RU2138930C1 - Способ изготовления проводящей схемы на подложке, проводящая схема на подложке и устройство для изготовления гибкой проводящей схемы - Google Patents

Способ изготовления проводящей схемы на подложке, проводящая схема на подложке и устройство для изготовления гибкой проводящей схемы Download PDF

Info

Publication number
RU2138930C1
RU2138930C1 RU94040379A RU94040379A RU2138930C1 RU 2138930 C1 RU2138930 C1 RU 2138930C1 RU 94040379 A RU94040379 A RU 94040379A RU 94040379 A RU94040379 A RU 94040379A RU 2138930 C1 RU2138930 C1 RU 2138930C1
Authority
RU
Russia
Prior art keywords
sheet
electrically conductive
conductive
layer
circuit
Prior art date
Application number
RU94040379A
Other languages
English (en)
Russian (ru)
Other versions
RU94040379A (ru
Inventor
А.Робертс Джозеф
Original Assignee
Рисерч Организейшн Фор Серкьют Ноледж Лимитед Партнершип
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Рисерч Организейшн Фор Серкьют Ноледж Лимитед Партнершип filed Critical Рисерч Организейшн Фор Серкьют Ноледж Лимитед Партнершип
Publication of RU94040379A publication Critical patent/RU94040379A/ru
Application granted granted Critical
Publication of RU2138930C1 publication Critical patent/RU2138930C1/ru

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1447—External wirings; Wiring ducts; Laying cables
    • H05K7/1451—External wirings; Wiring ducts; Laying cables with connections between circuit boards or units
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R31/00—Coupling parts supported only by co-operation with counterpart
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/045—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by making a conductive layer having a relief pattern, followed by abrading of the raised portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49083—Heater type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49217—Contact or terminal manufacturing by assembling plural parts by elastic joining
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49906—Metal deforming with nonmetallic bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Multi-Conductor Connections (AREA)
RU94040379A 1992-02-14 1993-02-10 Способ изготовления проводящей схемы на подложке, проводящая схема на подложке и устройство для изготовления гибкой проводящей схемы RU2138930C1 (ru)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US07837357 US5343616B1 (en) 1992-02-14 1992-02-14 Method of making high density self-aligning conductive networks and contact clusters
US837357 1992-02-14
PCT/US1993/001454 WO1993016574A1 (en) 1992-02-14 1993-02-10 High density conductive networks and method and apparatus for making same

Publications (2)

Publication Number Publication Date
RU94040379A RU94040379A (ru) 1996-08-10
RU2138930C1 true RU2138930C1 (ru) 1999-09-27

Family

ID=25274222

Family Applications (1)

Application Number Title Priority Date Filing Date
RU94040379A RU2138930C1 (ru) 1992-02-14 1993-02-10 Способ изготовления проводящей схемы на подложке, проводящая схема на подложке и устройство для изготовления гибкой проводящей схемы

Country Status (7)

Country Link
US (3) US5343616B1 (https=)
EP (1) EP0626124A4 (https=)
JP (1) JPH07506218A (https=)
KR (2) KR950700676A (https=)
CA (1) CA2128210A1 (https=)
RU (1) RU2138930C1 (https=)
WO (2) WO1993016575A1 (https=)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2248887C2 (ru) * 1999-09-07 2005-03-27 Бреже Амбаллаж С.А. Установка для печати при помощи переноса, в частности путем золотого тиснения
RU2291598C2 (ru) * 2005-02-08 2007-01-10 Федеральное государственное унитарное предприятие "Научно-производственное предприятие "Полет" Способ изготовления гибких многослойных печатных плат
RU2412479C2 (ru) * 2004-03-24 2011-02-20 Сименс Акциенгезелльшафт Устройство с интегральной схемой
RU2458491C1 (ru) * 2008-08-11 2012-08-10 Шарп Кабусики Кайся Гибкая подложка и структура электрической схемы
RU2496286C1 (ru) * 2012-03-20 2013-10-20 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский государственный технический университет имени Н.Э. Баумана (МГТУ им. Н.Э. Баумана) Способ изготовления гибких рельефных печатных плат для электронной и электротехнической аппаратуры
RU2519942C2 (ru) * 2009-02-13 2014-06-20 Сейдзи КАГАВА Композитная пленка из линейно-процарапанной, тонкой металлической пленки и пластиковой пленки, а также установка для ее производства
EA037451B1 (ru) * 2018-06-19 2021-03-30 Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт автоматики им. Н.Л. Духова" Способ изготовления печатных плат

