JP2008511147A - 操作ハウジング - Google Patents
操作ハウジング Download PDFInfo
- Publication number
- JP2008511147A JP2008511147A JP2007528891A JP2007528891A JP2008511147A JP 2008511147 A JP2008511147 A JP 2008511147A JP 2007528891 A JP2007528891 A JP 2007528891A JP 2007528891 A JP2007528891 A JP 2007528891A JP 2008511147 A JP2008511147 A JP 2008511147A
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- operating
- housing
- cooling plate
- operating housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20609—Air circulating in closed loop within cabinets wherein heat is removed through air-to-liquid heat-exchanger
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Aviation & Aerospace Engineering (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Valve Device For Special Equipments (AREA)
- Temperature-Responsive Valves (AREA)
- Electrically Driven Valve-Operating Means (AREA)
Abstract
Description
2 背面壁
2.1 開口
2.2 壁区分
10 冷却プレート
10.1 流入接続部
10.1′ 流出接続部
10.2 導線
10.3 固定孔
10.4 縁部領域
11 冷却体
12 ファン
13 空気案内板
20 コンピュータ
21 表示フィールド
22 コンピュータケーシング
Claims (9)
- 4つの側面壁と、1つの正面壁と、1つの背面壁(2)と、組込まれた電子的なコンポーネントの損失熱を導出するための冷却装置とを有する操作ハウジングにおいて、冷却装置が冷却液により貫流される冷却プレート(10)を有し、該冷却プレート(10)が前記背面壁(2)の大部分を形成していることを特徴とする、操作ハウジング。
- 前記冷却プレート(10)が循環する縁部領域(10.4)で、操作ハウジング(1)の開口(2.1)を取囲む壁区分(2.2)に、内側から又は外側から取付けられている、請求項1記載の操作ハウジング。
- 前記冷却プレート(10)に、冷却液を導くために少なくとも1つの冷却通路が設けられ、該冷却通路が前記背面壁(2)の外側に配置された流入接続部(10.1)と流出接続部(10.1′)とを備えている、請求項1又は2記載の操作ハウジング。
- 操作ハウジング(1)の内部に向いた前記冷却プレート(10)の内面に、冷却リブ又は空気流動通路を備えた少なくとも1つの冷却体(11)が一体に構成されているか又は別体の部分として取付けられ、該冷却体(11)を損失熱を帯びた空気が操作ケーシング(1)内で貫流する、請求項1から3までのいずれか1項記載の操作ハウジング。
- 損失熱を帯びた空気を冷却プレート(10)又は冷却体(11)に向かって搬送するために操作ハウジング(1)の内部に少なくとも1つのファン(12)が配置されている、請求項1から4までのいずれか1項記載の操作ハウジング。
- 操作ハウジング(1)内に、正面壁に組込まれた表示フィールド(21)を有するコンピュータ(20)が受容されており、該コンピュータ(20)がコンピュータケーシング(22)内に組込まれたファンを有し、該ファンが空気を前記冷却板(10)へ又は冷却体(11)へ向かって案内するために操作ハウジングの内部と流動結合されている、請求項5記載の操作ハウジング。
- 操作ハウジング(1)内に単数又は複数の空気案内板(13)が配置されており、該空気案内板(13)で損失熱を帯びた空気が冷却プレート(10)の内面に沿って又は冷却体(11)の上を案内される、請求項1から6までのいずれか1項、特に請求項5又は6記載の操作ハウジング。
- 少なくとも1つの前記冷却通路が挿入された導管(10.2)を備えている、請求項3から7までのいずれか1項記載の操作ハウジング。
- 前記導管(10.2)が平らな側からフライス加工された、メアンダ形に延在する受容通路内へプレス嵌めされておりかつ当該の平らな側が該受容通路に続いて平面加工されている、請求項8記載の操作ハウジング。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005016115A DE102005016115B4 (de) | 2005-04-08 | 2005-04-08 | Anordnung zum Kühlen eines elektronischen Gerätes |
PCT/EP2006/001932 WO2006105835A2 (de) | 2005-04-08 | 2006-03-03 | Bediengehäuse |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008511147A true JP2008511147A (ja) | 2008-04-10 |
JP4605813B2 JP4605813B2 (ja) | 2011-01-05 |
Family
ID=36954866
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007528891A Active JP4605813B2 (ja) | 2005-04-08 | 2006-03-03 | 操作ハウジング |
Country Status (7)
Country | Link |
---|---|
US (1) | US20080117595A1 (ja) |
EP (1) | EP1869539B1 (ja) |
JP (1) | JP4605813B2 (ja) |
CN (2) | CN100543644C (ja) |
AT (1) | ATE487176T1 (ja) |
DE (2) | DE102005016115B4 (ja) |
