GB1126370A - Improvements relating to printed circuits - Google Patents
Improvements relating to printed circuitsInfo
- Publication number
- GB1126370A GB1126370A GB5507465A GB5507465A GB1126370A GB 1126370 A GB1126370 A GB 1126370A GB 5507465 A GB5507465 A GB 5507465A GB 5507465 A GB5507465 A GB 5507465A GB 1126370 A GB1126370 A GB 1126370A
- Authority
- GB
- United Kingdom
- Prior art keywords
- conductors
- projecting portion
- layer
- printed circuits
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0733—Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
1,126,370. Printed circuits. BRITISH AIRCRAFT CORP. (OPERATING) Ltd. 21 March. 1967 [29 Dec., 1965], No. 55074/65. Heading H1R. In a multilayer or double-sided printed circuit, connection is made between conductors 4a. 4b which are separated by an insulating layer 56, by forming a hole in layer 56 where such connection is required, and forming the lower conductor 4a with a projecting portion 7 substantially the thickness of the layer 56; the layers are then assembled, and a welding electrode 8 is applied to the free surface of upper conductor 4b above the projecting portion 7 to form a welded joint 9. Conductors 4a, 4b are originally formed by photo-etching or electron beam scribing, and projecting portion 7 is preferably formed by selective etching, although an additive technique may alternatively be used. The multilayer circuit is built up progressively, welded joints being made where required at each level (Fig. 4, not shown). Fig. 1 (not shown) discloses a method of pinchwelding registering conductors within a hole in an intermediate insulating layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB5507465A GB1126370A (en) | 1965-12-29 | 1965-12-29 | Improvements relating to printed circuits |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB5507465A GB1126370A (en) | 1965-12-29 | 1965-12-29 | Improvements relating to printed circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1126370A true GB1126370A (en) | 1968-09-05 |
Family
ID=10472873
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB5507465A Expired GB1126370A (en) | 1965-12-29 | 1965-12-29 | Improvements relating to printed circuits |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1126370A (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2204940A1 (en) * | 1972-10-27 | 1974-05-24 | Thomson Csf | |
EP0533198A2 (en) * | 1991-09-19 | 1993-03-24 | Nitto Denko Corporation | Flexible printed substrate |
EP0608726A1 (en) * | 1993-01-26 | 1994-08-03 | Dyconex Patente Ag | Process for plating through-connections between conducting foils |
EP0626124A1 (en) * | 1992-02-14 | 1994-11-30 | Rock Ltd Partnership | High density conductive networks and method and apparatus for making same |
US5584120A (en) * | 1992-02-14 | 1996-12-17 | Research Organization For Circuit Knowledge | Method of manufacturing printed circuits |
GB2307797A (en) * | 1995-11-30 | 1997-06-04 | Daewoo Electronics Co Ltd | Flexible coil structure |
EP1026929A2 (en) * | 1999-02-05 | 2000-08-09 | Sony Chemicals Corporation | Elemental piece of flexible printed wiring board and flexible printed wiring board |
EP1094693A2 (en) * | 1999-10-18 | 2001-04-25 | Sony Chemicals Corporation | Multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards |
EP1337136A3 (en) * | 2002-02-18 | 2005-07-27 | North Corporation | Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate |
EP1093329A3 (en) * | 1999-10-12 | 2006-01-18 | North Corporation | Wiring circuit substrate and manufacturing method therefor |
US9365947B2 (en) | 2013-10-04 | 2016-06-14 | Invensas Corporation | Method for preparing low cost substrates |
-
1965
- 1965-12-29 GB GB5507465A patent/GB1126370A/en not_active Expired
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2204940A1 (en) * | 1972-10-27 | 1974-05-24 | Thomson Csf | |
EP0533198A2 (en) * | 1991-09-19 | 1993-03-24 | Nitto Denko Corporation | Flexible printed substrate |
EP0533198A3 (en) * | 1991-09-19 | 1995-11-02 | Nitto Denko Corp | Flexible printed substrate |
EP0626124A1 (en) * | 1992-02-14 | 1994-11-30 | Rock Ltd Partnership | High density conductive networks and method and apparatus for making same |
EP0626124A4 (en) * | 1992-02-14 | 1995-11-15 | Rock Lp | High density conductive networks and method and apparatus for making same. |
US5584120A (en) * | 1992-02-14 | 1996-12-17 | Research Organization For Circuit Knowledge | Method of manufacturing printed circuits |
EP0608726A1 (en) * | 1993-01-26 | 1994-08-03 | Dyconex Patente Ag | Process for plating through-connections between conducting foils |
US5457881A (en) * | 1993-01-26 | 1995-10-17 | Dyconex Patente Ag | Method for the through plating of conductor foils |
GB2307797B (en) * | 1995-11-30 | 2000-08-16 | Daewoo Electronics Co Ltd | A process for manufacturing a flexible coil winding structure of a flyback transformer |
GB2307797A (en) * | 1995-11-30 | 1997-06-04 | Daewoo Electronics Co Ltd | Flexible coil structure |
US5877669A (en) * | 1995-11-30 | 1999-03-02 | Daewoo Electronics Co., Ltd. | Flyback transformer having a flexible coil winding structure and manufacturing process thereof |
EP1026929A2 (en) * | 1999-02-05 | 2000-08-09 | Sony Chemicals Corporation | Elemental piece of flexible printed wiring board and flexible printed wiring board |
EP1026929A3 (en) * | 1999-02-05 | 2002-06-12 | Sony Chemicals Corporation | Elemental piece of flexible printed wiring board and flexible printed wiring board |
US6717064B1 (en) | 1999-02-05 | 2004-04-06 | Sony Chemicals Corp. | Substrate piece and flexible substrate |
EP1093329A3 (en) * | 1999-10-12 | 2006-01-18 | North Corporation | Wiring circuit substrate and manufacturing method therefor |
US7096578B2 (en) | 1999-10-12 | 2006-08-29 | Tessera Interconnect Materials, Inc. | Manufacturing method for wiring circuit substrate |
US7546681B2 (en) | 1999-10-12 | 2009-06-16 | Tessera Interconnect Materials, Inc. | Manufacturing method for wiring circuit substrate |
US7721422B2 (en) | 1999-10-12 | 2010-05-25 | Tessera Interconnect Materials, Inc. | Methods of making microelectronic assemblies |
EP1094693A2 (en) * | 1999-10-18 | 2001-04-25 | Sony Chemicals Corporation | Multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards |
EP1094693A3 (en) * | 1999-10-18 | 2003-08-27 | Sony Chemicals Corporation | Multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards |
EP1337136A3 (en) * | 2002-02-18 | 2005-07-27 | North Corporation | Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate |
US9365947B2 (en) | 2013-10-04 | 2016-06-14 | Invensas Corporation | Method for preparing low cost substrates |
US10283484B2 (en) | 2013-10-04 | 2019-05-07 | Invensas Corporation | Low cost substrates |
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