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5528001A (en) * 1992-02-14 1996-06-18 Research Organization For Circuit Knowledge Circuit of electrically conductive paths on a dielectric with a grid of isolated conductive features that are electrically insulated from the paths
US5721007A (en) * 1994-09-08 1998-02-24 The Whitaker Corporation Process for low density additive flexible circuits and harnesses
US5928767A (en) * 1995-06-07 1999-07-27 Dexter Corporation Conductive film composite
US5718789A (en) * 1995-06-07 1998-02-17 The Dexter Corporation Method for making a debossed conductive film composite
US6143989A (en) * 1995-07-20 2000-11-07 The Regents Of The University Of California Active alignment/contact verification system
US5796158A (en) * 1995-07-31 1998-08-18 Micron Technology, Inc. Lead frame coining for semiconductor devices
US5873739A (en) * 1996-05-14 1999-02-23 Miraco, Inc. Direct circuit to circuit stored energy connector
US6085414A (en) * 1996-08-15 2000-07-11 Packard Hughes Interconnect Company Method of making a flexible circuit with raised features protruding from two surfaces and products therefrom
US6182359B1 (en) * 1997-01-31 2001-02-06 Lear Automotive Dearborn, Inc. Manufacturing process for printed circuits
US5995610A (en) * 1997-05-06 1999-11-30 Telefonaktiebolaget Lm Ericsson Cooperative call processing across public and private intelligent networks
JP3282793B2 (ja) * 1997-12-02 2002-05-20 株式会社エンプラス Ｉｃソケット
US6299456B1 (en) * 1998-04-10 2001-10-09 Micron Technology, Inc. Interposer with contact structures for electrical testing
US6140217A (en) 1998-07-16 2000-10-31 International Business Machines Corporation Technique for extending the limits of photolithography
US6359233B1 (en) * 1999-10-26 2002-03-19 Intel Corporation Printed circuit board multipack structure having internal gold fingers and multipack and printed circuit board formed therefrom, and methods of manufacture thereof
DE10000090A1 (de) * 2000-01-04 2001-08-30 Elfo Ag Sachseln Sachseln Verfahren zum Herstellen einer mehrlagigen Planarspule
JP2001326046A (ja) * 2000-05-17 2001-11-22 Enplas Corp コンタクトピン集合体、コンタクトピン組立体及び電気部品用ソケット
US6632343B1 (en) 2000-08-30 2003-10-14 Micron Technology, Inc. Method and apparatus for electrolytic plating of surface metals
US6641408B1 (en) 2000-10-18 2003-11-04 Storage Technology Corporation Compliant contacts for conductive devices
US6431876B1 (en) 2000-10-18 2002-08-13 Storage Technology Corporation Conductive trace interconnection
US6508674B1 (en) 2000-10-18 2003-01-21 Storage Technology Corporation Multi-layer conductive device interconnection
US6699395B1 (en) 2000-10-18 2004-03-02 Storage Technology Corporation Method of forming alignment features for conductive devices
US6884313B2 (en) * 2001-01-08 2005-04-26 Fujitsu Limited Method and system for joining and an ultra-high density interconnect
US6532654B2 (en) 2001-01-12 2003-03-18 International Business Machines Corporation Method of forming an electrical connector
JP3924126B2 (ja) * 2001-01-16 2007-06-06 アルプス電気株式会社 プリント配線基板、及びその製造方法
CA2443782A1 (en) * 2001-05-07 2002-11-14 Dusan Milojevic Process for manufacturing electrically conductive components
US6848944B2 (en) * 2001-11-12 2005-02-01 Fci Americas Technology, Inc. Connector for high-speed communications
KR100841611B1 (ko) * 2001-11-27 2008-06-27 엘지디스플레이 주식회사 플라스틱 액정표시소자 제조장치
US6692816B2 (en) * 2001-11-28 2004-02-17 3M Innovative Properties Company Abrasion resistant electrode and device
