RU2652254C2 - Реактивный клей-расплав - Google Patents

Реактивный клей-расплав Download PDF

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Publication number
RU2652254C2
RU2652254C2 RU2015135522A RU2015135522A RU2652254C2 RU 2652254 C2 RU2652254 C2 RU 2652254C2 RU 2015135522 A RU2015135522 A RU 2015135522A RU 2015135522 A RU2015135522 A RU 2015135522A RU 2652254 C2 RU2652254 C2 RU 2652254C2
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RU
Russia
Prior art keywords
silane
adhesive composition
hot melt
melt adhesive
wax
Prior art date
Application number
RU2015135522A
Other languages
English (en)
Russian (ru)
Other versions
RU2015135522A (ru
Inventor
Ву СУЭНЬ
Original Assignee
ХЕНКЕЛЬ АйПи ЭНД ХОЛДИНГ ГМБХ
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Publication of RU2015135522A publication Critical patent/RU2015135522A/ru
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Publication of RU2652254C2 publication Critical patent/RU2652254C2/ru

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284Application of adhesive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32Polymers modified by chemical after-treatment
    • C08G65/329Polymers modified by chemical after-treatment with organic compounds
    • C08G65/336Polymers modified by chemical after-treatment with organic compounds containing silicon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/02Polysilicates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L91/00Compositions of oils, fats or waxes; Compositions of derivatives thereof
    • C08L91/06Waxes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/02Polyalkylene oxides
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J191/00Adhesives based on oils, fats or waxes; Adhesives based on derivatives thereof
    • C09J191/06Waxes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L93/00Compositions of natural resins; Compositions of derivatives thereof
    • C08L93/04Rosin
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00Presence of polyolefin
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00Presence of (meth)acrylic polymer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2471/00Presence of polyether
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2491/00Presence of oils, fats or waxes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Chemical & Material Sciences (AREA)
  • Adhesives Or Adhesive Processes (AREA)
RU2015135522A 2013-01-24 2014-01-02 Реактивный клей-расплав RU2652254C2 (ru)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361756231P 2013-01-24 2013-01-24
US61/756,231 2013-01-24
PCT/US2014/010059 WO2014116398A1 (en) 2013-01-24 2014-01-02 Reactive hot melt adhesive

Publications (2)

Publication Number Publication Date
RU2015135522A RU2015135522A (ru) 2017-03-02
RU2652254C2 true RU2652254C2 (ru) 2018-04-25

Family

ID=51227942

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2015135522A RU2652254C2 (ru) 2013-01-24 2014-01-02 Реактивный клей-расплав

Country Status (11)

