-11-14 | 1985-10-08 | Group Ii Manufacturing Ltd. | Creation of a parting zone in a crystal structure |
JPS6130672A (ja) * | 1984-07-23 | 1986-02-12 | Hitachi Ltd | 選択的加工方法 |
US4670063A (en) * | 1985-04-10 | 1987-06-02 | Eaton Corporation | Semiconductor processing technique with differentially fluxed radiation at incremental thicknesses |
JPH01245993A (ja) * | 1988-03-27 | 1989-10-02 | Semiconductor Energy Lab Co Ltd | 薄膜加工装置 |
US4861421A (en) * | 1988-06-01 | 1989-08-29 | Texas Instruments Incorporated | Photochemical semiconductor etching |
CA1325041C (en) * | 1988-08-15 | 1993-12-07 | Michael Peter Gaukroger | Cutting using high energy radiation |
JPH02112890A (ja) * | 1988-10-20 | 1990-04-25 | Showa Denko Kk | ダイヤモンドの切断方法 |
CA2009514C (en) * | 1990-02-07 | 1995-04-25 | Mahmud U. Islam | Laser rough and finish machining of hard materials |
JPH03264181A (ja) * | 1990-03-10 | 1991-11-25 | Onoda Cement Co Ltd | ダイヤモンドの研磨方法 |
US5410125A (en) * | 1990-10-11 | 1995-04-25 | Harry Winston, S.A. | Methods for producing indicia on diamonds |
US5149938A (en) * | 1990-10-11 | 1992-09-22 | Harry Winston, S.A. | Methods for producing indicia on diamonds |
JPH0624896A (ja) * | 1992-07-09 | 1994-02-01 | Sumitomo Electric Ind Ltd | ダイヤモンド合成方法 |
US5328715A (en) * | 1993-02-11 | 1994-07-12 | General Electric Company | Process for making metallized vias in diamond substrates |
-
1993
- 1993-03-10 JP JP5048452A patent/JPH0640797A/ja active Pending
- 1993-04-22 DE DE69313709T patent/DE69313709T2/de not_active Expired - Fee Related
- 1993-04-22 RU RU9393005019A patent/RU2094225C1/ru active
- 1993-04-22 EP EP93106566A patent/EP0567129B1/en not_active Expired - Lifetime
- 1993-04-22 US US08/050,639 patent/US5483038A/en not_active Expired - Fee Related
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