US6826830B2 (en) * 2002-02-05 2004-12-07 International Business Machines Corporation Multi-layered interconnect structure using liquid crystalline polymer dielectric
RU2222831C1 (ru) * 2002-05-18 2004-01-27 Общество с ограниченной ответственностью "ВА Инструментс" Сигнальное оптическое устройство
FR2850493B1 (fr) * 2003-01-29 2005-10-21 Alstom Procede de fabrication de bandes de contacts pour connecteurs d'appareillages electriques, et bande de contacts pour de tels connecteurs
US7307502B2 (en) * 2003-07-16 2007-12-11 Marvell World Trade Ltd. Power inductor with reduced DC current saturation
US7489219B2 (en) * 2003-07-16 2009-02-10 Marvell World Trade Ltd. Power inductor with reduced DC current saturation
US7023313B2 (en) * 2003-07-16 2006-04-04 Marvell World Trade Ltd. Power inductor with reduced DC current saturation
CN100380450C (zh) * 2003-08-21 2008-04-09 新科实业有限公司 用于构造硬盘驱动器的电路组件及其方法
US8324872B2 (en) * 2004-03-26 2012-12-04 Marvell World Trade, Ltd. Voltage regulator with coupled inductors having high coefficient of coupling
CN100442956C (zh) * 2005-03-25 2008-12-10 华通电脑股份有限公司 软硬复合电路板的制造方法
WO2007016689A1 (en) 2005-08-02 2007-02-08 New Way Machine Components, Inc. Method and apparatus for in-line processing and immediately sequential or simultaneous processing of flat and flexible substrates through viscous shear in thin cross section gaps for the manufacture of micro-electronic circuits or displays
GB2436174B (en) * 2006-03-15 2011-01-12 Avago Technologies Fiber Ip Connection arrangement and method for optical communications
RU2313926C1 (ru) * 2006-06-05 2007-12-27 Федеральное государственное унитарное предприятие "Научно-производственное предприятие "Полет" Способ изготовления печатных плат
KR100811768B1 (ko) * 2007-04-23 2008-03-07 삼성전기주식회사 인쇄회로기판의 제조방법
CN100574562C (zh) * 2007-07-06 2009-12-23 富葵精密组件(深圳)有限公司 镂空印刷电路板的制作方法
RU2363072C1 (ru) * 2008-02-18 2009-07-27 Институт физики полупроводников Сибирского отделения Российской академии наук Многоконтактное гибридное соединение
CN101801155A (zh) * 2009-02-09 2010-08-11 富士康(昆山)电脑接插件有限公司 柔性印刷电路板及安装有柔性印刷电路板的电连接器
EP2244291A1 (en) * 2009-04-20 2010-10-27 Nxp B.V. Multilevel interconnection system
TWM365052U (en) * 2009-05-15 2009-09-11 Inventec Corp Electromagnetic wave shielding device
US20110024160A1 (en) 2009-07-31 2011-02-03 Clifton Quan Multi-layer microwave corrugated printed circuit board and method
US9072164B2 (en) * 2009-11-17 2015-06-30 Raytheon Company Process for fabricating a three dimensional molded feed structure
RU2497320C1 (ru) * 2012-02-13 2013-10-27 Общество с ограниченной ответственностью "Тегас Электрик" Плата печатная составная
RU2529742C1 (ru) * 2013-02-22 2014-09-27 Общество с ограниченной ответственностью "Тегас Электрик" Способ изготовления составной печатной платы
JP6599853B2 (ja) 2013-06-21 2019-10-30 サンミナ コーポレーション 除去可能なカバー層を用いてめっき貫通孔を有する積層構造を形成する方法
CN107241862B (zh) * 2013-06-26 2019-05-03 湖北奕宏精密制造有限公司 电路板
RU2604721C1 (ru) * 2015-06-24 2016-12-10 Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" (Госкорпорация "Росатом") Способ изготовления рельефной печатной платы
DE102018133007A1 (de) * 2018-12-20 2020-06-25 Bayerische Motoren Werke Aktiengesellschaft Verfahren zum Herstellen eines Hochvoltspeichers
US10709022B1 (en) 2019-04-19 2020-07-07 Gentherm Incorporated Milling of flex foil with two conductive layers from both sides
TWI726427B (zh) * 2019-09-27 2021-05-01 友達光電股份有限公司 元件基板
WO2025003782A1 (en) * 2023-06-30 2025-01-02 Molex, Llc Resting pocket contact connector