Country Link
US (1) US9428677B2 (enExample)
EP (1) EP2948513B1 (enExample)
JP (1) JP6117941B2 (enExample)
CN (1) CN104981527B (enExample)
AU (1) AU2014209751B2 (enExample)
BR (1) BR112015017087A2 (enExample)
CL (1) CL2015002036A1 (enExample)
ES (1) ES2753378T3 (enExample)
PL (1) PL2948513T3 (enExample)
RU (1) RU2652254C2 (enExample)
WO (1) WO2014116398A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105899614B (zh) 2014-01-14 2019-06-04 汉高知识产权控股有限责任公司 具有改进粘合性的反应性热熔性粘合剂
US20160326408A1 (en) * 2015-05-08 2016-11-10 Henkel lP & Holding GmbH Moisture curable hot melt adhesive with high adhesion strength and fast set time
EP3231518B1 (de) * 2016-04-15 2023-10-11 Jowat SE Stangenförmiger schmelzklebstoffkörper für heissklebepistolen
WO2019109328A1 (en) * 2017-12-08 2019-06-13 Henkel Ag & Co. Kgaa Moisture Curable Hot-melt Adhesive Composition
MX2021001219A (es) * 2018-07-31 2021-04-12 Covestro Netherlands Bv Metodo para monitorear la calidad de un colchon.
DE102019132472A1 (de) * 2018-12-03 2020-06-04 Toyota Boshoku Kabushiki Kaisha Zweikomponenten-Heißschmelzklebstoff, ein verfestigtes Produkt und ein Verfahren zur Steuerung einer Vernetzungszeit
CN110452663B (zh) * 2019-09-11 2021-01-08 久智光电子材料科技有限公司 石英制品粘结剂及其制备方法、在石英制品加工中的应用
US11859092B2 (en) * 2021-03-26 2024-01-02 Te Connectivity Solutions Gmbh Printable non-curable thixotropic hot melt composition
US11859093B2 (en) * 2021-03-26 2024-01-02 Te Connectivity Solutions Gmbh Printable non-curable thixotropic hot melt composition
CN113831886B (zh) * 2021-09-23 2023-09-15 烟台德邦科技股份有限公司 一种粘接低表面能材料的聚氨酯热熔胶及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2355724C1 (ru) * 2005-04-29 2009-05-20 Зика Текнолоджи Аг Влагоотверждающаяся композиция с повышенной эластичностью
EP2289997A1 (en) * 2008-05-02 2011-03-02 Kaneka Corporation Room temperature-curable composition and cured product thereof
US20120042499A1 (en) * 2009-03-19 2012-02-23 Bostik S.A. Adhesive composition with improved green strength
US20120123016A1 (en) * 2009-04-06 2012-05-17 Henkel Ag & Co. Kgaa Curable composition
US20120322926A1 (en) * 2009-12-22 2012-12-20 Henkel Corporation Moisture cure hot melt adhesives

