JP2015518660A5 - - Google Patents

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Publication number
JP2015518660A5
JP2015518660A5 JP2015506334A JP2015506334A JP2015518660A5 JP 2015518660 A5 JP2015518660 A5 JP 2015518660A5 JP 2015506334 A JP2015506334 A JP 2015506334A JP 2015506334 A JP2015506334 A JP 2015506334A JP 2015518660 A5 JP2015518660 A5 JP 2015518660A5
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JP
Japan
Prior art keywords
fluid
substrate
cooling
conductive layer
integrated electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015506334A
Other languages
English (en)
Japanese (ja)
Other versions
JP6267686B2 (ja
JP2015518660A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/IB2013/052876 external-priority patent/WO2013160788A1/en
Publication of JP2015518660A publication Critical patent/JP2015518660A/ja
Publication of JP2015518660A5 publication Critical patent/JP2015518660A5/ja
Application granted granted Critical
Publication of JP6267686B2 publication Critical patent/JP6267686B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015506334A 2012-04-23 2013-04-11 冷却構造を備える一体型電子モジュール Expired - Fee Related JP6267686B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261636933P 2012-04-23 2012-04-23
US61/636,933 2012-04-23
PCT/IB2013/052876 WO2013160788A1 (en) 2012-04-23 2013-04-11 Integrated electronics module with cooling structure

Publications (3)

Publication Number Publication Date
JP2015518660A JP2015518660A (ja) 2015-07-02
JP2015518660A5 true JP2015518660A5 (enExample) 2017-07-06
JP6267686B2 JP6267686B2 (ja) 2018-01-24

Family

ID=48483116

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015506334A Expired - Fee Related JP6267686B2 (ja) 2012-04-23 2013-04-11 冷却構造を備える一体型電子モジュール

Country Status (7)

Country Link
US (1) US20150123663A1 (enExample)
EP (1) EP2842162A1 (enExample)
JP (1) JP6267686B2 (enExample)
CN (1) CN104428891B (enExample)
BR (1) BR112014026062A2 (enExample)
RU (1) RU2640574C2 (enExample)
WO (1) WO2013160788A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9674984B2 (en) 2015-06-23 2017-06-06 Cubic Corporation Plastic chassis for liquid cooled electronic components
US10237967B2 (en) * 2015-10-02 2019-03-19 Analogic Corporation Cooling assembly for electronics assembly of imaging system
US11010326B2 (en) 2018-09-20 2021-05-18 Western Digital Technologies, Inc. Universal serial bus voltage reducing adaptor

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU1325963A1 (ru) * 1985-05-23 1991-08-07 Истринское Отделение Всесоюзного Электротехнического Института Им.В.И.Ленина Радиоэлектронный блок
DE3666644D1 (en) * 1985-11-19 1989-11-30 Nec Corp Liquid cooling system for integrated circuit chips
EP0236065B1 (en) * 1986-02-25 1990-11-28 Nec Corporation Liquid cooling system for integrated circuit chips
JPS6351454U (enExample) * 1986-09-22 1988-04-07
CA1327710C (en) * 1987-12-07 1994-03-15 Kazuhiko Umezawa Cooling system for ic package
JPH06209060A (ja) * 1992-10-15 1994-07-26 Sun Microsyst Inc 半導体チップを冷却する装置及び方法
JPH08103426A (ja) * 1994-10-06 1996-04-23 Toshiba Corp 磁気共鳴イメージング装置の遮蔽シート
JPH10189845A (ja) * 1996-12-25 1998-07-21 Denso Corp 半導体素子の放熱装置
US6400012B1 (en) * 1997-09-17 2002-06-04 Advanced Energy Voorhees, Inc. Heat sink for use in cooling an integrated circuit
US6386278B1 (en) * 1998-08-04 2002-05-14 Jurgen Schulz-Harder Cooler
US6011245A (en) * 1999-03-19 2000-01-04 Bell; James H. Permanent magnet eddy current heat generator
JP2002200055A (ja) * 2000-12-28 2002-07-16 Toshiba Medical System Co Ltd 磁気共鳴イメージング装置
JP2002094192A (ja) * 2000-09-12 2002-03-29 Denki Kagaku Kogyo Kk 回路基板の冷却構造
DE20115922U1 (de) * 2001-01-11 2002-01-17 Siemens AG, 80333 München Kunststoff-Schaltplatte eines hydraulischen Kraftfahrzeug-Getriebesteuergerätes
JP4969738B2 (ja) * 2001-06-28 2012-07-04 株式会社東芝 セラミックス回路基板およびそれを用いた半導体モジュール
US20060293727A1 (en) * 2002-05-09 2006-12-28 Greg Spooner System and method for treating exposed tissue with light emitting diodes
JP2005288044A (ja) * 2004-04-06 2005-10-20 Hitachi Medical Corp 磁気共鳴イメージング装置
GB2419417B (en) * 2004-10-20 2007-05-16 Gen Electric Gradient bore cooling and RF shield
US7397665B2 (en) 2004-12-08 2008-07-08 Optherm - Thermal Solutions Ltd. Integral heat-dissipation system for electronic boards
US20060157225A1 (en) * 2005-01-18 2006-07-20 Yves Martin High turbulence heat exchanger
RU53072U1 (ru) * 2005-04-06 2006-04-27 Федеральное государственное унитарное предприятие "Научно-исследовательский институт Научно-производственное объединение "ЛУЧ" (ФГУП "НИИ НПО "ЛУЧ") Устройство для охлаждения и термостатирования полупроводниковых приборов
JP4759384B2 (ja) * 2005-12-20 2011-08-31 昭和電工株式会社 半導体モジュール
EP2059303A1 (en) 2006-08-30 2009-05-20 Koninklijke Philips Electronics N.V. Apparatus for thermal treatment of tissue
ES2363025T3 (es) * 2006-10-27 2011-07-19 Agie Charmilles Sa Unidad de placa de circuito y procedimiento para la producción de la misma.
JP5222735B2 (ja) * 2007-02-06 2013-06-26 株式会社日立メディコ 磁気共鳴イメージング装置および傾斜磁場コイル
JP2010114121A (ja) * 2008-11-04 2010-05-20 Daikin Ind Ltd 電装部品の放熱器
US20100175857A1 (en) * 2009-01-15 2010-07-15 General Electric Company Millichannel heat sink, and stack and apparatus using the same
DE102009005915B4 (de) * 2009-01-23 2013-07-11 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul in Druckkontaktausführung
WO2011036607A1 (en) 2009-09-24 2011-03-31 Koninklijke Philips Electronics N.V. High intensity focused ultrasound positioning mechanism
DE102009046321B4 (de) * 2009-11-03 2013-10-17 Bruker Biospin Ag Kühlvorrichtung zur kryogenen Kühlung eines NMR-Detektionssystems mit Hilfe eines mit kryogenen Fluid gefüllten Behälters
CN201667332U (zh) * 2010-03-29 2010-12-08 比亚迪股份有限公司 一种半导体功率模块
DE102010032078B4 (de) * 2010-07-23 2012-02-16 Siemens Aktiengesellschaft Leistungselektronik-Baueinheit für eine Magnetresonanzeinrichtung und Magnetresonanzeinrichtung

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