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3147054A (en) * 1962-06-14 1964-09-01 Rca Corp Test point extender for circuit boards
US3434939A (en) * 1965-10-07 1969-03-25 Fabri Tek Inc Process for making printed circuits

Family Cites Families (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2427144A (en) * 1936-11-23 1947-09-09 Jansen Franciscus Jo Wilhelmus Mechanical connection for electrical circuits
US2638660A (en) * 1945-04-03 1953-05-19 Philips Lab Inc Electrical insulator
US2757443A (en) * 1953-01-21 1956-08-07 Erie Resistor Corp Method of making printed circuits
US2716268A (en) * 1952-10-16 1955-08-30 Erie Resistor Corp Method of making printed circuits
US2837619A (en) * 1954-08-30 1958-06-03 Stein Samuel Strain sensitive element and method of manufacture
US2912745A (en) * 1955-08-25 1959-11-17 Erie Resistor Corp Method of making a printed circuit
US2912746A (en) * 1955-10-10 1959-11-17 Erie Resistor Corp Method of making printed circuit panels
US2912748A (en) * 1956-05-28 1959-11-17 Erie Resistor Corp Method of making printed circuit panels
US3148098A (en) * 1960-11-03 1964-09-08 Day Company Method of producing electrical components
GB993885A (https=) * 1961-03-03 1965-06-02 Aktiebolaget Electrolux
US3301730A (en) * 1961-04-03 1967-01-31 Rogers Corp Method of making a printed circuit
NL291372A (https=) * 1961-10-23
US3158421A (en) * 1961-12-04 1964-11-24 Gen Dynamics Corp Electrical connector for a printed circuit board and cable
GB1126370A (en) * 1965-12-29 1968-09-05 British Aircraft Corp Ltd Improvements relating to printed circuits
US3423260A (en) * 1966-03-21 1969-01-21 Bunker Ramo Method of making a thin film circuit having a resistor-conductor pattern
US3434208A (en) * 1966-12-16 1969-03-25 William H Toomey Circuit assembly process
US3488890A (en) * 1967-03-09 1970-01-13 Western Electric Co Method of and apparatus for adjusting film resistors to a desired resistance value
DE1665944A1 (de) * 1967-05-13 1971-04-08 Siemens Ag Verfahren zum Herstellen elektrischer Schaltkreise
US3612745A (en) * 1970-07-08 1971-10-12 Sierracin Corp Flexural bus bar assembly
US3875542A (en) * 1971-02-10 1975-04-01 Tektronix Inc High frequency fuse
US3889363A (en) * 1971-02-16 1975-06-17 Richard P Davis Method of making printed circuit boards
CA963237A (en) * 1971-05-14 1975-02-25 Frank L. Dieterich Method and blank for making potentiometer contact springs
DE2136386A1 (de) * 1971-07-21 1973-02-01 Wagner Schaltungstechnik Elektrische schmelzsicherung und verfahren zu ihrer herstellung
DE2305883A1 (de) * 1973-02-07 1974-08-15 Finsterhoelzl Rafi Elekt Leiterplatte
US4089734A (en) * 1974-09-16 1978-05-16 Raytheon Company Integrated circuit fusing technique
US4075420A (en) * 1975-08-28 1978-02-21 Burroughs Corporation Cover layer for flexible circuits
US4357750A (en) * 1976-06-21 1982-11-09 Advanced Circuit Technology Inc. Jumper cable
US4080027A (en) * 1976-07-30 1978-03-21 Gte Sylvania Incorporated Electrical contact and connector
US4020548A (en) * 1976-08-25 1977-05-03 Western Electric Company, Inc. Forming and stripping of conductors
US4091125A (en) * 1976-11-08 1978-05-23 Delgadillo Joseph A Circuit board and method for producing same
US4306925A (en) * 1977-01-11 1981-12-22 Pactel Corporation Method of manufacturing high density printed circuit
CH642772A5 (de) * 1977-05-28 1984-04-30 Knudsen Ak L Elektrische schmelzsicherung und deren herstellungsverfahren.
US4272753A (en) * 1978-08-16 1981-06-09 Harris Corporation Integrated circuit fuse
US4406062A (en) * 1979-11-05 1983-09-27 Thomas & Betts Corporation Method of forming a multichannel connector
US4532152A (en) * 1982-03-05 1985-07-30 Elarde Vito D Fabrication of a printed circuit board with metal-filled channels
US4604799A (en) * 1982-09-03 1986-08-12 John Fluke Mfg. Co., Inc. Method of making molded circuit board
US4528259A (en) * 1983-11-10 1985-07-09 Sullivan Donald F Printed wiring boards with solder mask over bare copper wires having large area thickened circuit pad connections
US4775611A (en) * 1983-11-10 1988-10-04 Sullivan Donald F Additive printed circuit boards with flat surface and indented primary wiring conductors
US4501638A (en) * 1983-12-05 1985-02-26 E. I. Du Pont De Nemours And Company Liquid chemical process for forming conductive through-holes through a dielectric layer
US4655518A (en) * 1984-08-17 1987-04-07 Teradyne, Inc. Backplane connector
US4651417A (en) * 1984-10-23 1987-03-24 New West Technology Corporation Method for forming printed circuit board
US4721550A (en) * 1986-05-05 1988-01-26 New West Technology Corporation Process for producing printed circuit board having improved adhesion
US4806106A (en) * 1987-04-09 1989-02-21 Hewlett-Packard Company Interconnect lead frame for thermal ink jet printhead and methods of manufacture
US4840702A (en) * 1987-12-29 1989-06-20 Action Technologies, Inc. Apparatus and method for plasma treating of circuit boards
US4912844A (en) * 1988-08-10 1990-04-03 Dimensional Circuits Corporation Methods of producing printed circuit boards
US4996391A (en) * 1988-09-30 1991-02-26 Siemens Aktiengesellschaft Printed circuit board having an injection molded substrate
CH680483A5 (https=) * 1989-10-20 1992-08-31 Kobe Properties Ltd
JP2806580B2 (ja) * 1989-12-15 1998-09-30 日本電気株式会社 表面実装コネクタ
US5097101A (en) * 1991-02-05 1992-03-17 Tektronix, Inc. Method of forming a conductive contact bump on a flexible substrate and a flexible substrate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3147054A (en) * 1962-06-14 1964-09-01 Rca Corp Test point extender for circuit boards
US3434939A (en) * 1965-10-07 1969-03-25 Fabri Tek Inc Process for making printed circuits