Family Cites Families (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5974149A (ja) 1982-10-20 1984-04-26 Kanegafuchi Chem Ind Co Ltd 硬化性組成物
JPS60235747A (ja) 1984-05-07 1985-11-22 Nippon Telegr & Teleph Corp <Ntt> 光フアイバ接続部の補強方法
US4783504A (en) 1986-02-28 1988-11-08 Shell Oil Company Hot melt adhesive containing a silane grafted hydrogenated block polymer
GB8625528D0 (en) 1986-10-24 1986-11-26 Swift Adhesives Ltd Adhesive compositions
CA1312408C (en) 1987-10-09 1993-01-05 Peter W. Merz Reactive, thixotropic hot-melt adhesive on silane basis
JP2650696B2 (ja) 1987-12-18 1997-09-03 横浜ゴム株式会社 ホットメルト接着剤組成物
GB8811615D0 (en) 1988-05-17 1988-06-22 Swift Adhesives Ltd Adhesive compositions
GB8811616D0 (en) 1988-05-17 1988-06-22 Swift Adhesives Ltd Compositions
JP2649824B2 (ja) 1988-05-31 1997-09-03 三井・デュポンポリケミカル株式会社 架橋性樹脂組成物
DE3827464A1 (de) 1988-08-12 1990-02-22 Henkel Kgaa Alkoxysilanterminierte, feuchtigkeitsvernetzende schmelzkleber sowie ihre verwendung als klebe- und dichtmassen
US5097053A (en) 1988-10-13 1992-03-17 Basf Corporation Fast-cure polyurethane sealant composition containing silyl-substituted guanidine accelerators
JPH02150488A (ja) 1988-12-02 1990-06-08 Mitsui Toatsu Chem Inc プライマー組成物とその接着加工方法
GB8924619D0 (en) 1989-11-01 1989-12-20 Swift Adhesives Ltd Crosslinkable polymers
GB8927003D0 (en) 1989-11-29 1990-01-17 Swift Adhesives Ltd Chemical compounds
US5331049A (en) 1990-06-22 1994-07-19 Exxon Chemical Patents Inc. Water-curable, hot melt adhesive composition
JPH04176028A (ja) 1990-11-07 1992-06-23 Funai Denki Kenkyusho:Kk ディスクの偏心ずれ吸収装置
US5210150A (en) 1991-11-22 1993-05-11 E. I. Du Pont De Nemours And Company Moisture-curable melt-processible ethylene copolymer adhesives
US5346939A (en) 1993-01-25 1994-09-13 Minnesota Mining And Manufacturing Company Water curable resin compositions
US5472785A (en) * 1994-04-12 1995-12-05 Minnesota Mining And Manufacturing Company Reactive wax-containing moisture curable hot melt composition
US5461110A (en) 1994-05-04 1995-10-24 Du Pont Canada Inc. Cross-linkable adhesive polymers
GB2292154A (en) 1994-08-10 1996-02-14 Minnesota Mining & Mfg Abrasive elements comprising adhesives cross-linked via silyl groups
US5669940A (en) 1995-08-09 1997-09-23 Minnesota Mining And Manufacturing Company Abrasive article
EP0966503B2 (en) 1997-03-14 2008-01-09 Minnesota Mining And Manufacturing Company Cure-on-demand, moisture-curable compositions having reactive silane functionality
JP3681854B2 (ja) 1997-03-17 2005-08-10 ダイセル化学工業株式会社 シラン変性熱可塑性エラストマー及びホットメルト接着剤
US6828403B2 (en) 1998-04-27 2004-12-07 Essex Specialty Products, Inc. Method of bonding a window to a substrate using a silane functional adhesive composition
JP5122701B2 (ja) 1998-04-27 2013-01-16 ザ ダウ ケミカル カンパニー オンデマンド硬化接着剤およびオンデマンド接着剤をその上に有する窓モジュール
US6121354A (en) * 1998-11-19 2000-09-19 Bostik, Inc. High performance single-component sealant
JP3030020B1 (ja) 1998-12-10 2000-04-10 コニシ株式会社 ウレタン系樹脂及びその製造方法
EP1153982B1 (en) 1999-01-05 2004-08-04 Kaneka Corporation Curable resin composition
US6303731B1 (en) 1999-01-20 2001-10-16 H.B. Fuller Licensing & Financing Inc. Moisture curable polyurethane compositions
DE60037357T2 (de) 1999-03-18 2008-12-04 Kaneka Corp. Härtbare Zusammensetzung
EP1038901B1 (en) 1999-03-25 2005-07-27 Kaneka Corporation Curable composition
CA2302653A1 (en) 1999-03-29 2000-09-29 Hideharu Jyono Curable composition
JP4414045B2 (ja) 1999-06-01 2010-02-10 株式会社カネカ 硬化性樹脂組成物
DE10132678A1 (de) 2000-07-26 2002-02-07 Henkel Kgaa Alkoxysilylgruppenhaltige Bindemittel und Bindemittelzusammensetzungen, Verfahren zu deren Herstellung und deren Verwendung
US6433055B1 (en) 2000-09-13 2002-08-13 Dow Corning Corporation Electrically conductive hot-melt silicone adhesive composition
ATE510898T1 (de) * 2000-10-27 2011-06-15 Metabolix Inc Zusammensetzungen enthaltend polyhydroxyalkanoate und reaktive monomere
US6664323B2 (en) 2001-02-02 2003-12-16 General Electric Company Moisture curable sealants
DE10139132A1 (de) 2001-08-09 2003-02-27 Consortium Elektrochem Ind Alkoxyvernetzende einkomponentige feuchtigkeitshärtende Massen
DE60203973T2 (de) 2001-08-14 2006-02-23 Kaneka Corp. Härtbares Harz
DE60216966T2 (de) 2001-11-29 2007-10-04 Kaneka Corp. Härtbare zusammensetzung
MXPA02011491A (es) * 2001-12-06 2003-06-30 Rohm & Haas Adhesivo de fusion en caliente.
JP3621678B2 (ja) 2001-12-26 2005-02-16 コニシ株式会社 ウレタン樹脂系ホットメルト接着剤
US6649016B2 (en) 2002-03-04 2003-11-18 Dow Global Technologies Inc. Silane functional adhesive composition and method of bonding a window to a substrate without a primer
US6749943B1 (en) 2002-07-02 2004-06-15 3M Innovative Properties Company Silane based moisture curing hot-melt adhesives
TW200407390A (en) 2002-09-03 2004-05-16 Rohm & Haas Reactive hot-melt adhesive compositions with improved adhesion to difficult substrates
US7700707B2 (en) * 2002-10-15 2010-04-20 Exxonmobil Chemical Patents Inc. Polyolefin adhesive compositions and articles made therefrom
US6803412B2 (en) 2003-03-13 2004-10-12 H.B. Fuller Licensing & Financing Inc. Moisture curable hot melt sealants for glass constructions
JP2005015885A (ja) 2003-06-27 2005-01-20 Ebara Corp 基板処理方法及び装置
DE10338344A1 (de) 2003-08-21 2005-03-24 Clariant Gmbh Modifizierte Polyolefinwachse
JP4176028B2 (ja) 2004-02-16 2008-11-05 大阪瓦斯株式会社 エネルギシステム
US7645831B2 (en) 2004-03-26 2010-01-12 Henkel Ag & Co. Kgaa Reactive hot melt adhesives
DE602005026022D1 (de) * 2004-08-11 2011-03-03 Konishi Co Ltd Reaktive schmelze-harz-zusammensetzung und reaktiver schmelzhaftkleber
US20080241407A1 (en) 2004-09-02 2008-10-02 Hsien-Kun Chu Silicone-Containing Hot-Melt Compositions
DE102004055450A1 (de) 2004-11-17 2006-05-18 Degussa Ag Feuchtigkeitshärtendes Bindemittel
DE102004062653A1 (de) 2004-12-24 2006-07-06 Bayer Materialscience Ag Feuchthärtende Zusammensetzung und Schmelzklebstoff
GB0515052D0 (en) * 2005-07-22 2005-08-31 Dow Corning Organosiloxane compositions
EP1849845A1 (de) 2006-04-26 2007-10-31 Sika Technology AG Feuchtigkeitshärtende Zusammensetzungen enthaltend silanfunktionelle Polymere und Aminosilan-Addukte
AU2008228842B2 (en) 2007-03-21 2014-01-16 Avery Dennison Corporation Pressure sensitive adhesives
US9212300B2 (en) * 2007-08-10 2015-12-15 Henkel Ag & Co. Kgaa Reactive hot melt adhesive
EP2347352B1 (en) 2008-09-16 2019-11-06 Beckman Coulter, Inc. Interactive tree plot for flow cytometry data
US9365751B2 (en) * 2012-07-24 2016-06-14 Henkel IP & Holding GmbH Reactive hot melt adhesive

