RU2640574C2 - Интегральный электронный модуль с охлаждающей структурой - Google Patents

Интегральный электронный модуль с охлаждающей структурой Download PDF

Info

Publication number
RU2640574C2
RU2640574C2 RU2014146775A RU2014146775A RU2640574C2 RU 2640574 C2 RU2640574 C2 RU 2640574C2 RU 2014146775 A RU2014146775 A RU 2014146775A RU 2014146775 A RU2014146775 A RU 2014146775A RU 2640574 C2 RU2640574 C2 RU 2640574C2
Authority
RU
Russia
Prior art keywords
fluid
substrate
heat
electronic module
cooling
Prior art date
Application number
RU2014146775A
Other languages
English (en)
Russian (ru)
Other versions
RU2014146775A (ru
Inventor
Ари Юхани БРУСИЛА
Original Assignee
Конинклейке Филипс Н.В.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Конинклейке Филипс Н.В. filed Critical Конинклейке Филипс Н.В.
Publication of RU2014146775A publication Critical patent/RU2014146775A/ru
Application granted granted Critical
Publication of RU2640574C2 publication Critical patent/RU2640574C2/ru

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/20—Arrangements or instruments for measuring magnetic variables involving magnetic resonance
    • G01R33/28—Details of apparatus provided for in groups G01R33/44 - G01R33/64
    • G01R33/32—Excitation or detection systems, e.g. using radio frequency signals
    • G01R33/34—Constructional details, e.g. resonators, specially adapted to MR
    • G01R33/34015—Temperature-controlled RF coils
    • G01R33/3403—Means for cooling of the RF coils, e.g. a refrigerator or a cooling vessel specially adapted for housing an RF coil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
RU2014146775A 2012-04-23 2013-04-11 Интегральный электронный модуль с охлаждающей структурой RU2640574C2 (ru)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261636933P 2012-04-23 2012-04-23
US61/636,933 2012-04-23
PCT/IB2013/052876 WO2013160788A1 (en) 2012-04-23 2013-04-11 Integrated electronics module with cooling structure

Publications (2)

Publication Number Publication Date
RU2014146775A RU2014146775A (ru) 2016-06-10
RU2640574C2 true RU2640574C2 (ru) 2018-01-10

Family

ID=48483116

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2014146775A RU2640574C2 (ru) 2012-04-23 2013-04-11 Интегральный электронный модуль с охлаждающей структурой

Country Status (7)

Country Link
US (1) US20150123663A1 (enExample)
EP (1) EP2842162A1 (enExample)
JP (1) JP6267686B2 (enExample)
CN (1) CN104428891B (enExample)
BR (1) BR112014026062A2 (enExample)
RU (1) RU2640574C2 (enExample)
WO (1) WO2013160788A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9674984B2 (en) 2015-06-23 2017-06-06 Cubic Corporation Plastic chassis for liquid cooled electronic components
US10237967B2 (en) * 2015-10-02 2019-03-19 Analogic Corporation Cooling assembly for electronics assembly of imaging system
US11010326B2 (en) 2018-09-20 2021-05-18 Western Digital Technologies, Inc. Universal serial bus voltage reducing adaptor

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU1325963A1 (ru) * 1985-05-23 1991-08-07 Истринское Отделение Всесоюзного Электротехнического Института Им.В.И.Ленина Радиоэлектронный блок
US6386278B1 (en) * 1998-08-04 2002-05-14 Jurgen Schulz-Harder Cooler
US20040035245A1 (en) * 2001-01-11 2004-02-26 Roland Albert Plastic control plate of a hydraulic gearbox control device in a motor vehicle
RU53072U1 (ru) * 2005-04-06 2006-04-27 Федеральное государственное унитарное предприятие "Научно-исследовательский институт Научно-производственное объединение "ЛУЧ" (ФГУП "НИИ НПО "ЛУЧ") Устройство для охлаждения и термостатирования полупроводниковых приборов
US20060157225A1 (en) * 2005-01-18 2006-07-20 Yves Martin High turbulence heat exchanger