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2248887C2 (ru) * 1999-09-07 2005-03-27 Бреже Амбаллаж С.А. Установка для печати при помощи переноса, в частности путем золотого тиснения
RU2412479C2 (ru) * 2004-03-24 2011-02-20 Сименс Акциенгезелльшафт Устройство с интегральной схемой
RU2291598C2 (ru) * 2005-02-08 2007-01-10 Федеральное государственное унитарное предприятие "Научно-производственное предприятие "Полет" Способ изготовления гибких многослойных печатных плат
RU2458491C1 (ru) * 2008-08-11 2012-08-10 Шарп Кабусики Кайся Гибкая подложка и структура электрической схемы
US8754332B2 (en) 2008-08-11 2014-06-17 Sharp Kabushiki Kaisha Display device
RU2519942C2 (ru) * 2009-02-13 2014-06-20 Сейдзи КАГАВА Композитная пленка из линейно-процарапанной, тонкой металлической пленки и пластиковой пленки, а также установка для ее производства
RU2496286C1 (ru) * 2012-03-20 2013-10-20 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский государственный технический университет имени Н.Э. Баумана (МГТУ им. Н.Э. Баумана) Способ изготовления гибких рельефных печатных плат для электронной и электротехнической аппаратуры
EA037451B1 (ru) * 2018-06-19 2021-03-30 Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт автоматики им. Н.Л. Духова" Способ изготовления печатных плат

