JPS55147819A - Working method of substrate for elastic surface wave filter - Google Patents
Working method of substrate for elastic surface wave filterInfo
- Publication number
- JPS55147819A JPS55147819A JP5568479A JP5568479A JPS55147819A JP S55147819 A JPS55147819 A JP S55147819A JP 5568479 A JP5568479 A JP 5568479A JP 5568479 A JP5568479 A JP 5568479A JP S55147819 A JPS55147819 A JP S55147819A
- Authority
- JP
- Japan
- Prior art keywords
- main face
- substrate
- wave filter
- surface wave
- elastic surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
PURPOSE:To eliminate the influence of the bulk wave by subjecting the main face to a processing using grain to make the main face rough after working the main face by irradiation of a laser light to form a groove when the second main face opposite to the first main face of the piezoelectric substrate for elastic surface wave filter is made rough. CONSTITUTION:The main face of a substrate for elastic surface wave filter is made rough by laser processing machine 10. That is, laser working machine 10 consists of laser oscillator 11 and beam scanning unit 13 which receives the laser light reflected by mirror 12. The laser light is irradiated to the main face, which should be made rough, of substrate 15 to form a groove by this processing machine 10, and further, grain is used to polish it, thus achieving a desired roughing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5568479A JPS55147819A (en) | 1979-05-09 | 1979-05-09 | Working method of substrate for elastic surface wave filter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5568479A JPS55147819A (en) | 1979-05-09 | 1979-05-09 | Working method of substrate for elastic surface wave filter |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55147819A true JPS55147819A (en) | 1980-11-18 |
Family
ID=13005719
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5568479A Pending JPS55147819A (en) | 1979-05-09 | 1979-05-09 | Working method of substrate for elastic surface wave filter |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55147819A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017158090A (en) * | 2016-03-03 | 2017-09-07 | 株式会社ディスコ | Baw device and method of manufacturing the same |
-
1979
- 1979-05-09 JP JP5568479A patent/JPS55147819A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017158090A (en) * | 2016-03-03 | 2017-09-07 | 株式会社ディスコ | Baw device and method of manufacturing the same |
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