RU93005019A - Способ обработки алмаза - Google Patents

Способ обработки алмаза

Info

Publication number
RU93005019A
RU93005019A RU93005019/33A RU93005019A RU93005019A RU 93005019 A RU93005019 A RU 93005019A RU 93005019/33 A RU93005019/33 A RU 93005019/33A RU 93005019 A RU93005019 A RU 93005019A RU 93005019 A RU93005019 A RU 93005019A
Authority
RU
Russia
Prior art keywords
diamond
treatment method
light
light beam
processed
Prior art date
Application number
RU93005019/33A
Other languages
English (en)
Other versions
RU2094225C1 (ru
Inventor
Ота Нобухиро
Харано Кацуко
Фудзимори Наодзи
Original Assignee
Сумитомо Электрик Индастриз, Лтд.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP5048452A external-priority patent/JPH0640797A/ja
Application filed by Сумитомо Электрик Индастриз, Лтд. filed Critical Сумитомо Электрик Индастриз, Лтд.
Publication of RU93005019A publication Critical patent/RU93005019A/ru
Application granted granted Critical
Publication of RU2094225C1 publication Critical patent/RU2094225C1/ru

Links

Claims (1)

  1. Способ заключается в том, что алмаз подвергают обработке, например шлифованию или резке, при облучении поверхности алмаза светом, имеющим длину волны в области от 190 до 360 нм. Плотность энергии падающего света, угол рассеяния светового пучка и полуширина спектра выбираются соответствующим образом. Световой пучок лучей сводят цилиндрической линзой. Кроме того, обработку проводят в определенном материале, за счет чего улучшают плоскостность обрабатываемой лицевой стороны и скорость обработки.
RU9393005019A 1992-04-23 1993-04-22 Способ обработки материала RU2094225C1 (ru)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP4-104483 1992-04-23
JP10448392 1992-04-23
JP5048452A JPH0640797A (ja) 1992-04-23 1993-03-10 ダイヤモンドの加工方法
JP5-48452 1993-03-10

Publications (2)

Publication Number Publication Date
RU93005019A true RU93005019A (ru) 1995-06-09
RU2094225C1 RU2094225C1 (ru) 1997-10-27

Family

ID=26388725

Family Applications (1)

Application Number Title Priority Date Filing Date
RU9393005019A RU2094225C1 (ru) 1992-04-23 1993-04-22 Способ обработки материала

Country Status (5)

Country Link
US (1) US5483038A (ru)
EP (1) EP0567129B1 (ru)
JP (1) JPH0640797A (ru)
DE (1) DE69313709T2 (ru)
RU (1) RU2094225C1 (ru)

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DE69919579T2 (de) 1998-12-22 2005-09-15 Element Six (Pty) Ltd. Schneiden von ultraharten materialen
US6660964B1 (en) * 2000-09-22 2003-12-09 David Benderly Optical modification of laser beam cross section in object marking systems
JP2005534914A (ja) * 2002-07-31 2005-11-17 ソルヴィーアス　アクチェンゲゼルシャフト 装置および測定方法
JP4126377B2 (ja) * 2004-02-05 2008-07-30 独立行政法人産業技術総合研究所 ダイヤモンドの加工方法
WO2006038017A2 (en) * 2004-10-07 2006-04-13 Powerlase Limited An apparatus and a method for processing hard material using a laser having an irradiance in the range 10 '6 to 10 '9 w/cm'2 and a repetition rate in the range 10 to 50 khz
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WO2006138442A2 (en) 2005-06-14 2006-12-28 Ebstein Steven M Applications of laser-processed substrate for molecular diagnostics
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US8319145B2 (en) * 2006-07-10 2012-11-27 Lazare Kaplan International, Inc. System and method for gemstone micro-inscription
US10016876B2 (en) 2007-11-05 2018-07-10 Baker Hughes, A Ge Company, Llc Methods of forming polycrystalline compacts and earth-boring tools including polycrystalline compacts
CA2704758C (en) * 2007-11-05 2014-03-18 Baker Hughes Incorporated Methods and apparatuses for forming cutting elements having a chamfered edge for earth-boring tools
JP2009262188A (ja) * 2008-04-24 2009-11-12 Disco Abrasive Syst Ltd 透明板状物のレーザー加工方法
US8722507B2 (en) 2011-01-06 2014-05-13 Hitachi Metals, Ltd. Method for forming identification marks on silicon carbide single crystal substrate, and silicon carbide single crystal substrate
RU2479395C1 (ru) * 2011-10-12 2013-04-20 Общество с ограниченной ответственностью "Лазерный Центр" Способ лазерной резки металла или сплава
RU2479396C1 (ru) * 2011-10-12 2013-04-20 Общество с ограниченной ответственностью "Лазерный Центр" Способ лазерной гравировки металла или сплава
CN103192199B (zh) * 2013-04-18 2015-04-29 苏州光韵达光电科技有限公司 一种用于光纤激光切割陶瓷的吸收剂
WO2016002036A1 (ja) * 2014-07-03 2016-01-07 新日鐵住金株式会社 レーザ加工装置
GB201603991D0 (en) 2016-03-08 2016-04-20 Univ Dundee Processing method and apparatus
RU2018102523A (ru) 2015-06-24 2019-07-25 Юниверсити Оф Данди Способ и устройство для уменьшения фотоэлектронного выхода и/или выхода вторичных электронов
US9931714B2 (en) 2015-09-11 2018-04-03 Baker Hughes, A Ge Company, Llc Methods and systems for removing interstitial material from superabrasive materials of cutting elements using energy beams
RU2760694C2 (ru) * 2017-01-18 2021-11-29 Айпиджи Фотоникс Корпорэйшн Способ и системы для формирования изображений в когерентном излучении и управления с обратной связью для модификации материалов
WO2018147959A1 (en) * 2017-02-09 2018-08-16 Us Synthetic Corporation Energy machined polycrystalline diamond compacts and related methods
DE102017120051B4 (de) * 2017-08-31 2023-01-12 Baosteel Tailored Blanks Gmbh Verfahren zum Laserstrahlschweißen eines oder mehrerer Stahlbleche aus presshärtbarem Mangan-Borstahl
KR102416293B1 (ko) 2018-08-01 2022-07-01 고쿠리쓰다이가쿠호진 규슈다이가쿠 다이아몬드 평활화 방법
US12030143B2 (en) * 2019-08-01 2024-07-09 Sumitomo Electric Hardmetal Corp. Method for manufacturing a cutting tool, and the cutting tool
CN112461263B (zh) * 2020-11-20 2023-03-24 大连理工大学 一种金刚石陀螺谐振子纳米制造方法

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