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3666644D1 (en) * 1985-11-19 1989-11-30 Nec Corp Liquid cooling system for integrated circuit chips
EP0236065B1 (en) * 1986-02-25 1990-11-28 Nec Corporation Liquid cooling system for integrated circuit chips
JPS6351454U (enExample) * 1986-09-22 1988-04-07
CA1327710C (en) * 1987-12-07 1994-03-15 Kazuhiko Umezawa Cooling system for ic package
JPH06209060A (ja) * 1992-10-15 1994-07-26 Sun Microsyst Inc 半導体チップを冷却する装置及び方法
JPH08103426A (ja) * 1994-10-06 1996-04-23 Toshiba Corp 磁気共鳴イメージング装置の遮蔽シート
JPH10189845A (ja) * 1996-12-25 1998-07-21 Denso Corp 半導体素子の放熱装置
US6400012B1 (en) * 1997-09-17 2002-06-04 Advanced Energy Voorhees, Inc. Heat sink for use in cooling an integrated circuit
US6011245A (en) * 1999-03-19 2000-01-04 Bell; James H. Permanent magnet eddy current heat generator
JP2002200055A (ja) * 2000-12-28 2002-07-16 Toshiba Medical System Co Ltd 磁気共鳴イメージング装置
JP2002094192A (ja) * 2000-09-12 2002-03-29 Denki Kagaku Kogyo Kk 回路基板の冷却構造
JP4969738B2 (ja) * 2001-06-28 2012-07-04 株式会社東芝 セラミックス回路基板およびそれを用いた半導体モジュール
US20060293727A1 (en) * 2002-05-09 2006-12-28 Greg Spooner System and method for treating exposed tissue with light emitting diodes
JP2005288044A (ja) * 2004-04-06 2005-10-20 Hitachi Medical Corp 磁気共鳴イメージング装置
GB2419417B (en) * 2004-10-20 2007-05-16 Gen Electric Gradient bore cooling and RF shield
US7397665B2 (en) 2004-12-08 2008-07-08 Optherm - Thermal Solutions Ltd. Integral heat-dissipation system for electronic boards
JP4759384B2 (ja) * 2005-12-20 2011-08-31 昭和電工株式会社 半導体モジュール
EP2059303A1 (en) 2006-08-30 2009-05-20 Koninklijke Philips Electronics N.V. Apparatus for thermal treatment of tissue
ES2363025T3 (es) * 2006-10-27 2011-07-19 Agie Charmilles Sa Unidad de placa de circuito y procedimiento para la producción de la misma.
JP5222735B2 (ja) * 2007-02-06 2013-06-26 株式会社日立メディコ 磁気共鳴イメージング装置および傾斜磁場コイル
JP2010114121A (ja) * 2008-11-04 2010-05-20 Daikin Ind Ltd 電装部品の放熱器
US20100175857A1 (en) * 2009-01-15 2010-07-15 General Electric Company Millichannel heat sink, and stack and apparatus using the same
DE102009005915B4 (de) * 2009-01-23 2013-07-11 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul in Druckkontaktausführung
WO2011036607A1 (en) 2009-09-24 2011-03-31 Koninklijke Philips Electronics N.V. High intensity focused ultrasound positioning mechanism
DE102009046321B4 (de) * 2009-11-03 2013-10-17 Bruker Biospin Ag Kühlvorrichtung zur kryogenen Kühlung eines NMR-Detektionssystems mit Hilfe eines mit kryogenen Fluid gefüllten Behälters
CN201667332U (zh) * 2010-03-29 2010-12-08 比亚迪股份有限公司 一种半导体功率模块
DE102010032078B4 (de) * 2010-07-23 2012-02-16 Siemens Aktiengesellschaft Leistungselektronik-Baueinheit für eine Magnetresonanzeinrichtung und Magnetresonanzeinrichtung

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU1325963A1 (ru) * 1985-05-23 1991-08-07 Истринское Отделение Всесоюзного Электротехнического Института Им.В.И.Ленина Радиоэлектронный блок
US6386278B1 (en) * 1998-08-04 2002-05-14 Jurgen Schulz-Harder Cooler
US20040035245A1 (en) * 2001-01-11 2004-02-26 Roland Albert Plastic control plate of a hydraulic gearbox control device in a motor vehicle
US20060157225A1 (en) * 2005-01-18 2006-07-20 Yves Martin High turbulence heat exchanger
RU53072U1 (ru) * 2005-04-06 2006-04-27 Федеральное государственное унитарное предприятие "Научно-исследовательский институт Научно-производственное объединение "ЛУЧ" (ФГУП "НИИ НПО "ЛУЧ") Устройство для охлаждения и термостатирования полупроводниковых приборов

Also Published As

Publication number Publication date
RU2014146775A (ru) 2016-06-10
BR112014026062A2 (pt) 2017-06-27
CN104428891B (zh) 2018-03-13
JP6267686B2 (ja) 2018-01-24
CN104428891A (zh) 2015-03-18
JP2015518660A (ja) 2015-07-02
US20150123663A1 (en) 2015-05-07
EP2842162A1 (en) 2015-03-04
WO2013160788A1 (en) 2013-10-31

Similar Documents

Publication Publication Date Title
CA2961001C (en) Liquid cooled metal core printed circuit board
US7417861B2 (en) Vehicular power converter
RU2620867C2 (ru) Ультразвуковой матричный зонд с рассеивающим тепло кабелем и теплообменом через опорный блок
JP6966324B2 (ja) 超音波トランスデューサのアクティブ熱管理に対するシステム、方法及び装置
US9151814B2 (en) Power electronics assembly for a magnetic resonance device
RU2640574C2 (ru) Интегральный электронный модуль с охлаждающей структурой
KR20130054701A (ko) 천층 열에너지 유지체 및 유체 교환에 의해 열을 방출하는 전자기기
KR20110003474A (ko) 내부 냉각 챔버를 갖는 고주파 발생 장치
US20240375941A1 (en) Temperature-control arrangement for a microelectric system
CN102138374A (zh) 具有多个模块化信号计算机单元的飞行器信号计算机系统
JP2015518660A5 (enExample)
JP2006257912A (ja) ポンプ装置
KR20100037036A (ko) 액체 펌프의 가동을 위한 전자 부품의 열 배출 방법
JP2008511147A (ja) 操作ハウジング
CN103500734A (zh) 一种液冷绝缘式散热器
CN117766973A (zh) 一种基于有源相控阵天线散热的微流道散热器
CN223528370U (zh) 一种外置散热式机柜
JP4844647B2 (ja) 電気装置及びスイッチング電源装置
CN105309041A (zh) 加热装置
CN220674191U (zh) 冷却装置、电子装置及供电装置
KR20190125904A (ko) 직류 전도식 전자기 펌프
US12178008B2 (en) Cooling apparatus and cooling system
JP2019070457A (ja) 磁性流体熱機関
JP2018067638A (ja) 電子制御装置
US20070051500A1 (en) Magneto-hydrodynamic heat sink

Legal Events

Date Code Title Description
MM4A The patent is invalid due to non-payment of fees

Effective date: 20190412