Also Published As

Publication number Publication date
RU94040379A (ru) 1996-08-10
EP0626124A1 (en) 1994-11-30
WO1993016575A1 (en) 1993-08-19
US5526565A (en) 1996-06-18
KR950700676A (ko) 1995-01-16
KR100298010B1 (https=) 2001-11-22
CA2128210A1 (en) 1993-08-19
US5477612A (en) 1995-12-26
WO1993016574A1 (en) 1993-08-19
JPH07506218A (ja) 1995-07-06
EP0626124A4 (en) 1995-11-15
US5343616B1 (en) 1998-12-29
US5343616A (en) 1994-09-06

Similar Documents

Publication Publication Date Title
RU2138930C1 (ru) Способ изготовления проводящей схемы на подложке, проводящая схема на подложке и устройство для изготовления гибкой проводящей схемы
EP0806127B1 (en) An environmentally desirable printed circuit and associated apparatus
US5584120A (en) Method of manufacturing printed circuits
US5334279A (en) Method and apparatus for making printed circuit boards
US7229293B2 (en) Connecting structure of circuit board and method for manufacturing the same
US4985601A (en) Circuit boards with recessed traces
EP0545328B1 (en) Printed circuit board manufacturing process
EP0843955B1 (en) Method of forming raised metallic contacts on electrical circuits
US5738797A (en) Three-dimensional multi-layer circuit structure and method for forming the same
CA2109687A1 (en) Method for the through plating of conductor foils
US5055637A (en) Circuit boards with recessed traces
US6243946B1 (en) Method of forming an interlayer connection structure
US6477052B1 (en) Multiple layer thin flexible circuit board
EP0457593A2 (en) Lead frame and assembly process
EP0147566B1 (en) Method of forming contacts for flexible module carriers
US4992059A (en) Ultra fine line cable and a method for fabricating the same
US4889962A (en) Circuit board with coaxial circuit and method therefor
JP3049972B2 (ja) 多層配線板
EP1340414A2 (en) A method of forming an opening or cavity in a substrate for receiving an electronic component
WO2024182463A2 (en) Liquid crystal polymer dielectric powder or 3d printed material
JPH06120623A (ja) 配線板
JPH0634436B2 (ja) Ｉｃカ−ド用プリント配線板
JPS614295A (ja) プリント配線板の製造方法
JPH0846322A (ja) 印刷配線板の製造方法
JPS62257753A (ja) 半導体搭載用基板およびその製造方法