JP2015518660A5 - - Google Patents
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- Publication number
- JP2015518660A5 JP2015518660A5 JP2015506334A JP2015506334A JP2015518660A5 JP 2015518660 A5 JP2015518660 A5 JP 2015518660A5 JP 2015506334 A JP2015506334 A JP 2015506334A JP 2015506334 A JP2015506334 A JP 2015506334A JP 2015518660 A5 JP2015518660 A5 JP 2015518660A5
- Authority
- JP
- Japan
- Prior art keywords
- fluid
- substrate
- cooling
- conductive layer
- integrated electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012530 fluid Substances 0.000 claims description 51
- 238000001816 cooling Methods 0.000 claims description 29
- 239000000758 substrate Substances 0.000 claims description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 239000000696 magnetic material Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 34
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- 239000012809 cooling fluid Substances 0.000 description 6
- 238000003384 imaging method Methods 0.000 description 5
- 239000002826 coolant Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 229920002449 FKM Polymers 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 210000002307 prostate Anatomy 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000002560 therapeutic procedure Methods 0.000 description 1
- 238000009210 therapy by ultrasound Methods 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261636933P | 2012-04-23 | 2012-04-23 | |
| US61/636,933 | 2012-04-23 | ||
| PCT/IB2013/052876 WO2013160788A1 (en) | 2012-04-23 | 2013-04-11 | Integrated electronics module with cooling structure |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015518660A JP2015518660A (ja) | 2015-07-02 |
| JP2015518660A5 true JP2015518660A5 (enExample) | 2017-07-06 |
| JP6267686B2 JP6267686B2 (ja) | 2018-01-24 |
Family
ID=48483116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015506334A Expired - Fee Related JP6267686B2 (ja) | 2012-04-23 | 2013-04-11 | 冷却構造を備える一体型電子モジュール |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20150123663A1 (enExample) |
| EP (1) | EP2842162A1 (enExample) |
| JP (1) | JP6267686B2 (enExample) |
| CN (1) | CN104428891B (enExample) |
| BR (1) | BR112014026062A2 (enExample) |
| RU (1) | RU2640574C2 (enExample) |
| WO (1) | WO2013160788A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9674984B2 (en) | 2015-06-23 | 2017-06-06 | Cubic Corporation | Plastic chassis for liquid cooled electronic components |
| US10237967B2 (en) * | 2015-10-02 | 2019-03-19 | Analogic Corporation | Cooling assembly for electronics assembly of imaging system |
| US11010326B2 (en) | 2018-09-20 | 2021-05-18 | Western Digital Technologies, Inc. | Universal serial bus voltage reducing adaptor |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU1325963A1 (ru) * | 1985-05-23 | 1991-08-07 | Истринское Отделение Всесоюзного Электротехнического Института Им.В.И.Ленина | Радиоэлектронный блок |
| DE3666644D1 (en) * | 1985-11-19 | 1989-11-30 | Nec Corp | Liquid cooling system for integrated circuit chips |
| EP0236065B1 (en) * | 1986-02-25 | 1990-11-28 | Nec Corporation | Liquid cooling system for integrated circuit chips |
| JPS6351454U (enExample) * | 1986-09-22 | 1988-04-07 | ||
| CA1327710C (en) * | 1987-12-07 | 1994-03-15 | Kazuhiko Umezawa | Cooling system for ic package |
| JPH06209060A (ja) * | 1992-10-15 | 1994-07-26 | Sun Microsyst Inc | 半導体チップを冷却する装置及び方法 |
| JPH08103426A (ja) * | 1994-10-06 | 1996-04-23 | Toshiba Corp | 磁気共鳴イメージング装置の遮蔽シート |
| JPH10189845A (ja) * | 1996-12-25 | 1998-07-21 | Denso Corp | 半導体素子の放熱装置 |