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2355724C1 (ru) * 2005-04-29 2009-05-20 Зика Текнолоджи Аг Влагоотверждающаяся композиция с повышенной эластичностью
EP2289997A1 (en) * 2008-05-02 2011-03-02 Kaneka Corporation Room temperature-curable composition and cured product thereof
US20120042499A1 (en) * 2009-03-19 2012-02-23 Bostik S.A. Adhesive composition with improved green strength
US20120123016A1 (en) * 2009-04-06 2012-05-17 Henkel Ag & Co. Kgaa Curable composition
US20120322926A1 (en) * 2009-12-22 2012-12-20 Henkel Corporation Moisture cure hot melt adhesives

Also Published As

Publication number Publication date
CL2015002036A1 (es) 2016-02-12
PL2948513T3 (pl) 2020-01-31
EP2948513B1 (en) 2019-08-07
AU2014209751B2 (en) 2017-07-06
JP2016508528A (ja) 2016-03-22
ES2753378T3 (es) 2020-04-08
JP6117941B2 (ja) 2017-04-19
BR112015017087A2 (pt) 2017-07-11
EP2948513A1 (en) 2015-12-02
RU2015135522A (ru) 2017-03-02
US20150322311A1 (en) 2015-11-12
WO2014116398A1 (en) 2014-07-31
AU2014209751A1 (en) 2015-07-23
EP2948513A4 (en) 2016-10-19
US9428677B2 (en) 2016-08-30
CN104981527B (zh) 2018-02-23
CN104981527A (zh) 2015-10-14

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