WO (1) | WO2006105835A2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015133431A (ja) * | 2014-01-15 | 2015-07-23 | 日星電気株式会社 | 冷却構造、及びこれを使用したファイバレーザ装置 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202005018284U1 (de) * | 2005-04-08 | 2006-02-02 | Rittal Gmbh & Co. Kg | Kühleinheit |
US7295440B2 (en) * | 2006-03-07 | 2007-11-13 | Honeywell International, Inc. | Integral cold plate/chasses housing applicable to force-cooled power electronics |
DE102007023058A1 (de) * | 2007-05-16 | 2008-10-30 | Siemens Ag | Kühlplattensystem |
DE102009006924B3 (de) * | 2009-02-02 | 2010-08-05 | Knürr AG | Betriebsverfahren und Anordnung zum Kühlen von elektrischen und elektronischen Bauelementen und Moduleinheiten in Geräteschränken |
US11026347B2 (en) * | 2012-12-21 | 2021-06-01 | Smart Embedded Computing, Inc. | Configurable cooling for rugged environments |
DE102014225971A1 (de) * | 2014-12-16 | 2016-06-16 | Robert Bosch Gmbh | Kühlplatte für Batteriezelle als Montageplatte |
CN111402728B (zh) * | 2020-03-24 | 2022-05-31 | 京东方科技集团股份有限公司 | 弯折垫片组件、柔性oled模组以及oled设备 |
Citations (2)
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JPH0343739U (ja) * | 1989-09-08 | 1991-04-24 | ||
JPH11510962A (ja) * | 1995-10-24 | 1999-09-21 | アービッド・サーマル・プロダクツ、インコーポレイテッド | 電子部品冷却用液冷ヒートシンク |
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-
2005
- 2005-04-08 DE DE102005016115A patent/DE102005016115B4/de active Active
-
2006
- 2006-03-03 EP EP06707396A patent/EP1869539B1/de active Active
- 2006-03-03 CN CNB2006800099059A patent/CN100543644C/zh not_active Expired - Fee Related
- 2006-03-03 CN CN200680002168XA patent/CN101103324B/zh active Active
- 2006-03-03 US US11/793,620 patent/US20080117595A1/en not_active Abandoned
- 2006-03-03 AT AT06707396T patent/ATE487176T1/de active
- 2006-03-03 WO PCT/EP2006/001932 patent/WO2006105835A2/de not_active Application Discontinuation
- 2006-03-03 JP JP2007528891A patent/JP4605813B2/ja active Active
- 2006-03-03 DE DE502006008229T patent/DE502006008229D1/de active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0343739U (ja) * | 1989-09-08 | 1991-04-24 | ||
JPH11510962A (ja) * | 1995-10-24 | 1999-09-21 | アービッド・サーマル・プロダクツ、インコーポレイテッド | 電子部品冷却用液冷ヒートシンク |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015133431A (ja) * | 2014-01-15 | 2015-07-23 | 日星電気株式会社 | 冷却構造、及びこれを使用したファイバレーザ装置 |
Also Published As
Publication number | Publication date |
---|---|
EP1869539A2 (de) | 2007-12-26 |
EP1869539B1 (de) | 2010-11-03 |
ATE487176T1 (de) | 2010-11-15 |
WO2006105835A2 (de) | 2006-10-12 |
DE102005016115B4 (de) | 2007-12-20 |
JP4605813B2 (ja) | 2011-01-05 |
CN101103324A (zh) | 2008-01-09 |
CN100543644C (zh) | 2009-09-23 |
CN101151585A (zh) | 2008-03-26 |
US20080117595A1 (en) | 2008-05-22 |
CN101103324B (zh) | 2011-06-15 |
DE102005016115A1 (de) | 2006-10-12 |
DE502006008229D1 (de) | 2010-12-16 |
WO2006105835A3 (de) | 2007-02-15 |
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