| US6400012B1 (en) * | 1997-09-17 | 2002-06-04 | Advanced Energy Voorhees, Inc. | Heat sink for use in cooling an integrated circuit |
| US6386278B1 (en) * | 1998-08-04 | 2002-05-14 | Jurgen Schulz-Harder | Cooler |
| US6011245A (en) * | 1999-03-19 | 2000-01-04 | Bell; James H. | Permanent magnet eddy current heat generator |
| JP2002200055A (ja) * | 2000-12-28 | 2002-07-16 | Toshiba Medical System Co Ltd | 磁気共鳴イメージング装置 |
| JP2002094192A (ja) * | 2000-09-12 | 2002-03-29 | Denki Kagaku Kogyo Kk | 回路基板の冷却構造 |
| DE20115922U1 (de) * | 2001-01-11 | 2002-01-17 | Siemens AG, 80333 München | Kunststoff-Schaltplatte eines hydraulischen Kraftfahrzeug-Getriebesteuergerätes |
| JP4969738B2 (ja) * | 2001-06-28 | 2012-07-04 | 株式会社東芝 | セラミックス回路基板およびそれを用いた半導体モジュール |
| US20060293727A1 (en) * | 2002-05-09 | 2006-12-28 | Greg Spooner | System and method for treating exposed tissue with light emitting diodes |
| JP2005288044A (ja) * | 2004-04-06 | 2005-10-20 | Hitachi Medical Corp | 磁気共鳴イメージング装置 |
| GB2419417B (en) * | 2004-10-20 | 2007-05-16 | Gen Electric | Gradient bore cooling and RF shield |
| US7397665B2 (en) | 2004-12-08 | 2008-07-08 | Optherm - Thermal Solutions Ltd. | Integral heat-dissipation system for electronic boards |
| US20060157225A1 (en) * | 2005-01-18 | 2006-07-20 | Yves Martin | High turbulence heat exchanger |
| RU53072U1 (ru) * | 2005-04-06 | 2006-04-27 | Федеральное государственное унитарное предприятие "Научно-исследовательский институт Научно-производственное объединение "ЛУЧ" (ФГУП "НИИ НПО "ЛУЧ") | Устройство для охлаждения и термостатирования полупроводниковых приборов |
| JP4759384B2 (ja) * | 2005-12-20 | 2011-08-31 | 昭和電工株式会社 | 半導体モジュール |
| EP2059303A1 (en) | 2006-08-30 | 2009-05-20 | Koninklijke Philips Electronics N.V. | Apparatus for thermal treatment of tissue |
| ES2363025T3 (es) * | 2006-10-27 | 2011-07-19 | Agie Charmilles Sa | Unidad de placa de circuito y procedimiento para la producción de la misma. |
| JP5222735B2 (ja) * | 2007-02-06 | 2013-06-26 | 株式会社日立メディコ | 磁気共鳴イメージング装置および傾斜磁場コイル |
| JP2010114121A (ja) * | 2008-11-04 | 2010-05-20 | Daikin Ind Ltd | 電装部品の放熱器 |
| US20100175857A1 (en) * | 2009-01-15 | 2010-07-15 | General Electric Company | Millichannel heat sink, and stack and apparatus using the same |
| DE102009005915B4 (de) * | 2009-01-23 | 2013-07-11 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul in Druckkontaktausführung |
| WO2011036607A1 (en) | 2009-09-24 | 2011-03-31 | Koninklijke Philips Electronics N.V. | High intensity focused ultrasound positioning mechanism |
| DE102009046321B4 (de) * | 2009-11-03 | 2013-10-17 | Bruker Biospin Ag | Kühlvorrichtung zur kryogenen Kühlung eines NMR-Detektionssystems mit Hilfe eines mit kryogenen Fluid gefüllten Behälters |
| CN201667332U (zh) * | 2010-03-29 | 2010-12-08 | 比亚迪股份有限公司 | 一种半导体功率模块 |
| DE102010032078B4 (de) * | 2010-07-23 | 2012-02-16 | Siemens Aktiengesellschaft | Leistungselektronik-Baueinheit für eine Magnetresonanzeinrichtung und Magnetresonanzeinrichtung |
-
2013
- 2013-04-11 RU RU2014146775A patent/RU2640574C2/ru not_active IP Right Cessation
- 2013-04-11 JP JP2015506334A patent/JP6267686B2/ja not_active Expired - Fee Related
- 2013-04-11 EP EP13724627.8A patent/EP2842162A1/en not_active Withdrawn
- 2013-04-11 WO PCT/IB2013/052876 patent/WO2013160788A1/en not_active Ceased
- 2013-04-11 CN CN201380021633.4A patent/CN104428891B/zh not_active Expired - Fee Related
- 2013-04-11 US US14/396,098 patent/US20150123663A1/en not_active Abandoned
- 2013-04-11 BR BR112014026062A patent/BR112014026062A2/pt not_active Application Discontinuation
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